Hu; Chih-Chia
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hu; Chih-Chia.The latest application filed is for "semiconductor device and method of manufacturing".
Company Profile
29.20.30
- Hu; Chih-Chia - Taipei TW
- Hu; Chih-Chia - Hsinchu TW
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor Device and Method of Manufacturing App 20220278063 - Hu; Chih-Chia ; et al. | 2022-09-01 |
| Through-Dielectric Vias for Direct Connection and Method Forming Same App 20220262766 - Chen; Ming-Fa ; et al. | 2022-08-18 |
| Multiple-mask multiple-exposure lithography and masks Grant 11,402,747 - Yu , et al. August 2, 2 | 2022-08-02 |
| Semiconductor device and method of manufacturing Grant 11,335,656 - Hu , et al. May 17, 2 | 2022-05-17 |
| Integrating Passive Devices in Package Structures App 20220139885 - Hu; Chih-Chia ; et al. | 2022-05-05 |
| Integrating passive devices in package structures Grant 11,239,205 - Hu , et al. February 1, 2 | 2022-02-01 |
| Method Of Manufacturing Integrated Circuit Having Through-substrate Via App 20220012402 - Hu; Chih-Chia ; et al. | 2022-01-13 |
| Semiconductor Package And Manufacturing Method Thereof App 20210384147 - Chen; Hsien-Wei ; et al. | 2021-12-09 |
| Methods Of Forming Semiconductor Packages With Shortened Talking Path App 20210358821 - Chen; Hsien-Wei ; et al. | 2021-11-18 |
| Manufacturing Method Of Semiconductor Structure App 20210327789 - Hu; Chih-Chia ; et al. | 2021-10-21 |
| Semiconductor package and manufacturing method thereof Grant 11,107,779 - Chen , et al. August 31, 2 | 2021-08-31 |
| Multiple-Mask Multiple-Exposure Lithography and Masks App 20210255540 - Yu; Peter ; et al. | 2021-08-19 |
| Semiconductor structure and manufacturing method thereof Grant 11,094,613 - Hu , et al. August 17, 2 | 2021-08-17 |
| Semiconductor packages with shortened talking path Grant 11,088,041 - Chen , et al. August 10, 2 | 2021-08-10 |
| Layout design of integrated circuit with through-substrate via Grant 11,080,455 - Hu , et al. August 3, 2 | 2021-08-03 |
| Semiconductor Device and Method of Manufacture App 20210175154 - Hu; Chih-Chia ; et al. | 2021-06-10 |
| Mixing organic materials into hybrid packages Grant 11,031,354 - Chen , et al. June 8, 2 | 2021-06-08 |
| Multiple-mask multiple-exposure lithography and masks Grant 10,996,558 - Yu , et al. May 4, 2 | 2021-05-04 |
| Bonding Structure of Dies with Dangling Bonds App 20210118832 - Chen; Hsien-Wei ; et al. | 2021-04-22 |
| Semiconductor Package And Manufacturing Method Thereof App 20210118827 - Chen; Hsien-Wei ; et al. | 2021-04-22 |
| Semiconductor Packages Wiyh Shortened Talking Path App 20210082779 - Chen; Hsien-Wei ; et al. | 2021-03-18 |
| Mixing organic materials into hybrid packages Grant 10,937,743 - Chen , et al. March 2, 2 | 2021-03-02 |
| Semiconductor Structure And Manufacturing Method Thereof App 20210057309 - Hu; Chih-Chia ; et al. | 2021-02-25 |
| Semiconductor device and method of manufacture Grant 10,930,580 - Hu , et al. February 23, 2 | 2021-02-23 |
| Semiconductor Device and Method of Manufacturing App 20210005561 - Hu; Chih-Chia ; et al. | 2021-01-07 |
| Bonding structure of dies with dangling bonds Grant 10,861,808 - Chen , et al. December 8, 2 | 2020-12-08 |
| Seal Ring for Hybrid-Bond App 20200373253 - Hu; Chih-Chia ; et al. | 2020-11-26 |
| Integrated Circuit Packages And Methods Of Forming The Same App 20200343218 - Hu; Chih-Chia ; et al. | 2020-10-29 |
| Semiconductor device and method of manufacturing Grant 10,784,219 - Hu , et al. Sept | 2020-09-22 |
| Seal ring for hybrid-bond Grant 10,741,506 - Hu , et al. A | 2020-08-11 |
| Bonding Structure of Dies with Dangling Bonds App 20200161263 - Chen; Hsien-Wei ; et al. | 2020-05-21 |
| Integrating Passive Devices in Package Structures App 20200152608 - Hu; Chih-Chia ; et al. | 2020-05-14 |
| Semiconductor Device and Method of Manufacture App 20200144160 - Hu; Chih-Chia ; et al. | 2020-05-07 |
| System and Method for Aligned Stitching App 20200118937 - Hu; Chih-Chia ; et al. | 2020-04-16 |
| Multiple-mask multiple-exposure lithography and masks Grant 10,620,530 - Yu , et al. | 2020-04-14 |
| Multiple-Mask Multiple-Exposure Lithography and Masks App 20200050102 - Yu; Peter ; et al. | 2020-02-13 |
| Integrating passive devices in package structures Grant 10,535,636 - Hu , et al. Ja | 2020-01-14 |
| Mixing Organic Materials into Hybrid Packages App 20200006254 - Chen; Ming-Fa ; et al. | 2020-01-02 |
| Semiconductor device and method of manufacture Grant 10,515,874 - Hu , et al. Dec | 2019-12-24 |
| System and method for aligned stitching Grant 10,510,676 - Hu , et al. Dec | 2019-12-17 |
| Mixing Organic Materials Into Hybrid Packages App 20190333871 - Chen; Ming-Fa ; et al. | 2019-10-31 |
| Seal Ring for Hybrid-Bond App 20190287932 - Hu; Chih-Chia ; et al. | 2019-09-19 |
| Seal ring for hybrid-bond Grant 10,312,201 - Hu , et al. | 2019-06-04 |
| Seal Ring for Hybrid-Bond App 20190164914 - Hu; Chih-Chia ; et al. | 2019-05-30 |
| System and Method for Aligned Stitching App 20190164899 - Hu; Chih-Chia ; et al. | 2019-05-30 |
| Semiconductor Device and Method of Manufacturing App 20190164919 - Hu; Chih-Chia ; et al. | 2019-05-30 |
| Semiconductor Device And Method Of Manufacture App 20190164867 - Hu; Chih-Chia ; et al. | 2019-05-30 |
| Integrating Passive Devices in Package Structures App 20190148342 - Hu; Chih-Chia ; et al. | 2019-05-16 |
| Multiple-Mask Multiple-Exposure Lithography and Masks App 20190033706 - Yu; Peter ; et al. | 2019-01-31 |
| Interconnect structure and method Grant 10,157,867 - Chen , et al. Dec | 2018-12-18 |
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