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Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device
Grant 11,444,023 - Hsu , et al. September 13, 2 | 2022-09-13 |
Method Of Forming Semiconductor Packages Having Thermal Through Vias (ttv)
App 20220285241 - Hsu; Sen-Kuei ; et al. | 2022-09-08 |
Package Structure And Manufacturing Method Of Package Structure Thereof
App 20220262758 - Teng; Po-Yuan ; et al. | 2022-08-18 |
Package Structure
App 20220216194 - Hsu; Sen-Kuei ; et al. | 2022-07-07 |
Semiconductor packages having thermal through vias (TTV)
Grant 11,373,922 - Hsu , et al. June 28, 2 | 2022-06-28 |
Package structure and manufacturing method of package structure thereof
Grant 11,355,466 - Teng , et al. June 7, 2 | 2022-06-07 |
Semiconductor package having channels formed between through-insulator-vias
Grant 11,322,453 - Hsu May 3, 2 | 2022-05-03 |
Package structure
Grant 11,296,067 - Hsu , et al. April 5, 2 | 2022-04-05 |
Devices for high-density probing techniques and method of implementing the same
Grant 11,249,112 - Wang , et al. February 15, 2 | 2022-02-15 |
Semiconductor Package
App 20210407914 - Hsu; Sen-Kuei ; et al. | 2021-12-30 |
Semiconductor Package And Manufacturing Method Thereof
App 20210249372 - Hsu; Sen-Kuei ; et al. | 2021-08-12 |
Package Structure And Manufacturing Method Of Package Structure Thereof
App 20210242159 - Teng; Po-Yuan ; et al. | 2021-08-05 |
Conductive Traces in Semiconductor Devices and Methods of Forming Same
App 20210183760 - Shih; Chao-Wen ; et al. | 2021-06-17 |
Semiconductor Package And Manufacturing Method Thereof
App 20210159185 - Hsu; Sen-Kuei | 2021-05-27 |
Conductive traces in semiconductor devices and methods of forming same
Grant 10,937,734 - Shih , et al. March 2, 2 | 2021-03-02 |
Semiconductor Device, Package Structure And Method Of Fabricating The Same
App 20210043564 - Hsu; Sen-Kuei ; et al. | 2021-02-11 |
Package Structure And Manufacturing Method Thereof
App 20210043590 - Hsu; Sen-Kuei ; et al. | 2021-02-11 |
Package Structure
App 20200411499 - Hsu; Sen-Kuei ; et al. | 2020-12-31 |
Semiconductor device and manufacturing method thereof
Grant 10,872,842 - Wan , et al. December 22, 2 | 2020-12-22 |
Semiconductor package, semiconductor device and method for packaging semiconductor device
Grant 10,867,882 - Wan , et al. December 15, 2 | 2020-12-15 |
Semiconductor Packages Having Thermal Through Vias (ttv)
App 20200373219 - Hsu; Sen-Kuei ; et al. | 2020-11-26 |
Package structure and manufacturing method thereof
Grant 10,840,197 - Hsu , et al. November 17, 2 | 2020-11-17 |
Test Circuit And Method
App 20200355737 - Wang; Mill-Jer ; et al. | 2020-11-12 |
Wireless Charging Devices Having Wireless Charging Coils and Methods of Manufacture Thereof
App 20200350782 - Yu; Chen-Hua ; et al. | 2020-11-05 |
Devices For High-density Probing Techniques And Method Of Implementing The Same
App 20200348341 - WANG; Mill-Jer ; et al. | 2020-11-05 |
Semiconductor device, package structure and method of fabricating the same
Grant 10,818,588 - Hsu , et al. October 27, 2 | 2020-10-27 |
Package structure
Grant 10,818,651 - Hsu , et al. October 27, 2 | 2020-10-27 |
Semiconductor Device And Manufacturing Method Thereof
App 20200273773 - Wan; Albert ; et al. | 2020-08-27 |
Semiconductor packages having thermal through vias (TTV)
Grant 10,748,831 - Hsu , et al. A | 2020-08-18 |
Semiconductor Device, Package Structure And Method Of Fabricating The Same
App 20200251414 - Kind Code | 2020-08-06 |
Package Structure
App 20200243497 - Hsu; Sen-Kuei ; et al. | 2020-07-30 |
Test circuit and method
Grant 10,725,090 - Wang , et al. | 2020-07-28 |
Wireless charging devices having wireless charging coils and methods of manufacture thereof
Grant 10,720,788 - Yu , et al. | 2020-07-21 |
Devices for high-density probing techniques and method of implementing the same
Grant 10,718,790 - Wang , et al. | 2020-07-21 |
Package Structure And Manufacturing Method Thereof
App 20200135670 - Hsu; Sen-Kuei ; et al. | 2020-04-30 |
Semiconductor Package, Semiconductor Device And Method For Packaging Semiconductor Device
App 20200091031 - Wan; Albert ; et al. | 2020-03-19 |
Semiconductor Packages And Methods Of Forming The Same
App 20190371694 - Hsu; Sen-Kuei ; et al. | 2019-12-05 |
Packaging of semiconductor device with antenna and heat spreader
Grant 10,490,479 - Wan , et al. Nov | 2019-11-26 |
Devices For High-density Probing Techniques And Method Of Implementing The Same
App 20190302146 - WANG; Mill-Jer ; et al. | 2019-10-03 |
Devices for high-density probing techniques and method of implementing the same
Grant 10,274,518 - Wang , et al. | 2019-04-30 |
Semiconductor device and semiconductor package
Grant 10,256,203 - Chuang , et al. | 2019-04-09 |
Semicondcutor Device And Semicondcutor Package
App 20190035752 - Chuang; Lipu Kris ; et al. | 2019-01-31 |
Semiconductor device structure
Grant 10,157,859 - Chang , et al. Dec | 2018-12-18 |
Test Circuit And Method
App 20180164365 - WANG; Mill-Jer ; et al. | 2018-06-14 |
Semiconductor Device Structure
App 20180130756 - CHANG; Shou-Zen ; et al. | 2018-05-10 |
On-chip electromagnetic bandgap (EBG) structure for noise suppression
Grant 9,899,982 - Tsai , et al. February 20, 2 | 2018-02-20 |
Test circuit and method
Grant 9,891,266 - Wang , et al. February 13, 2 | 2018-02-13 |
Semiconductor device structure and method for forming the same
Grant 9,875,972 - Chang , et al. January 23, 2 | 2018-01-23 |
Semiconductor Device Structure And Method For Forming The Same
App 20180019209 - CHANG; Shou-Zen ; et al. | 2018-01-18 |
Conductive Traces In Semiconductor Devices And Methods Of Forming Same
App 20170250130 - Shih; Chao-Wen ; et al. | 2017-08-31 |
On-chip Electromagnetic Bandgap (ebg) Structure For Noise Suppression
App 20170149404 - Tsai; Ming Hsien ; et al. | 2017-05-25 |
Conductive traces in semiconductor devices and methods of forming same
Grant 9,653,406 - Shih , et al. May 16, 2 | 2017-05-16 |
Wireless Charging Devices, Methods of Manufacture Thereof, and Charging Methods
App 20170104356 - Yu; Chen-Hua ; et al. | 2017-04-13 |
Devices For High-density Probing Techniques And Method Of Implementing The Same
App 20160313372 - WANG; Mill-Jer ; et al. | 2016-10-27 |
Conductive Traces in Semiconductor Devices and Methods of Forming Same
App 20160307852 - Shih; Chao-Wen ; et al. | 2016-10-20 |
Power supply arrangement for semiconductor device
Grant 9,406,648 - Wang , et al. August 2, 2 | 2016-08-02 |
Test-yield improvement devices for high-density probing techniques and method of implementing the same
Grant 9,354,254 - Wang , et al. May 31, 2 | 2016-05-31 |
Power Supply Arrangement For Semiconductor Device
App 20160093588 - WANG; Chuei-Tang ; et al. | 2016-03-31 |
Test Circuit And Method
App 20150241507 - Wang; Mill-Jer ; et al. | 2015-08-27 |
Test-yield Improvement Devices For High-density Probing Techniques And Method Of Implementing The Same
App 20140266273 - WANG; Mill-Jer ; et al. | 2014-09-18 |
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