Hollingshead; Curtis

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hollingshead; Curtis.The latest application filed is for "underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices".

Company Profile

0.5.5

Hollingshead; Curtis - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices Grant 7,442,578 - Jiang , et al. October 28, 2	2008-10-28
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices App 20070048900 - Jiang; Tongbi ; et al.	2007-03-01
Treatment of a ground semiconductor die to improve adhesive bonding to a substrate Grant 7,170,184 - Jiang , et al. January 30, 2	2007-01-30
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices Grant 7,094,628 - Jiang , et al. August 22, 2	2006-08-22
Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate Grant 6,812,064 - Jiang , et al. November 2, 2	2004-11-02
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices App 20040191962 - Jiang, Tongbi ; et al.	2004-09-30
Underfill Compounds Including Electrically Charged Filler Elements, Microelectronic Devices Having Underfill Compounds Including Electrically Charged Filler Elements, And Methods Of Underfilling Microelectronic Devices App 20040150079 - Jiang, Tongbi ; et al.	2004-08-05
Underfill Compounds Including Electrically Charged Filler Elements, Microelectronic Devices Having Underfill Compounds Including Electrically Charged Filler Elements, And Methods Of Underfilling Microelectronic Devices Grant 6,768,209 - Jiang , et al. July 27, 2	2004-07-27
Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate App 20030109081 - Jiang, Tongbi ; et al.	2003-06-12
Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate App 20030087507 - Jiang, Tongbi ; et al.	2003-05-08

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