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Patent applications and USPTO patent grants for Hsu; Ching-Pin.The latest application filed is for "semiconductor structure with an air gap".
Patent | Date |
---|---|
Semiconductor Structure With An Air Gap App 20220068766 - Hsu; Ching-Pin ;   et al. | 2022-03-03 |
Semiconductor structure with an air gap Grant 11,205,609 - Hsu , et al. December 21, 2 | 2021-12-21 |
Semiconductor Structure With An Air Gap App 20210242110 - Hsu; Ching-Pin ;   et al. | 2021-08-05 |
Method for fabricating a semiconductor structure on a semiconductor wafer Grant 10,658,173 - Chang , et al. | 2020-05-19 |
Method For Fabricating A Semiconductor Structure On A Semiconductor Wafer App 20200020524 - Chang; Feng-Yi ;   et al. | 2020-01-16 |
Electronic device Grant 10,290,919 - Hsu , et al. | 2019-05-14 |
Electronic Device App 20190006736 - Hsu; Yu Chen ;   et al. | 2019-01-03 |
Method for manufacturing contact holes of a semiconductor device Grant 9,337,084 - Chen , et al. May 10, 2 | 2016-05-10 |
Method of forming semiconductor device Grant 9,023,708 - Chen , et al. May 5, 2 | 2015-05-05 |
Method Of Forming Semiconductor Device App 20140315365 - Chen; Li-Chiang ;   et al. | 2014-10-23 |
Method for forming semiconductor structure having metal connection Grant 8,785,283 - Chen , et al. July 22, 2 | 2014-07-22 |
Method For Forming Semiconductor Structure Having Metal Connection App 20140154852 - Chen; Chieh-Te ;   et al. | 2014-06-05 |
Method for forming void-free dielectric layer Grant 8,691,659 - Hsu , et al. April 8, 2 | 2014-04-08 |
Method For Fabricating An Aperture App 20140038399 - Chang; Feng-Yi ;   et al. | 2014-02-06 |
Method for fabricating an aperture Grant 8,592,321 - Chang , et al. November 26, 2 | 2013-11-26 |
Method For Forming Void-free Dielectric Layer App 20130109151 - Hsu; Ching-Pin ;   et al. | 2013-05-02 |
Method For Fabricating An Aperture App 20120315748 - Chang; Feng-Yi ;   et al. | 2012-12-13 |
Method for fabricating CMOS transistor Grant 8,252,650 - Chang , et al. August 28, 2 | 2012-08-28 |
Camera lens assembly Grant 6,898,030 - Lin , et al. May 24, 2 | 2005-05-24 |
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