Hong; Jong Kuk

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hong; Jong Kuk.The latest application filed is for "metal core substrate and method of manufacturing the same".

Company Profile

0.12.23

Hong; Jong Kuk - Suwon KR
Hong; Jong-Kuk - Suwon-si N/A KR
Hong; Jong Kuk - Gyunggi-do N/A KR
Hong; Jong Kuk - Chungcheongnam-do KR
Hong; Jong Kuk - Choongchungnam-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Core substrate, manufacturing method thereof, and structure for metal via Grant 9,338,887 - Choi , et al. May 10, 2	2016-05-10
Metal Core Substrate And Method Of Manufacturing The Same App 20140174798 - CHOI; Jae Hoon ; et al.	2014-06-26
Printed Circuit Board And Method Of Manufacturing The Same App 20140144693 - CHOI; Jae Hoon ; et al.	2014-05-29
Core Substrate, Manufacturing Method Thereof, And Structure For Metal Via App 20140102770 - CHOI; Jae Hoon ; et al.	2014-04-17
Package Substrate App 20130313004 - AN; Jin-Yong ; et al.	2013-11-28
Method Of Manufacturing Coreless Substrate Having Filled Via Pad App 20130243941 - LEE; Seok Kyu ; et al.	2013-09-19
Method of manufacturing a package substrate Grant 8,499,444 - An , et al. August 6, 2	2013-08-06
Coreless substrate having filled via pad and method of manufacturing the same Grant 8,445,790 - Lee , et al. May 21, 2	2013-05-21
Semiconductor Package And Method For Manufacturing The Same App 20130119540 - Hong; Jong Kuk ; et al.	2013-05-16
Method of manufacturing a multi-layer board Grant 8,051,559 - Kim , et al. November 8, 2	2011-11-08
Method of manufacturing printed circuit board Grant 7,971,352 - Okabe , et al. July 5, 2	2011-07-05
Trench Substrate And Method Of Fabricating The Same App 20110097553 - Hong; Jong Kuk ; et al.	2011-04-28
Coreless substrate having filled via pad and method of manufacturing the same App 20100096177 - Lee; Seok Kyu ; et al.	2010-04-22
Multi-layer board and manufacturing method thereof App 20090236125 - Kim; Ki-Hwan ; et al.	2009-09-24
Package substrate and manufacturing method thereof App 20090169837 - An; Jin-Yong ; et al.	2009-07-02
Method of manufacturing printed circuit board App 20090151160 - Okabe; Shuhichi ; et al.	2009-06-18
Substrate manufacturing method App 20090084494 - An; Jin-Yong ; et al.	2009-04-02
Multilayered printed circuit board and fabricating method thereof App 20090073670 - Hong; Jong-Kuk ; et al.	2009-03-19
Multilayered printed circuit board and manufacturing method thereof App 20090038837 - Okabe; Shuhichi ; et al.	2009-02-12
Printed circuit board having embedded resistors and method of manufacturing the same App 20080110669 - Park; Hwa Sun ; et al.	2008-05-15
Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same Grant 7,351,915 - Ahn , et al. April 1, 2	2008-04-01
Method of producing printed circuit board with embedded resistor Grant 7,284,317 - Cho , et al. October 23, 2	2007-10-23
Printed circuit board including embedded resistor and method of fabricating the same Grant 7,277,005 - Kang , et al. October 2, 2	2007-10-02
Printed Circuit Board Including Embedded Capacitor Having High Dielectric Constant And Method Of Fabricating Same App 20070146980 - Ahn; Jin-Yong ; et al.	2007-06-28
Printed circuit board including embedded capacitor and method of fabricating same App 20060115770 - Hong; Jong Kuk ; et al.	2006-06-01
Printed circuit board including embedded resistor and method of fabricating the same App 20060049913 - Kang; Myung Sam ; et al.	2006-03-09
Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same App 20060044734 - Ahn; Jin-Yong ; et al.	2006-03-02
Method of fabricating PCB including embedded passive chip App 20060014327 - Cho; Suk-Hyeon ; et al.	2006-01-19
Method of producing printed circuit board with embedded resistor App 20050175385 - Cho, Suk-Hyun ; et al.	2005-08-11
Piezoelectric ceramic composition and piezoelectric ceramic device using the same Grant 6,683,014 - Seo , et al. January 27, 2	2004-01-27
Piezoelectric ceramic composition reducing leakage current and piezoelectric device using the same Grant 6,656,378 - Kwon , et al. December 2, 2	2003-12-02
Piezoelectric ceramic composition reducing leakage current and piezoelectric device using the same App 20030132418 - Kwon, Sang Koo ; et al.	2003-07-17

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