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Resin Additive Composition, Thermoplastic Resin Composition, And Molded Article Thereof App 20190062527 - MIZUSHIMA; Hiroaki ;   et al. | 2019-02-28 |
Substrate With Improved Coatability App 20160244592 - KAWAMOTO; Naoshi ;   et al. | 2016-08-25 |
Substrate bonding apparatus and substrate bonding method Grant 9,299,620 - Horikoshi March 29, 2 | 2016-03-29 |
Resin-additive masterbatch Grant 9,249,267 - Yokota , et al. February 2, 2 | 2016-02-02 |
Process for producing plastic bottle Grant 8,980,163 - Horikoshi , et al. March 17, 2 | 2015-03-17 |
Design System For Semiconductor Device, Method For Manufacturing Semiconductor Device, Semiconductor Device And Method For Bonding Substrates App 20140304674 - SUGAYA; Isao ;   et al. | 2014-10-09 |
System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates Grant 8,856,722 - Sugaya , et al. October 7, 2 | 2014-10-07 |
Design System For Semiconductor Device, Method For Manufacturing Semiconductor Device, Semiconductor Device And Method For Bonding Substrates App 20140181781 - SUGAYA; Isao ;   et al. | 2014-06-26 |
Polyolefin resin composition Grant 8,546,473 - Tanji , et al. October 1, 2 | 2013-10-01 |
Substrate Bonding Apparatus And Substrate Bonding Method App 20130244350 - HORIKOSHI; Takahiro | 2013-09-19 |
Design System For Semiconductor Device, Method For Manufacturing Semiconductor Device, Semiconductor Device And Method For Bonding Substrates App 20130191806 - Sugaya; Isao ;   et al. | 2013-07-25 |
Substrate bonding apparatus and substrate bonding method Grant 8,454,771 - Horikoshi June 4, 2 | 2013-06-04 |
Resin-additive Masterbatch App 20130065994 - Yokota; Akiko ;   et al. | 2013-03-14 |
System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates Grant 8,370,789 - Sugaya , et al. February 5, 2 | 2013-02-05 |
Process For Producing Plastic Bottle App 20120013049 - Horikoshi; Takahiro ;   et al. | 2012-01-19 |
Polyester resin composition Grant 8,058,334 - Horikoshi , et al. November 15, 2 | 2011-11-15 |
Polyester resin composition Grant 8,017,678 - Horikoshi , et al. September 13, 2 | 2011-09-13 |
Design System For Semiconductor Device, Method For Manufacturing Semiconductor Device, Semiconductor Device And Method For Bonding Substrates App 20110202890 - SUGAYA; Isao ;   et al. | 2011-08-18 |
Polyolefin Resin Composition App 20110105657 - Tanji; Naoko ;   et al. | 2011-05-05 |
Substrate Bonding Apparatus and Substrate Bonding Method App 20100139836 - HORIKOSHI; Takahiro | 2010-06-10 |
Polyester Resin Composition App 20100113710 - Horikoshi; Takahiro ;   et al. | 2010-05-06 |
Method for producing stabilized polymer Grant 7,662,893 - Tobita , et al. February 16, 2 | 2010-02-16 |
Polyester Resin Composition App 20090176913 - Horikoshi; Takahiro ;   et al. | 2009-07-09 |
Method for Producing Stabilized Polymer App 20080214752 - Tobita; Etsuo ;   et al. | 2008-09-04 |
Polyester resin container with improved weatherability Grant 7,132,499 - Tobita , et al. November 7, 2 | 2006-11-07 |
Polyester resin container with improved weatherability App 20050282995 - Tobita, Etsuo ;   et al. | 2005-12-22 |
Exposure method, exposure apparatus and making method of the apparatus, and device and manufacturing method of the device Grant 6,813,004 - Horikoshi , et al. November 2, 2 | 2004-11-02 |