ZHANG; Hongqing

Patent Applications and Registrations

Patent applications and USPTO patent grants for ZHANG; Hongqing.The latest application filed is for "tamper-respondent assemblies with porous heat transfer element(s)".

Company Profile

1.7.7

ZHANG; Hongqing - Hopewell Junction NY
Zhang; Hongqing - Bethlehem PA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Tamper-respondent Assemblies With Porous Heat Transfer Element(s) App 20220192011 - ZHANG; Hongqing ; et al.	2022-06-16
Tamper-respondent assembly with structural material within sealed inner compartment Grant 11,191,155 - Zhang , et al. November 30, 2	2021-11-30
Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover Grant 11,156,409 - Zhang , et al. October 26, 2	2021-10-26
Conformal integrated circuit (IC) device package lid Grant 11,158,562 - Lewison , et al. October 26, 2	2021-10-26
Conformal Integrated Circuit (IC) Device Package Lid App 20210249333 - Lewison; David J. ; et al.	2021-08-12
Lid/heat Spreader Having Targeted Flexibility App 20210233825 - LI; SHIDONG ; et al.	2021-07-29
Coolant-cooled Heat Sinks With Internal Thermally-conductive Fins Joined To The Cover App 20210222956 - ZHANG; Hongqing ; et al.	2021-07-22
Non-destructive Bond Line Thickness Measurement Of Thermal Interface Material On Silicon Packages App 20210123729 - Zhang; Hongqing ; et al.	2021-04-29
Fabricating coolant-cooled heat sinks with internal thermally-conductive fins Grant 10,842,043 - Zhang , et al. November 17, 2	2020-11-17
Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure Grant 8,541,854 - Cotte , et al. September 24, 2	2013-09-24
Method Of Minimizing Beam Bending Of Mems Device By Reducing The Interfacial Bonding Strength Between Sacrificial Layer And Mems Structure App 20120103534 - COTTE; JOHN M. ; et al.	2012-05-03
Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure Grant 8,163,584 - Lu , et al. April 24, 2	2012-04-24
Method Of Minimizing Beam Bending Of Mems Device By Reducing The Interfacial Bonding Strength Between Sacrificial Layer And Mems Structure App 20090258455 - Cotte; John M. ; et al.	2009-10-15

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