| Patent | Date |
|---|
Method for sealing an access opening to a cavity and MEMS component comprising a sealing element
Grant 10,913,656 - Metzger-Brueckl , et al. February 9, 2 | 2021-02-09 |
Method of manufacturing an imager and imager device
Grant 10,854,669 - Meinhold , et al. December 1, 2 | 2020-12-01 |
Method Of Manufacturing An Imager And Imager Device
App 20200321388 - Meinhold; Dirk ; et al. | 2020-10-08 |
Method of manufacturing an imager and imager device
Grant 10,692,921 - Meinhold , et al. | 2020-06-23 |
Method Of Manufacturing An Imager And Imager Device
App 20200006418 - Meinhold; Dirk ; et al. | 2020-01-02 |
Method of manufacturing an imager and imager device
Grant 10,411,060 - Meinhold , et al. Sept | 2019-09-10 |
Bonded system and a method for adhesively bonding a hygroscopic material
Grant 10,332,814 - Von Waechter , et al. | 2019-06-25 |
Method For Sealing An Access Opening To A Cavity And Mems Component Comprising A Sealing Element
App 20190112182 - Metzger-Brueckl; Gerhard ; et al. | 2019-04-18 |
Method Of Manufacturing An Imager And Imager Device
App 20170301721 - Meinhold; Dirk ; et al. | 2017-10-19 |
Passivation layer and method of making a passivation layer
Grant 9,728,480 - Matoy , et al. August 8, 2 | 2017-08-08 |
Method of manufacturing an imager and imager device
Grant 9,659,992 - Meinhold , et al. May 23, 2 | 2017-05-23 |
Bonded System And A Method For Adhesively Bonding A Hygroscopic Material
App 20160247739 - Von Waechter; Claus ; et al. | 2016-08-25 |
Method for Producing a Semiconductor Device
App 20160086842 - AHRENS; CARSTEN ; et al. | 2016-03-24 |
Method for producing a semiconductor device
Grant 9,236,290 - Ahrens , et al. January 12, 2 | 2016-01-12 |
Passivation Layer and Method of Making a Passivation Layer
App 20150235917 - Matoy; Kurt ; et al. | 2015-08-20 |
Conductive Lines and Pads and Method of Manufacturing Thereof
App 20150194398 - Hampp; Roland ; et al. | 2015-07-09 |
Conductive lines and pads and method of manufacturing thereof
Grant 9,006,898 - Hampp , et al. April 14, 2 | 2015-04-14 |
Method for manufacturing a device on a substrate
Grant 8,999,187 - Obernhuber , et al. April 7, 2 | 2015-04-07 |
Chip Comprising an Integrated Circuit, Fabrication Method and Method for Locally Rendering a Carbonic Layer Conductive
App 20150087145 - Hoeckele; Uwe | 2015-03-26 |
Chip comprising an integrated circuit, fabrication method and method for locally rendering a carbonic layer conductive
Grant 8,927,419 - Hoeckele January 6, 2 | 2015-01-06 |
Semiconductor packages and methods of formation thereof
Grant 8,866,274 - Gruber , et al. October 21, 2 | 2014-10-21 |
Method of Manufacturing an imager and imager device
App 20140284663 - MEINHOLD; Dirk ; et al. | 2014-09-25 |
Through substrate via semiconductor components and methods of formation thereof
Grant 8,815,743 - Birner , et al. August 26, 2 | 2014-08-26 |
Passivation Layer and Method of Making a Passivation Layer
App 20140117511 - Matoy; Kurt ; et al. | 2014-05-01 |
Method for Manufacturing a Device on a Substrate
App 20140083973 - Obernhuber; Sandra ; et al. | 2014-03-27 |
Chip Comprising an Integrated Circuit, Fabrication Method and Method for Locally Rendering a Carbonic Layer Conductive
App 20140073132 - Hoeckele; Uwe | 2014-03-13 |
Conductive Lines and Pads and Method of Manufacturing Thereof
App 20140048940 - Hampp; Roland ; et al. | 2014-02-20 |
Method for manufacturing a device on a substrate
Grant 8,597,531 - Obernhuber , et al. December 3, 2 | 2013-12-03 |
Chip comprising an integrated circuit, fabrication method and method for locally rendering a carbonic layer conductive
Grant 8,598,593 - Hoeckele December 3, 2 | 2013-12-03 |
Conductive lines and pads and method of manufacturing thereof
Grant 8,586,472 - Hampp , et al. November 19, 2 | 2013-11-19 |
Through Substrate Via Semiconductor Components And Methods of Formation Thereof
App 20130267093 - Birner; Albert ; et al. | 2013-10-10 |
Semiconductor Packages and Methods of Formation Thereof
App 20130256857 - Gruber; Hermann ; et al. | 2013-10-03 |
Through substrate via semiconductor components
Grant 8,399,936 - Birner , et al. March 19, 2 | 2013-03-19 |
Chip Comprising an Integrated Circuit, Fabrication Method and Method for Locally Rendering a Carbonic Layer Conductive
App 20130015583 - Hoeckele; Uwe | 2013-01-17 |
Method for Producing a Semiconductor Device
App 20120289023 - Ahrens; Carsten ; et al. | 2012-11-15 |
Conductive Lines and Pads and Method of Manufacturing Thereof
App 20120013011 - Hampp; Roland ; et al. | 2012-01-19 |
Integrated circuit having a semiconductor arrangement
Grant 7,834,427 - Detzel , et al. November 16, 2 | 2010-11-16 |
Method for Manufacturing a Device on a Substrate
App 20100252526 - Obernhuber; Sandra ; et al. | 2010-10-07 |
Through Substrate Via Semiconductor Components
App 20100230818 - Birner; Albert ; et al. | 2010-09-16 |
Through substrate via semiconductor components
Grant 7,772,123 - Birner , et al. August 10, 2 | 2010-08-10 |
Through Substrate Via Semiconductor Components
App 20090302480 - Birner; Albert ; et al. | 2009-12-10 |
Integrated Circuit Having A Semiconductor Arrangement
App 20080179669 - Detzel; Thomas ; et al. | 2008-07-31 |
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