Hsieh; Yung-Wei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsieh; Yung-Wei.The latest application filed is for "process for manufacturing semiconductor package having hollow chamber".

Company Profile

0.10.17

Hsieh; Yung-Wei - Hsinchu TW
Hsieh; Yung-Wei - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package structure having hollow chamber and bottom substrate and package process thereof Grant 9,508,676 - Shih , et al. November 29, 2	2016-11-29
Process For Manufacturing Semiconductor Package Having Hollow Chamber App 20160318756 - Shih; Cheng-Hung ; et al.	2016-11-03
Trace Structure Of Fine-pitch Pattern App 20160020166 - Hsieh; Yung-Wei ; et al.	2016-01-21
Semiconductor Manufacturing Process And Structure Thereof App 20140367856 - Shih; Cheng-Hung ; et al.	2014-12-18
Semiconductor manufacturing process and structure thereof Grant 8,877,629 - Shih , et al. November 4, 2	2014-11-04
Semiconductor Manufacturing Process And Structure Thereof App 20140159234 - Shih; Cheng-Hung ; et al.	2014-06-12
Package structure and semiconductor structure thereof Grant 8,581,239 - Shih , et al. November 12, 2	2013-11-12
Method For Manufacturing Fine-pitch Bumps And Structure Thereof App 20130256882 - Shih; Cheng-Hung ; et al.	2013-10-03
Method For Manufacturing Fine-pitch Bumps And Structure Thereof App 20130249089 - Shih; Cheng-Hung ; et al.	2013-09-26
Semiconductor Packaging Method And Structure Thereof App 20130252374 - Shih; Cheng-Hung ; et al.	2013-09-26
Method For Manufacturing Fine-pitch Bumps And Structure Thereof App 20130249081 - Shih; Cheng-Hung ; et al.	2013-09-26
Method for manufacturing fine-pitch bumps and structure thereof Grant 8,530,344 - Shih , et al. September 10, 2	2013-09-10
Semiconductor Packaging Method And Structure Thereof App 20130214419 - Shih; Cheng-Hung ; et al.	2013-08-22
Semiconductor Packaging Method And Structure Thereof App 20130214407 - Shih; Cheng-Hung ; et al.	2013-08-22
Method for manufacturing fine-pitch bumps and structure thereof Grant 8,501,614 - Shih , et al. August 6, 2	2013-08-06
Semiconductor packaging method and structure thereof Grant 8,497,579 - Shih , et al. July 30, 2	2013-07-30
Package Structure And Semiconductor Structure Thereof App 20130187265 - Shih; Cheng-Hung ; et al.	2013-07-25
Bumping Process App 20130183823 - Kuo; Chih-Ming ; et al.	2013-07-18

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