Hortaleza; Edgardo R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hortaleza; Edgardo R..The latest application filed is for "semiconductor device and method of forming clip bond having multiple bond line thicknesses".

Company Profile

0.5.14

Hortaleza; Edgardo R. - Pacifica CA
Hortaleza; Edgardo R. - Garland TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device and Method of Forming Clip Bond Having Multiple Bond Line Thicknesses App 20220208716 - Choi; Hyung Mook ; et al.	2022-06-30
Copper-metallized Integrated Circuits Having An Overcoat For Protecting Bondable Metal Contacts And Improving Mold Compound Adhesion App 20080111244 - Tessmer; Glenn J. ; et al.	2008-05-15
Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits Grant 7,351,651 - Li , et al. April 1, 2	2008-04-01
Re-enforced ball-grid array packages for semiconductor products App 20070085220 - Hortaleza; Edgardo R.	2007-04-19
Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits Grant 7,061,114 - Hortaleza , et al. June 13, 2	2006-06-13
Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits App 20060094228 - Li; Lei ; et al.	2006-05-04
Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits App 20060082000 - Li; Lei ; et al.	2006-04-20
Enhanced PGA interconnection App 20060022327 - Hortaleza; Edgardo R.	2006-02-02
Structure and method for contact pads having double overcoat-protected bondable metal plugs over copper-metallized integrated circuits App 20050224987 - Hortaleza, Edgardo R. ; et al.	2005-10-13
Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits App 20050224984 - Hortaleza, Edgardo R. ; et al.	2005-10-13
Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits App 20050215048 - Li, Lei ; et al.	2005-09-29
Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits App 20050206007 - Li, Lei ; et al.	2005-09-22
Multiple die-spacer for an integrated circuit App 20050161791 - Hortaleza, Edgardo R.	2005-07-28
Recessed-bond semiconductor package substrate App 20040183167 - Hortaleza, Edgardo R. ; et al.	2004-09-23
Undercut process with isotropic plasma etching at package level Grant 6,686,291 - Hortaleza February 3, 2	2004-02-03
Folded tape area array package with one metal layer App 20040012078 - Hortaleza, Edgardo R.	2004-01-22
Heat dissipating flip-chip ball grid array Grant 6,657,311 - Hortaleza , et al. December 2, 2	2003-12-02
Heat Dissipating Flip-chip Ball Grid Array App 20030214049 - Hortaleza, Edgardo R. ; et al.	2003-11-20
Stitch bond enhancement for hard-to-bond materials Grant 5,960,262 - Torres , et al. September 28, 1	1999-09-28

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