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name:-0.0044960975646973
Hsu; Ching-Pin Patent Filings

Hsu; Ching-Pin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsu; Ching-Pin.The latest application filed is for "semiconductor structure with an air gap".

Company Profile
3.12.10
  • Hsu; Ching-Pin - Tainan City TW
  • Hsu; Ching-Pin - Tainan TW
  • Hsu; Ching Pin - New Taipei TW
  • Hsu; Ching Pin - New Taipei City TW
  • Hsu; Ching-Pin - Taoyuan TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Structure With An Air Gap
App 20220068766 - Hsu; Ching-Pin ;   et al.
2022-03-03
Semiconductor structure with an air gap
Grant 11,205,609 - Hsu , et al. December 21, 2
2021-12-21
Semiconductor Structure With An Air Gap
App 20210242110 - Hsu; Ching-Pin ;   et al.
2021-08-05
Method for fabricating a semiconductor structure on a semiconductor wafer
Grant 10,658,173 - Chang , et al.
2020-05-19
Method For Fabricating A Semiconductor Structure On A Semiconductor Wafer
App 20200020524 - Chang; Feng-Yi ;   et al.
2020-01-16
Electronic device
Grant 10,290,919 - Hsu , et al.
2019-05-14
Electronic Device
App 20190006736 - Hsu; Yu Chen ;   et al.
2019-01-03
Method for manufacturing contact holes of a semiconductor device
Grant 9,337,084 - Chen , et al. May 10, 2
2016-05-10
Method of forming semiconductor device
Grant 9,023,708 - Chen , et al. May 5, 2
2015-05-05
Method Of Forming Semiconductor Device
App 20140315365 - Chen; Li-Chiang ;   et al.
2014-10-23
Method for forming semiconductor structure having metal connection
Grant 8,785,283 - Chen , et al. July 22, 2
2014-07-22
Method For Forming Semiconductor Structure Having Metal Connection
App 20140154852 - Chen; Chieh-Te ;   et al.
2014-06-05
Method for forming void-free dielectric layer
Grant 8,691,659 - Hsu , et al. April 8, 2
2014-04-08
Method For Fabricating An Aperture
App 20140038399 - Chang; Feng-Yi ;   et al.
2014-02-06
Method for fabricating an aperture
Grant 8,592,321 - Chang , et al. November 26, 2
2013-11-26
Method For Forming Void-free Dielectric Layer
App 20130109151 - Hsu; Ching-Pin ;   et al.
2013-05-02
Method For Fabricating An Aperture
App 20120315748 - Chang; Feng-Yi ;   et al.
2012-12-13
Method for fabricating CMOS transistor
Grant 8,252,650 - Chang , et al. August 28, 2
2012-08-28
Camera lens assembly
Grant 6,898,030 - Lin , et al. May 24, 2
2005-05-24

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