Zhang, Hongqing

USPTO Trademark & Patent Filings

Trademark applications and grants for Zhang, Hongqing. Zhang, Hongqing has 8 trademark applications. The latest application filed is for "YSABEAU"

Company Profile

Hongqing Zhang
Zhang, Hongqing
zhang hongqing
ZHANG; Hongqing - Hopewell Junction NY
Zhang; Hongqing - Hopewell Junction NY
ZHANG; HONGQING - HOPEWELL JUNCTION NY
Zhang; Hongqing - Bethlehem PA

Entity Type	INDIVIDUAL
Address	Rm 504, Block 8, Yongrong South Terrace, No. 223, Longqi Road, Panyu District, Guangzhou CHINA 511400

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks Patents

Patent Applications

Patent Application	Date
TAMPER-RESPONDENT ASSEMBLIES WITH POROUS HEAT TRANSFER ELEMENT(S) 20220192011 - 17/117267 ZHANG; Hongqing ; et al.	2022-06-16
Conformal Integrated Circuit (IC) Device Package Lid 20210249333 - 16/787241 Lewison; David J. ; et al.	2021-08-12
LID/HEAT SPREADER HAVING TARGETED FLEXIBILITY 20210233825 - 16/773937 LI; SHIDONG ; et al.	2021-07-29
COOLANT-COOLED HEAT SINKS WITH INTERNAL THERMALLY-CONDUCTIVE FINS JOINED TO THE COVER 20210222956 - 16/747059 ZHANG; Hongqing ; et al.	2021-07-22
NON-DESTRUCTIVE BOND LINE THICKNESS MEASUREMENT OF THERMAL INTERFACE MATERIAL ON SILICON PACKAGES 20210123729 - 16/662158 Zhang; Hongqing ; et al.	2021-04-29
Tamper-respondent assembly with structural material within sealed inner compartment 11,191,155 - 17/117,277 Zhang , et al. November 30, 2	2021-11-30
Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover 11,156,409 - 16/747,059 Zhang , et al. October 26, 2	2021-10-26
Conformal integrated circuit (IC) device package lid 11,158,562 - 16/787,241 Lewison , et al. October 26, 2	2021-10-26
Fabricating coolant-cooled heat sinks with internal thermally-conductive fins 10,842,043 - 16/679,496 Zhang , et al. November 17, 2	2020-11-17
Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure 8,541,854 - 13/349,596 Cotte , et al. September 24, 2	2013-09-24

Patent Grants & Applications

Trademark Applications

Mark Image Registration \| Serial	Trademark Application Date
"YSABEAU" 97328524	YSABEAU 2022-03-24
"RIVIKO" 97087076	RIVIKO 2021-10-21
"CAMAAY" 97041355	CAMAAY 2021-09-23
"SAWDCA" 97041360	SAWDCA 2021-09-23
"GOVEAA" 97041346	GOVEAA 2021-09-23
"XTGTP" 90726046	XTGTP 2021-05-21
"YGSDM" 90726061	YGSDM 2021-05-21
"COLORBABY" 90166938	COLORBABY 2020-09-09

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