HO; Cheng EN

Patent Applications and Registrations

Patent applications and USPTO patent grants for HO; Cheng EN.The latest application filed is for "method for microstructure modification of conducting lines".

Company Profile

2.12.18

HO; Cheng EN - Taoyuan City TW
Ho; Cheng-En - Taoyuan TW
Ho; Cheng-En - New Taipei TW
HO; CHENG-EN - New Taipei City TW
Ho; Cheng-En - Taipei County TW
Ho; Cheng-En - Yunlin County TW
Ho; Cheng-En - Taoyuan County TW
Ho; Cheng En - Taipei City TW
Ho, Cheng En - Hsu Lin City TW
Ho; Cheng-En - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Microstructure Modification Of Conducting Lines App 20220293467 - HO; Cheng EN ; et al.	2022-09-15
Nanotwinned structure Grant 11,439,007 - Ho , et al. September 6, 2	2022-09-06
Method for microstructure modification of conducting lines Grant 11,430,693 - Ho , et al. August 30, 2	2022-08-30
Nanotwinned Structure App 20200236782 - Ho; Cheng-En ; et al.	2020-07-23
High-speed Electroplating Method App 20200048786 - HO; Cheng En ; et al.	2020-02-13
Method for manufacturing circuit board Grant 9,744,624 - Lan , et al. August 29, 2	2017-08-29
Circuit Board Structure App 20160372409 - Lan; Jaen-Don ; et al.	2016-12-22
Method For Manufacturing Circuit Board App 20160374206 - Lan; Jaen-Don ; et al.	2016-12-22
Adjustable fixture structure for 3-dimensional X-ray computed tomography Grant 9,194,822 - Ho , et al. November 24, 2	2015-11-24
Solder joint with a multilayer intermetallic compound structure Grant 9,079,272 - Ho , et al. July 14, 2	2015-07-14
Adjustable Fixture Structure For 3-dimensional X-ray Computed Tomography App 20150168316 - HO; Cheng-En ; et al.	2015-06-18
Solder Joint With A Multilayer Intermetallic Compound Structure App 20140126955 - Ho; Cheng-En ; et al.	2014-05-08
Method for controlling beta-tin orientation in solder joints Grant 8,702,878 - Ho , et al. April 22, 2	2014-04-22
Method For Suppressing Kirkendall Voids Formation At The Interface Between Solder And Copper Pad App 20130153646 - Ho; Cheng-En	2013-06-20
Method For Controlling Beta-tin Orientation In Solder Joints App 20130008288 - Ho; Cheng-En ; et al.	2013-01-10
Method for inhibiting electromigration-induced phase segregation in solder joints Grant 8,207,469 - Ho , et al. June 26, 2	2012-06-26
Method for inhibiting growth of nickel-copper-tin intermetallic layer in solder joints Grant 8,092,621 - Ho , et al. January 10, 2	2012-01-10
Method for testing a high-speed digital to analog converter based on an undersampling technique Grant 8,049,650 - Lin , et al. November 1, 2	2011-11-01
Method For Testing A High-speed Digital To Analog Converter Based On An Undersampling Technique App 20110227769 - Lin; Chun-Wei ; et al.	2011-09-22
Method For Inhibiting Growth Of Nickel-copper-tin Intermetallic Layer In Solder Joints App 20110139314 - Ho; Cheng-En ; et al.	2011-06-16
High speed ball shear machine Grant 7,950,565 - Ho , et al. May 31, 2	2011-05-31
High Speed Ball Shear Machine App 20100301100 - Ho; Cheng-En ; et al.	2010-12-02
Method Of Inhibiting A Formation Of Palladium-nickel-tin Intermetallic In Solder Joints App 20100127047 - Ho; Cheng-En ; et al.	2010-05-27
Method for inhibiting electromigration-induced phase segregation in solder joints App 20090294409 - Ho; Cheng-En ; et al.	2009-12-03
Fluidic Nano/micro Array Chip And Chipset Thereof App 20080280785 - Tseng; Fan Gang ; et al.	2008-11-13
Solder joints with low consumption rate of nickel layer App 20030219623 - Kao, Cheng Heng ; et al.	2003-11-27
Method for controlling the formation of intermetallic compounds in solder joints Grant 6,602,777 - Kao , et al. August 5, 2	2003-08-05
Method For Controlling The Formation Of Intermetallic Compounds In Solder Joints App 20030132271 - Kao, Cheng-Heng ; et al.	2003-07-17

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