| Patent | Date |
|---|
Manufacturing Method For Surface Acoustic Wave Filter Package Structure
App 20220302896 - Hsu; Shih-Ping ; et al. | 2022-09-22 |
Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same
Grant 11,450,597 - Chou , et al. September 20, 2 | 2022-09-20 |
Intermediate Substrate And Fabrication Method Thereof
App 20220285257 - Hsu; Shih-Ping ; et al. | 2022-09-08 |
Package structure
Grant 11,417,581 - Hsu , et al. August 16, 2 | 2022-08-16 |
Inductor Structure And Fabrication Method Thereof, Electronic Package And Fabrication Method Thereof, And Method For Fabricating Packaging Carrier
App 20220254869 - Hsu; Shih-Ping | 2022-08-11 |
Semiconductor package carrier board, method for fabricating the same, and electronic package having the same
Grant 11,404,348 - Chou , et al. August 2, 2 | 2022-08-02 |
Semiconductor Package Structure
App 20220238425 - Hsu; Che-Wei ; et al. | 2022-07-28 |
Surface acoustic wave filter package structure and method of manufacturing the same
Grant 11,387,806 - Hsu , et al. July 12, 2 | 2022-07-12 |
Semiconductor Package Device
App 20220173048 - Yu; Chun-Hsien ; et al. | 2022-06-02 |
Semiconductor package substrate, electronic package and methods for fabricating the same
Grant 11,335,630 - Chou , et al. May 17, 2 | 2022-05-17 |
Package apparatus
Grant 11,246,223 - Hsu February 8, 2 | 2022-02-08 |
Package structure for semiconductor device and manufacturing method thereof
Grant 11,222,880 - Hsu , et al. January 11, 2 | 2022-01-11 |
Flip-chip package substrate and method for fabricating the same
Grant 11,183,447 - Chou , et al. November 23, 2 | 2021-11-23 |
Manufacturing Method For Semiconductor Package Structure
App 20210320096 - Hu; Chu-Chin ; et al. | 2021-10-14 |
Flip-chip package substrate and method for preparing the same
Grant 11,139,230 - Chou , et al. October 5, 2 | 2021-10-05 |
Package substrate and flip-chip package circuit including the same
Grant 11,081,435 - Hsu , et al. August 3, 2 | 2021-08-03 |
Method of fabricating packaging substrate
Grant 11,031,329 - Hu , et al. June 8, 2 | 2021-06-08 |
Flip-chip Package Substrate And Method For Fabricating The Same
App 20210098351 - Chou; Pao-Hung ; et al. | 2021-04-01 |
Electronic package having heat dissipating element and method for fabricating the same
Grant 10,896,882 - Hsu , et al. January 19, 2 | 2021-01-19 |
Semiconductor Package Carrier Board, Method For Fabricating The Same, And Electronic Package Having The Same
App 20200388552 - Chou; Pao-Hung ; et al. | 2020-12-10 |
Semiconductor Package Substrate, Method For Fabricating The Same, And Electronic Package Having The Same
App 20200388564 - Chou; Pao-Hung ; et al. | 2020-12-10 |
Method Of Fabricating Package Substrates
App 20200332429 - YU; CHUN-HSIEN ; et al. | 2020-10-22 |
Semiconductor Package Substrate, Electronic Package And Methods For Fabricating The Same
App 20200312756 - Chou; Pao-Hung ; et al. | 2020-10-01 |
Electronic package
Grant 10,784,205 - Hu , et al. Sept | 2020-09-22 |
Method of fabricating package substrates
Grant 10,745,818 - Yu , et al. A | 2020-08-18 |
Semiconductor Package Structure And Method Of Making The Same
App 20200161234 - Hsu; Che-Wei ; et al. | 2020-05-21 |
Surface Acoustic Wave Filter Package Structure And Method Of Manufacturing The Same
App 20200153409 - Hsu; Shih-Ping ; et al. | 2020-05-14 |
Semiconductor Package Structure And Method Of Making The Same
App 20200135693 - Hu; Chu-Chin ; et al. | 2020-04-30 |
Package Structure For Semiconductor Device And Manufacturing Method Thereof
App 20200075565 - Hsu; Che-Wei ; et al. | 2020-03-05 |
Electronic Package And Method For Fabricating The Same
App 20200075554 - Hsu; Che-Wei ; et al. | 2020-03-05 |
Package substrate and associated fabrication method with varying depths for circuit device terminals
Grant 10,580,739 - Hu , et al. | 2020-03-03 |
Flip-chip Package Substrate And Method For Preparing The Same
App 20200066624 - Chou; Pao-Hung ; et al. | 2020-02-27 |
Interposer substrate and method of fabricating the same
Grant 10,483,194 - Chou , et al. Nov | 2019-11-19 |
Method for fabricating bump structures on chips with panel type process
Grant 10,483,232 - Hsu , et al. Nov | 2019-11-19 |
Flip-chip Packaging Substrate And Method For Fabricating The Same
App 20190348375 - Chou; Pao-Hung ; et al. | 2019-11-14 |
Semiconductor package structure and method of making the same
Grant 10,475,752 - Hsu , et al. Nov | 2019-11-12 |
Interposer substrate and method for manufacturing the same
Grant 10,475,765 - Hsu , et al. Nov | 2019-11-12 |
Flip-chip Package Substrate
App 20190341357 - Hu; Chu-Chin ; et al. | 2019-11-07 |
Semiconductor Package Structure And Method Of Making The Same
App 20190279925 - Hsu; Shih-Ping ; et al. | 2019-09-12 |
Package structure and its fabrication method
Grant 10,361,160 - Hsu | 2019-07-23 |
Electronic Package And Method For Fabricating The Same
App 20190214349 - Hsu; Shih-Ping ; et al. | 2019-07-11 |
Package substrate and its fabrication method
Grant 10,347,575 - Yu , et al. July 9, 2 | 2019-07-09 |
Electronic Package And Method Of Manufacturing The Same
App 20190206754 - Hsu; Che-Wei ; et al. | 2019-07-04 |
Interposer substrate and method of fabricating the same
Grant 10,283,442 - Hsu , et al. | 2019-05-07 |
Sensor package and method of manufacturing the same
Grant 10,269,841 - Hsu , et al. | 2019-04-23 |
Sensor Package and Method of Manufacturing the Same
App 20190103429 - Hsu; Che-Wei ; et al. | 2019-04-04 |
Interposer Substrate And Method For Manufacturing The Same
App 20190074260 - Hsu; Shih-Ping ; et al. | 2019-03-07 |
Method for Fabricating Bump Structures on Chips with Panel Type Process
App 20190067242 - Hsu; Shih-Ping ; et al. | 2019-02-28 |
Electronic package and conductive structure thereof
Grant 10,204,865 - Hu , et al. Feb | 2019-02-12 |
Semiconductor Package Structure and Method of Making the Same
App 20180358304 - Hsu; Shih-Ping ; et al. | 2018-12-13 |
Package Structure And Method Of Fabricating The Same
App 20180315678 - Hsu; Shih-Ping ; et al. | 2018-11-01 |
Manufacturing method of package substrate with metal on conductive portions
Grant 10,117,340 - Hsu , et al. October 30, 2 | 2018-10-30 |
Interposer Substrate And Method Of Fabricating The Same
App 20180286794 - Chou; Pao-Hung ; et al. | 2018-10-04 |
Package substrate having a plurality of chips electrically connected by conductive vias and wiring bonding
Grant 10,079,220 - Hu , et al. September 18, 2 | 2018-09-18 |
Methods of fabricating an electronic package structure
Grant 10,079,190 - Hsu , et al. September 18, 2 | 2018-09-18 |
Package Structure And Method Of Manufacturing The Same
App 20180261578 - HSU; Shih-Ping ; et al. | 2018-09-13 |
Manufacturing Method Of Package Substrate With Metal On Conductive Portions
App 20180255651 - HSU; Che-Wei ; et al. | 2018-09-06 |
Package substrate
Grant 10,062,649 - Hsu , et al. August 28, 2 | 2018-08-28 |
Packaging Substrate And Method Of Fabricating The Same
App 20180240747 - Hu; Chu-Chin ; et al. | 2018-08-23 |
Packaging Substrate And Method Of Fabricating The Same
App 20180240748 - Hu; Chu-Chin ; et al. | 2018-08-23 |
Interposer substrate and method of fabricating the same
Grant 10,014,242 - Chou , et al. July 3, 2 | 2018-07-03 |
Packaging substrate and method of fabricating the same
Grant 10,002,823 - Hu , et al. June 19, 2 | 2018-06-19 |
Package substrate with metal on conductive portions and manufacturing method thereof
Grant 9,992,879 - Hsu , et al. June 5, 2 | 2018-06-05 |
Package structure and method of manufacturing the same
Grant 9,972,599 - Hsu , et al. May 15, 2 | 2018-05-15 |
Package Substrate And Its Fabrication Method
App 20180130771 - HU; CHU-CHIN ; et al. | 2018-05-10 |
Package Substrate And Its Fabrication Method
App 20180130745 - Hu; Chu-Chin ; et al. | 2018-05-10 |
Package Substrate And Flip-chip Package Circuit Including The Same
App 20180122734 - Hsu; Che-Wei ; et al. | 2018-05-03 |
Package Structure And Its Fabrication Method
App 20180108615 - HSU; SHIH-PING | 2018-04-19 |
Substrate structure and manufacturing method thereof
Grant 9,941,208 - Hsu April 10, 2 | 2018-04-10 |
Substrate Structure And Manufacturing Method Thereof
App 20180082941 - Hsu; Shih-Ping | 2018-03-22 |
Package stucture and method of fabricating the same
Grant 9,905,503 - Hsu , et al. February 27, 2 | 2018-02-27 |
Interposer Substrate And Method Of Manufacturing The Same
App 20180047662 - Hsu; Che-Wei ; et al. | 2018-02-15 |
Package substrate and flip-chip package circuit including the same
Grant 9,893,003 - Hsu , et al. February 13, 2 | 2018-02-13 |
Method of fabricating package substrates
Grant 9,831,217 - Hu , et al. November 28, 2 | 2017-11-28 |
Interposer substrate and method of manufacturing the same
Grant 9,831,165 - Hsu , et al. November 28, 2 | 2017-11-28 |
Packaging Substrate And Method Of Fabricating The Same
App 20170338174 - Hu; Chu-Chin ; et al. | 2017-11-23 |
Package substrate, package structure including the same, and their fabrication methods
Grant 9,824,964 - Yu , et al. November 21, 2 | 2017-11-21 |
Package Apparatus
App 20170318683 - HSU; SHIH-PING | 2017-11-02 |
Fabrication Method OF A Package Substrate
App 20170317031 - HU; CHU-CHIN ; et al. | 2017-11-02 |
IC carrier of semiconductor package and manufacturing method thereof
Grant 9,806,012 - Hsu , et al. October 31, 2 | 2017-10-31 |
Substrate structure and manufacturing method thereof
Grant 9,805,996 - Hsu , et al. October 31, 2 | 2017-10-31 |
Package Substrate
App 20170309557 - HSU; Chin-Yao ; et al. | 2017-10-26 |
Method Of Fabricating Package Substrates
App 20170301652 - HU; CHU-CHIN ; et al. | 2017-10-19 |
Package Substrate, Package Structure Including The Same, And Their Fabrication Methods
App 20170287815 - YU; CHUN-HSIEN ; et al. | 2017-10-05 |
Packaging module and substrate structure thereof
Grant 9,754,982 - Yu , et al. September 5, 2 | 2017-09-05 |
Method for manufacturing an electronic package
Grant 9,750,142 - Hsu August 29, 2 | 2017-08-29 |
Package substrate and its fabrication method
Grant 9,741,646 - Hsu , et al. August 22, 2 | 2017-08-22 |
Printed circuit board with embedded component and method for manufacturing same
Grant 9,730,328 - Hsu August 8, 2 | 2017-08-08 |
Package Substrate
App 20170207173 - HSU; SHIH-PING ; et al. | 2017-07-20 |
Package substrate, package structure including the same, and their fabrication methods
Grant 9,711,445 - Yu , et al. July 18, 2 | 2017-07-18 |
Method Of Fabricating Package Substrates
App 20170198406 - YU; CHUN-HSIEN ; et al. | 2017-07-13 |
Package Substrate And Its Fabrication Method
App 20170194262 - HU; CHU-CHIN ; et al. | 2017-07-06 |
IC Carrier of Semiconductor Package and Manufacturing Method Thereof
App 20170162492 - Hsu; Shih-Ping ; et al. | 2017-06-08 |
Electronic package
Grant 9,613,894 - Hu , et al. April 4, 2 | 2017-04-04 |
Package apparatus and manufacturing method thereof
Grant 9,601,402 - Chou , et al. March 21, 2 | 2017-03-21 |
Package apparatus and manufacturing method thereof
Grant 9,589,935 - Hu , et al. March 7, 2 | 2017-03-07 |
Package apparatus and manufacturing method thereof
Grant 9,583,436 - Tseng , et al. February 28, 2 | 2017-02-28 |
Package Substrate And Its Fabrication Method
App 20170047278 - YU; CHUN-HSIEN ; et al. | 2017-02-16 |
Package Substrate And Manufacturing Method Thereof
App 20170034908 - Hsu; Che-Wei ; et al. | 2017-02-02 |
Substrate Structure and Manufacturing Method Thereof
App 20170019995 - Hsu; Shih-Ping ; et al. | 2017-01-19 |
Package substrate and flip-chip package circuit including the same
Grant 9,548,234 - Hsu , et al. January 17, 2 | 2017-01-17 |
Package structure and its fabrication method
Grant 9,536,864 - Hsu January 3, 2 | 2017-01-03 |
Method of fabricating a circuit board structure
Grant 9,484,224 - Hsu November 1, 2 | 2016-11-01 |
Packaging Module And Substrate Structure Thereof
App 20160268326 - Yu; Chun-Hsien ; et al. | 2016-09-15 |
Package Substrate, Package Structure Including The Same, And Their Fabrication Methods
App 20160260655 - YU; CHUN-HSIEN ; et al. | 2016-09-08 |
Package Structure And Its Fabrication Method
App 20160240514 - HSU; SHIH-PING | 2016-08-18 |
Electronic Package
App 20160212852 - Hu; Chu-Chin ; et al. | 2016-07-21 |
Electronic Package And Conductive Structure Thereof
App 20160212851 - Hu; Chu-Chin ; et al. | 2016-07-21 |
Electronic Package
App 20160211204 - Hu; Chu-Chin ; et al. | 2016-07-21 |
Package Apparatus And Manufacturing Method Thereof
App 20160190059 - TSENG; CHAO-TSUNG ; et al. | 2016-06-30 |
Package Stucture And Method Of Fabricating The Same
App 20160181193 - Hsu; Shih-Ping ; et al. | 2016-06-23 |
Package apparatus with multiple pillar layers
Grant 9,370,105 - Hsu , et al. June 14, 2 | 2016-06-14 |
Interposer Substrate And Method Of Fabricating The Same
App 20160163627 - Hsu; Che-Wei ; et al. | 2016-06-09 |
Package Apparatus And Manufacturing Method Thereof
App 20160163677 - HU; CHU-CHIN ; et al. | 2016-06-09 |
Interposer Substrate And Method Of Fabricating The Same
App 20160163626 - Chou; Pao-Hung ; et al. | 2016-06-09 |
Semiconductor Package And Method Of Fabricating The Same
App 20160163629 - Hsu; Shih-Ping ; et al. | 2016-06-09 |
Interposer Substrate And Method Of Fabricating The Same
App 20160165722 - Hsu; Che-Wei ; et al. | 2016-06-09 |
Packaging substrate, method for manufacturing same, and chip packaging body having same
Grant 9,357,647 - Hu , et al. May 31, 2 | 2016-05-31 |
Multi-layer Circuit Board
App 20160135295 - HSU; CHE-WEI ; et al. | 2016-05-12 |
Package Structure And Method Of Fabricating The Same
App 20160135299 - Hsu; Shih-Ping ; et al. | 2016-05-12 |
Interposer substrate and method of fabricating the same
Grant 9,338,900 - Chou , et al. May 10, 2 | 2016-05-10 |
Package Substrate And Flip-chip Package Circuit Including The Same
App 20160118327 - HSU; CHE-WEI ; et al. | 2016-04-28 |
Package Structure And Method Of Fabricating The Same
App 20160104652 - Hsu; Shih-Ping ; et al. | 2016-04-14 |
Interposer Substrate And Method Of Fabricating The Same
App 20160073516 - CHOU; Pao-Hung ; et al. | 2016-03-10 |
Interposer Substrate And Method Of Manufacturing The Same
App 20160064317 - HSU; Che-Wei ; et al. | 2016-03-03 |
Interposer and package on package structure
Grant 9,271,388 - Hsu February 23, 2 | 2016-02-23 |
Method for manufacturing a multi-layer circuit board
Grant 9,265,146 - Hsu , et al. February 16, 2 | 2016-02-16 |
Package Substrate And Its Fabrication Method
App 20160043025 - HSU; CHIN-YAO ; et al. | 2016-02-11 |
Method of fabricating packaging substrate having a passive element embedded therein
Grant 9,232,665 - Hsu , et al. January 5, 2 | 2016-01-05 |
Package Apparatus And Manufacturing Method Thereof
App 20150382469 - HU; Chu-Chin ; et al. | 2015-12-31 |
Package Method
App 20150364435 - HSU; CHE-WEI ; et al. | 2015-12-17 |
Package Substrate And Flip-chip Package Circuit Including The Same
App 20150364408 - HSU; CHE-WEI ; et al. | 2015-12-17 |
Package Apparatus And Manufacturing Method Thereof
App 20150366064 - HSU; CHE-WEI ; et al. | 2015-12-17 |
Package method
Grant 9,214,437 - Hsu , et al. December 15, 2 | 2015-12-15 |
Package Structure And Method Of Manufacturing The Same
App 20150359096 - HSU; Shih-Ping ; et al. | 2015-12-10 |
Packaging substrate having embedded passive component and fabrication method thereof
Grant 9,179,549 - Hsu , et al. November 3, 2 | 2015-11-03 |
Package Structure And Its Fabrication Method
App 20150279818 - HSU; SHIH-PING | 2015-10-01 |
Package Apparatus And Manufacturing Method Thereof
App 20150279777 - HSU; SHIH-PING | 2015-10-01 |
Package Apparatus And Manufacturing Method Thereof
App 20150235916 - CHOU; E-TUNG ; et al. | 2015-08-20 |
Package structure and method for manufacturing same
Grant 9,099,450 - Hsu August 4, 2 | 2015-08-04 |
Printed circuit board with embedded component and method for manufacturing same
Grant 9,089,082 - Hsu July 21, 2 | 2015-07-21 |
Package structure having embedded semiconductor component and fabrication method thereof
Grant 9,024,422 - Hsu , et al. May 5, 2 | 2015-05-05 |
Method for manufacturing IC substrate
Grant 9,015,936 - Hsu , et al. April 28, 2 | 2015-04-28 |
Package on package structure and method for manufacturing same
Grant 9,000,573 - Chen , et al. April 7, 2 | 2015-04-07 |
Package On Package Structrue And Method For Manufacturing Same
App 20140374894 - CHEN; CHIEN-CHIH ; et al. | 2014-12-25 |
Packaging Substrate Having A Passive Element Embedded Therein
App 20140345930 - Hsu; Shih-Ping ; et al. | 2014-11-27 |
Method Of Fabricating Packaging Substrate Having A Passive Element Embedded Therein
App 20140345126 - Hsu; Shih-Ping ; et al. | 2014-11-27 |
Method Of Fabricating Packaging Substrate Having A Passive Element Embedded Therein
App 20140345125 - Hsu; Shih-Ping ; et al. | 2014-11-27 |
Package Structure And Method For Manufacturing Same
App 20140300009 - HSU; SHIH-PING | 2014-10-09 |
Package on package structrue and method for manufacturing same
Grant 8,853,000 - Chen , et al. October 7, 2 | 2014-10-07 |
Packaging substrate having a passive element embedded therein and method of fabricating the same
Grant 8,829,356 - Hsu , et al. September 9, 2 | 2014-09-09 |
Packaging substrate with conductive structure
Grant 8,779,300 - Hsu July 15, 2 | 2014-07-15 |
Printed Circuit Board With Embedded Component And Method For Manufactruing Same
App 20140182892 - HSU; SHIH-PING | 2014-07-03 |
Printed Circuit Board With Embedded Component And Method For Manufacturing Same
App 20140185257 - HSU; Shih-Ping | 2014-07-03 |
Multi-layer Printed Circuit Board And Method For Manufacturing Same
App 20140144675 - HSU; SHIH-PING | 2014-05-29 |
Interposer And Package On Package Structure
App 20140118951 - HSU; SHIH-PING | 2014-05-01 |
Circuit board having semiconductor chip embedded therein
Grant 8,711,572 - Hsu April 29, 2 | 2014-04-29 |
Structure of circuit board and method for fabricating the same
Grant 8,709,940 - Wang , et al. April 29, 2 | 2014-04-29 |
Chip Packaging Substrate, Method For Manufacturing Same, And Chip Packaging Structure Having Same
App 20140085833 - HSU; SHIH-PING ; et al. | 2014-03-27 |
Packaging Substrate, Method For Manufacturing Same, And Chip Packaging Body Having Same
App 20140078706 - HU; CHU-CHIN ; et al. | 2014-03-20 |
Package On Package Structrue And Method For Manufacturing Same
App 20140061903 - CHEN; CHIEN-CHIH ; et al. | 2014-03-06 |
Package Structure Having Embedded Semiconductor Component And Fabrication Method Thereof
App 20140035138 - Hsu; Shih-Ping ; et al. | 2014-02-06 |
Packaging Substrate, Method For Manufacturing Same, And Chip Packaging Body Having Same
App 20140036465 - HU; CHU-CHIN ; et al. | 2014-02-06 |
Package structure
Grant 8,633,587 - Hsu January 21, 2 | 2014-01-21 |
Multi-layer Circuit Board And Method For Manufacturing Same
App 20140000950 - HSU; CHE-WEI ; et al. | 2014-01-02 |
Packaging Substrate And Method For Manufacturing Same
App 20130341073 - HSU; CHE-WEI ; et al. | 2013-12-26 |
Lid for micro-electro-mechanical device and method for fabricating the same
Grant 8,610,006 - Hsu , et al. December 17, 2 | 2013-12-17 |
Method For Manufacturing Ic Substrate
App 20130318785 - HSU; CHE-WEI ; et al. | 2013-12-05 |
Multilayer Printed Circuit Board And Method For Manufacturing Same
App 20130313002 - HSU; SHIH-PING | 2013-11-28 |
Fabrication method of package structure having embedded semiconductor component
Grant 8,580,608 - Hsu , et al. November 12, 2 | 2013-11-12 |
Package stack device and fabrication method thereof
Grant 8,531,021 - Hu , et al. September 10, 2 | 2013-09-10 |
Fabrication Method Of Package Structure Having Embedded Semiconductor Component
App 20130230947 - Hsu; Shih-Ping ; et al. | 2013-09-05 |
Circuit Board Structure And Fabrication Thereof
App 20130183800 - Hsu; Shih-Ping | 2013-07-18 |
Packaging substrate structure with electronic component embedded therein and method for manufacture of the same
Grant 8,436,463 - Hsu May 7, 2 | 2013-05-07 |
Circuit board structure and fabrication method thereof
Grant 8,399,778 - Hsu March 19, 2 | 2013-03-19 |
Lid, Fabricating Method Thereof, And Mems Package Made Thereby
App 20130028450 - Cortese; Mario ; et al. | 2013-01-31 |
Circuit Board Having Semiconductor Chip Embedded Therein
App 20120281375 - Hsu; Shih-Ping | 2012-11-08 |
Package Stack Device And Fabrication Method Thereof
App 20120193789 - Hu; Chu-Chin ; et al. | 2012-08-02 |
Coreless packaging substrate and method for fabricating the same
Grant 8,227,711 - Hsu July 24, 2 | 2012-07-24 |
Packaging Substrate With Conductive Structure
App 20120181688 - Hsu; Shih-Ping | 2012-07-19 |
Package Structure Having Embedded Semiconductor Component And Fabrication Method Thereof
App 20120104598 - Hsu; Shih-Ping ; et al. | 2012-05-03 |
Packaging Substrate Having A Passive Element Embedded Therein And Method Of Fabricating The Same
App 20120037404 - Hsu; Shih- Ping ; et al. | 2012-02-16 |
Packaging Substrate Having Embedded Passive Component And Fabrication Method Thereof
App 20120037411 - Hsu; Shih-Ping ; et al. | 2012-02-16 |
Substrate structure with capacitor component embedded therein and method for fabricating the same
Grant 8,110,896 - Hsu February 7, 2 | 2012-02-07 |
Packaging substrate with conductive structure
Grant 8,101,866 - Hsu January 24, 2 | 2012-01-24 |
Package Structure
App 20120013002 - Hsu; Shih-Ping | 2012-01-19 |
Circuit board with identifiable information and method for fabricating the same
Grant 8,070,932 - Hsu , et al. December 6, 2 | 2011-12-06 |
Packaging substrate structure and manufacturing method thereof
Grant 8,058,566 - Hsu November 15, 2 | 2011-11-15 |
Package substrate embedded with semiconductor component
Grant 8,058,718 - Hsu , et al. November 15, 2 | 2011-11-15 |
Method of fabricating a packaging structure
Grant 8,058,105 - Hsu November 15, 2 | 2011-11-15 |
Package structure
Grant 8,058,721 - Hsu November 15, 2 | 2011-11-15 |
Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same
Grant 8,022,513 - Hsu September 20, 2 | 2011-09-20 |
Method of fabricating a package structure
Grant 8,017,442 - Hsu September 13, 2 | 2011-09-13 |
Embedded chip package structure with chip support protruding section
Grant 7,973,398 - Hsu July 5, 2 | 2011-07-05 |
Structure Of Circuit Board And Method For Fabricating The Same
App 20110154664 - Wang; Shing-Ru ; et al. | 2011-06-30 |
Circuit board structure having electronic components integrated therein
Grant 7,969,745 - Hsu , et al. June 28, 2 | 2011-06-28 |
Packaging substrate having electrical connection structure and method for fabricating the same
Grant 7,956,472 - Hsu June 7, 2 | 2011-06-07 |
Method Of Fabricating A Package Structure
App 20110097851 - Hsu; Shih- Ping | 2011-04-28 |
Method Of Fabricating A Packaging Structure
App 20110097850 - Hsu; Shih-Ping | 2011-04-28 |
Structure of circuit board and method for fabricating same
Grant 7,906,850 - Wang , et al. March 15, 2 | 2011-03-15 |
Coreless Packaging Substrate And Method For Fabricating The Same
App 20110042128 - HSU; Shih- Ping | 2011-02-24 |
Circuit board having power source
Grant 7,881,070 - Hsu February 1, 2 | 2011-02-01 |
Circuit board structure embedded with semiconductor chips
Grant 7,863,729 - Hsu , et al. January 4, 2 | 2011-01-04 |
Circuit board structure
Grant 7,858,885 - Hsu December 28, 2 | 2010-12-28 |
Circuit board structure having embedded capacitor and fabrication method thereof
Grant 7,839,650 - Hsu November 23, 2 | 2010-11-23 |
Circuit board structure having embedded semiconductor element and fabrication method thereof
Grant 7,839,649 - Hsu November 23, 2 | 2010-11-23 |
Method for fabricating a flip chip substrate structure
Grant 7,820,233 - Chen , et al. October 26, 2 | 2010-10-26 |
Circuit board
Grant 7,817,441 - Hsu October 19, 2 | 2010-10-19 |
Packaging substrate and method for fabricating the same
Grant 7,812,460 - Hsu October 12, 2 | 2010-10-12 |
Packaging substrate structure with electronic components embedded therein and method for manufacturing the same
Grant 7,754,538 - Hsu July 13, 2 | 2010-07-13 |
Package substrate and method for fabricating the same
Grant 7,718,470 - Hsu May 18, 2 | 2010-05-18 |
Circuit board structure with embedded semiconductor chip and method for fabricating the same
Grant 7,719,104 - Hsu , et al. May 18, 2 | 2010-05-18 |
Lid For Micro-electro-mechanical Device And Method For Fabricating The Same
App 20100108345 - Hsu; Shih-Ping ; et al. | 2010-05-06 |
Stack structure of circuit boards embedded with semiconductor chips
Grant 7,706,148 - Hsu , et al. April 27, 2 | 2010-04-27 |
Package structure having semiconductor chip embedded therein and method for fabricating the same
Grant 7,705,446 - Chia , et al. April 27, 2 | 2010-04-27 |
Electrical connection element of packaging substrate
App 20100089612 - Hsu; Shih-Ping | 2010-04-15 |
Package Structure And Package Substrate
App 20100052148 - Hsu; Shih-Ping | 2010-03-04 |
Package Structure
App 20100032827 - Hsu; Shih Ping | 2010-02-11 |
Conductive structures for electrically conductive pads of circuit board and fabrication method thereof
Grant 7,659,193 - Hu , et al. February 9, 2 | 2010-02-09 |
Method Of Fabricating Printed Circuit Board Having Semiconductor Components Embedded Therein
App 20100029047 - Hsu; Shih-Ping ; et al. | 2010-02-04 |
Stack structure of circuit board with semiconductor component embedded therein
Grant 7,656,040 - Hsu , et al. February 2, 2 | 2010-02-02 |
Circuit board structure with embedded electronic components
Grant 7,639,473 - Hsu , et al. December 29, 2 | 2009-12-29 |
Package Substrate Having Embedded Photosensitive Semiconductor Chip And Fabrication Method Thereof
App 20090309179 - Hsu; Shih-Ping ; et al. | 2009-12-17 |
Surface roughening method for embedded semiconductor chip structure
Grant 7,629,204 - Hsu December 8, 2 | 2009-12-08 |
Packaging substrate structure
App 20090294993 - Hsu; Shih-Ping | 2009-12-03 |
Packaging Substrate And Method For Fabricating The Same
App 20090294962 - Hsu; Shih-Ping | 2009-12-03 |
Coreless package substrate with conductive structures
Grant 7,626,270 - Chen , et al. December 1, 2 | 2009-12-01 |
Method for fabricating circuit board structure
Grant 7,614,146 - Hsu November 10, 2 | 2009-11-10 |
Plate structure having chip embedded therein and the manufacturing method of the same
Grant 7,598,610 - Hsu , et al. October 6, 2 | 2009-10-06 |
Multi-layer circuit board with fine pitches and fabricating method thereof
Grant 7,592,706 - Hsu September 22, 2 | 2009-09-22 |
Package structure with circuits directly connected to semiconductor chip
Grant 7,582,961 - Chia , et al. September 1, 2 | 2009-09-01 |
Circuit Board Structure Embedded With Semiconductor Chips
App 20090200658 - HSU; Shih Ping ; et al. | 2009-08-13 |
Package Substrate Embedded With Semiconductor Component
App 20090168380 - Hsu; Shih-Ping ; et al. | 2009-07-02 |
Package Substrate Embedded With Semiconductor Component
App 20090166841 - Hsu; Shih-Ping ; et al. | 2009-07-02 |
Methods for repairing circuit board having defective pre-soldering bump
Grant 7,546,682 - Hsu , et al. June 16, 2 | 2009-06-16 |
Manufacturing method of solder ball disposing surface structure of package substrate
Grant 7,544,599 - Hsu June 9, 2 | 2009-06-09 |
Chip embedded packaging structure
Grant 7,539,022 - Hsu May 26, 2 | 2009-05-26 |
Circuit board having power source
App 20090129040 - Hsu; Shih-Ping | 2009-05-21 |
Stacked package module and method for fabricating the same
App 20090115045 - Hsu; Shih-Ping ; et al. | 2009-05-07 |
Package on package structure
App 20090102039 - Hsu; Shih-Ping ; et al. | 2009-04-23 |
Solder Ball Disposing Surface Structure Of Package Substrate
App 20090102050 - HSU; Shih-Ping | 2009-04-23 |
Packaging substrate having capacitor embedded therein
App 20090102045 - Hsu; Shih-Ping ; et al. | 2009-04-23 |
Package Substrate And Method For Fabricating The Same
App 20090096099 - HSU; Shih-Ping | 2009-04-16 |
Circuit board with optoelectronic component embedded therein
Grant 7,519,244 - Hsu April 14, 2 | 2009-04-14 |
Stack structure of circuit boards embedded with semiconductor chips
App 20090091903 - Hsu; Shih Ping ; et al. | 2009-04-09 |
Semiconductor chip electrical connection structure
Grant 7,514,786 - Hsu April 7, 2 | 2009-04-07 |
Packaging substrate structure having semiconductor chip embedded therein and fabricating method thereof
App 20090085192 - Hsu; Shih-Ping ; et al. | 2009-04-02 |
Manufacturing Method Of Solder Ball Disposing Surface Structure Of Package Substrate
App 20090081861 - HSU; Shih-Ping | 2009-03-26 |
Circuit board structure of integrated optoelectronic component
Grant 7,508,006 - Hsu March 24, 2 | 2009-03-24 |
Packaging Substrate Structure And Method For Manufacturing The Same
App 20090071699 - HSU; Shih-Ping | 2009-03-19 |
Circuit board and method for fabricating the same
App 20090071704 - Hsu; Shih-Ping | 2009-03-19 |
Circuit Board Structure And Fabrication Method Thereof
App 20090065245 - Hsu; Shih-Ping | 2009-03-12 |
Packaging substrate structure with electronic component embedded therein and method for manufacture of the same
App 20090057873 - Hsu; Shih-Ping | 2009-03-05 |
Packaging substrate structure with electronic components embedded therein and method for fabricating the same
App 20090057913 - Hsu; Shih-Ping | 2009-03-05 |
Packaging substrate structure with electronic components embedded therein and method for manufacturing the same
App 20090046432 - Hsu; Shih-Ping | 2009-02-19 |
Packaging Substrate Having Electrical Connection Structure And Method For Fabricating The Same
App 20090041981 - Hsu; Shih-Ping | 2009-02-12 |
Packaging Substrate Having Chip Embedded Therein And Manufacturing Method Thereof
App 20090032930 - Hsu; Shih-Ping ; et al. | 2009-02-05 |
Circuit Board
App 20090032294 - Hsu; Shih-Ping | 2009-02-05 |
Semiconductor package substrate having contact pad protective layer formed thereon
Grant 7,485,970 - Hsu , et al. February 3, 2 | 2009-02-03 |
Flip chip package structure and method for manufacturing the same
App 20090026633 - Hsu; Shih-Ping | 2009-01-29 |
Packaging Substrate With Conductive Structure
App 20090020322 - Hsu; Shih-Ping | 2009-01-22 |
Flip-chip package structure, and the substrate and the chip thereof
App 20090014896 - Hsu; Shih-Ping | 2009-01-15 |
Packaging Substrate Structure And Manufacturing Method Thereof
App 20090000813 - Hsu; Shih-Ping | 2009-01-01 |
Semiconductor Package Substrate Having Electrical Connecting Pads
App 20080290528 - HSU; Shih-Ping | 2008-11-27 |
Method for fabricating a flip chip package
Grant 7,453,155 - Hsu November 18, 2 | 2008-11-18 |
Semiconductor device integrated with opto-electric component and method for fabricating the same
Grant 7,450,793 - Hsu November 11, 2 | 2008-11-11 |
Semiconductor package substrate with embedded chip and fabrication method thereof
Grant 7,449,363 - Hsu November 11, 2 | 2008-11-11 |
Substrate structure with embedded semiconductor chip and fabrication method thereof
Grant 7,446,402 - Hsu November 4, 2 | 2008-11-04 |
Circuit board structure having embedded capacitor and fabrication method thereof
App 20080264677 - Hsu; Shih-Ping | 2008-10-30 |
Structure of semiconductor chip and package structure having semiconductor chip embedded therein
App 20080251915 - HSU; Shih-Ping ; et al. | 2008-10-16 |
Method to manufacture a coreless packaging substrate
Grant 7,435,618 - Chen , et al. October 14, 2 | 2008-10-14 |
Packaging substrate structure
App 20080237884 - Hsu; Shih-Ping | 2008-10-02 |
Multi-chip Semiconductor Package Structure
App 20080237832 - Hsu; Shih-Ping ; et al. | 2008-10-02 |
Multi-chip Semiconductor Package Structure
App 20080237833 - Hsu; Shih-Ping ; et al. | 2008-10-02 |
Multi-chip Semiconductor Package Structure
App 20080237831 - Hsu; Shih-Ping ; et al. | 2008-10-02 |
Method to manufacture a coreless packaging substrate
Grant 7,419,850 - Chen , et al. September 2, 2 | 2008-09-02 |
Semiconductor Package Substrate
App 20080185711 - Hsu; Shih-Ping | 2008-08-07 |
Carrier plate structure havign a chip embedded therein and the manufacturing method of the same
App 20080185704 - Hsu; Shih-Ping ; et al. | 2008-08-07 |
Package Structure With Circuits Directly Connected To Semiconductor Chip
App 20080179725 - CHIA; Kan-Jung ; et al. | 2008-07-31 |
Circuit board with identifiable information and method for fabricating the same
App 20080166497 - Hsu; Shih-Ping ; et al. | 2008-07-10 |
Plate structure having chip embedded therein and the manufacturing method of the same
App 20080164597 - Hsu; Shih-Ping ; et al. | 2008-07-10 |
Circuit Board Structure Having Electronic Components Integrated Therein
App 20080165515 - Hsu; Shih-Ping ; et al. | 2008-07-10 |
Method for fabricating thermally enhanced semiconductor device
Grant 7,396,700 - Hsu July 8, 2 | 2008-07-08 |
Circuit Board Structure With Embedded Electronic Components
App 20080151518 - HSU; Shih-Ping ; et al. | 2008-06-26 |
Circuit Board Structure Having Embedded Semiconductor Element And Fabrication Method Thereof
App 20080153324 - HSU; Shih-Ping | 2008-06-26 |
Circuit Board Structure With Embedded Semiconductor Chip
App 20080142951 - Hsu; Shih-Ping ; et al. | 2008-06-19 |
Method For Fabricating Circuit Board Structure With Embedded Semiconductor Chip
App 20080145975 - Hsu; Shih-Ping ; et al. | 2008-06-19 |
Surface structure of flip chip substrate
Grant 7,382,057 - Hsu June 3, 2 | 2008-06-03 |
Circuit Board Structure With Embedded Semiconductor Chip And Method For Fabricating The Same
App 20080116565 - HSU; Shih-Ping ; et al. | 2008-05-22 |
Circuit board with identifiable information and method for fabricating the same
Grant 7,365,272 - Hsu , et al. April 29, 2 | 2008-04-29 |
Circuit Board Structure
App 20080094813 - HSU; Shih-Ping | 2008-04-24 |
Method For Fabricating Circuit Board Structure
App 20080092379 - HSU; Shih-Ping | 2008-04-24 |
Substrate with surface finished structure and method for making the same
App 20080093109 - Hsu; Shih-Ping ; et al. | 2008-04-24 |
Semiconductor device integrated with optoelectronic components
Grant 7,359,590 - Hsu April 15, 2 | 2008-04-15 |
Method for repairing metal finish layer on surface of electrical connection pad of circuit board
App 20080083115 - Hsu; Shih-Ping ; et al. | 2008-04-10 |
Repaired pre-soldering structure of circuit board and method thereof
App 20080083819 - Hsu; Shih-Ping ; et al. | 2008-04-10 |
Thin circuit board
Grant 7,351,916 - Hsu April 1, 2 | 2008-04-01 |
Method for fabricating circuit board with conductive structure
Grant 7,350,298 - Hsu , et al. April 1, 2 | 2008-04-01 |
Method for fabricating a flip chip substrate structure
App 20080075836 - Chen; Bo-Wei ; et al. | 2008-03-27 |
Circuit Board Structure With Embedded Semiconductor Chip And Method For Fabricating The Same
App 20080067666 - HSU; Shih-Ping | 2008-03-20 |
Flip chip substrate structure and the method for manufacturing the same
App 20080060838 - Chen; Bo-Wei ; et al. | 2008-03-13 |
Method for fabricating conductive bump of circuit board
Grant 7,341,934 - Hsu , et al. March 11, 2 | 2008-03-11 |
Circuit Board Structure And Method For Fabricating The Same
App 20080041621 - HSU; Shih-Ping ; et al. | 2008-02-21 |
Plate structure having chip embedded therein and the manufacturing method of the same
App 20080029872 - Hsu; Shih-Ping ; et al. | 2008-02-07 |
Substrate structure integrated with passive components
App 20080024998 - Hsu; Shih-Ping | 2008-01-31 |
Substrate structure integrated with passive components
App 20080023821 - Hsu; Shih-Ping | 2008-01-31 |
Package Structure Having Semiconductor Chip Embedded Therein And Method For Fabricating The Same
App 20080023819 - Chia; Kan-Jung ; et al. | 2008-01-31 |
Stack structure with semiconductor chip embedded in carrier
Grant 7,321,164 - Hsu January 22, 2 | 2008-01-22 |
Substrate for pre-soldering material and fabrication method thereof
Grant 7,319,276 - Hsu , et al. January 15, 2 | 2008-01-15 |
Superfine-circuit semiconductor package structure
App 20080006936 - Hsu; Shih-Ping | 2008-01-10 |
Module structure having embedded chips
Grant 7,312,405 - Hsu December 25, 2 | 2007-12-25 |
Structure with embedded opto-electric components
Grant 7,313,294 - Hsu December 25, 2 | 2007-12-25 |
Stack Structure Of Circuit Board With Semiconductor Component Embedded Therein
App 20070278644 - Hsu; Shih-Ping ; et al. | 2007-12-06 |
Multi-layer circuit board with fine pitches and fabricating method thereof
App 20070281464 - Hsu; Shih-Ping | 2007-12-06 |
Method For Repairing Conductive Structure Of Circuit Board
App 20070281503 - Hsu; Shih-Ping ; et al. | 2007-12-06 |
Method For Repairing Elecrical Circuit Of Circuit Board
App 20070274028 - HSU; Shih-Ping ; et al. | 2007-11-29 |
Circuit board structure of integrated optoelectronic componenet
Grant 7,302,126 - Hsu November 27, 2 | 2007-11-27 |
Method of manufacturing a coreless package substrate and conductive structure of the substrate
App 20070246744 - Chen; Bo-Wei ; et al. | 2007-10-25 |
Method to manufacture a coreless packaging substrate
App 20070249154 - Chen; Bo-Wei ; et al. | 2007-10-25 |
Method to manufacture a coreless packaging substrate
App 20070249155 - Chen; Bo-Wei ; et al. | 2007-10-25 |
Carrier Board Structure With Chip Embedded Therein And Method For Fabricating The Same
App 20070241444 - HSU; Shih-Ping ; et al. | 2007-10-18 |
Surface Structure Of Flip Chip Substrate
App 20070235884 - Hsu; Shih-Ping | 2007-10-11 |
Carrying structure of electronic components
Grant 7,276,800 - Hsu October 2, 2 | 2007-10-02 |
Method of embedding semiconductor chip in support plate
Grant 7,274,099 - Hsu September 25, 2 | 2007-09-25 |
Laminated Ic Packaging Substrate And Inter-connector Structure Thereof
App 20070216019 - Hsu; Shih-Ping | 2007-09-20 |
Embedded chip package structure
App 20070210423 - Hsu; Shih-Ping | 2007-09-13 |
Circuit board structure and method for fabricating the same
App 20070186413 - Hsu; Shih-Ping | 2007-08-16 |
Method for Fabricating Circuit Board with Conductive Structure
App 20070186412 - Hsu; Shih-Ping ; et al. | 2007-08-16 |
Circuit board structure embedded with semiconductor chips
App 20070181995 - Hsu; Shih Ping ; et al. | 2007-08-09 |
Circuit Board with Conductive Structure and Method for Fabricating the same
App 20070158852 - Hsu; Shih-Ping | 2007-07-12 |
Circuit Board Device With Fine Conductive Structure
App 20070158847 - Hsu; Shih-Ping | 2007-07-12 |
Conductive structures for electrically conductive pads of circuit board and fabrication method thereof
App 20070161223 - Hu; Wen-Hung ; et al. | 2007-07-12 |
Substrate assembly with direct electrical connection as a semiconductor package
Grant 7,242,092 - Hsu July 10, 2 | 2007-07-10 |
Circuit board structure with embedded selectable passive components and method for fabricating the same
Grant 7,239,525 - Hsu July 3, 2 | 2007-07-03 |
Circuit board assembly with fine electrically connecting structure
App 20070144774 - Hsu; Shih-Ping | 2007-06-28 |
Structure with semiconductor chips embeded therein and method of fabricating same
App 20070145577 - Zeng; Zhao-Chong ; et al. | 2007-06-28 |
Substrate structure with capacitor component embedded therein and method for fabricating the same
App 20070143993 - Hsu; Shih-Ping | 2007-06-28 |
Structure of circuit board and method for fabricating same
App 20070138630 - Wang; Shing-Ru ; et al. | 2007-06-21 |
Method of fabricating electrical connection terminal of embedded chip
App 20070130763 - Hsu; Shih-Ping ; et al. | 2007-06-14 |
Thin circuit board
App 20070125572 - Hsu; Shih-Ping | 2007-06-07 |
Method for fabricating connection terminal of circuit board
Grant 7,174,630 - Hsu , et al. February 13, 2 | 2007-02-13 |
Method of fabricating electrical connection terminal of embedded chip
Grant 7,174,631 - Hsu , et al. February 13, 2 | 2007-02-13 |
Method for fabricating electrical connection structure of circuit board
Grant 7,151,050 - Hsu , et al. December 19, 2 | 2006-12-19 |
Method of embedding semiconductor chip in support plate and embedded structure thereof
Grant 7,129,117 - Hsu October 31, 2 | 2006-10-31 |
Substrate for pre-soldering material and fabrication method thereof
Grant 7,112,524 - Hsu , et al. September 26, 2 | 2006-09-26 |
Method of fabricating a circuit board
Grant 7,089,660 - Hsu , et al. August 15, 2 | 2006-08-15 |
Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same
Grant 7,081,402 - Hsu , et al. July 25, 2 | 2006-07-25 |
Heat sink structure with embedded electronic components for semiconductor package
Grant 7,050,304 - Hsu , et al. May 23, 2 | 2006-05-23 |
Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same
Grant 7,012,019 - Hsu , et al. March 14, 2 | 2006-03-14 |
Substrate within a Ni/Au structure electroplated on electrical contact pads and method for fabricating the same
Grant 6,853,084 - Hsu , et al. February 8, 2 | 2005-02-08 |
Method of fabricating vias in solder pads of a ball grid array (BGA) substrate
Grant 6,649,506 - Hsu November 18, 2 | 2003-11-18 |
Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier
Grant 6,475,327 - Tung , et al. November 5, 2 | 2002-11-05 |
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