loadpatents
name:-0.025706052780151
name:-0.021078109741211
name:-0.00064420700073242
Hinode; Kenji Patent Filings

Hinode; Kenji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hinode; Kenji.The latest application filed is for "process for manufacturing semiconductor integrated circuit device".

Company Profile
0.18.17
  • Hinode; Kenji - Hachiouji JP
  • Hinode; Kenji - Tokyo JP
  • Hinode; Kenji - Tsukuba JP
  • Hinode; Kenji - Hachioji JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Process for manufacturing semiconductor integrated circuit device
Grant 8,129,275 - Ohashi , et al. March 6, 2
2012-03-06
Semiconductor device and method of manufacturing the same
Grant 7,947,596 - Takeda , et al. May 24, 2
2011-05-24
Process For Manufacturing Semiconductor Integrated Circuit Device
App 20100136786 - Ohashi; Naofumi ;   et al.
2010-06-03
Process for manufacturing semiconductor integrated circuit device
Grant 7,659,201 - Ohashi , et al. February 9, 2
2010-02-09
Polishing method
Grant 7,563,716 - Kondo , et al. July 21, 2
2009-07-21
Process for manufacturing semiconductor integrated circuit device
Grant 7,510,970 - Ohashi , et al. March 31, 2
2009-03-31
Process For Manufacturing Semiconductor Integrated Circuit Device
App 20080233736 - Ohashi; Naofumi ;   et al.
2008-09-25
Polishing method
Grant 7,279,425 - Kondo , et al. October 9, 2
2007-10-09
Polishing Method
App 20070167015 - Kondo; Seiichi ;   et al.
2007-07-19
Polishing method
App 20070029285 - Kondo; Seiichi ;   et al.
2007-02-08
Semiconductor device and method of manufacturing the same
App 20070018330 - Takeda; Kenichi ;   et al.
2007-01-25
Polishing method
Grant 7,132,367 - Kondo , et al. November 7, 2
2006-11-07
Semiconductor device and method manufacturing the same
Grant 7,122,900 - Takeda , et al. October 17, 2
2006-10-17
Manufacturing method for electronic device and multiple layer circuits thereof
Grant 7,081,417 - Hinode , et al. July 25, 2
2006-07-25
Process for manufacturing semiconductor integrated circuit device
App 20060141792 - Ohashi; Naofumi ;   et al.
2006-06-29
Polishing method
App 20050074967 - Kondo, Seiichi ;   et al.
2005-04-07
Semiconductor device
Grant 6,864,584 - Hanaoka , et al. March 8, 2
2005-03-08
Manufacturing method for electronic device and multiple layer circuits thereof
App 20040266209 - Hinode, Kenji ;   et al.
2004-12-30
Polishing method
App 20040229468 - Kondo, Seiichi ;   et al.
2004-11-18
Process for manufacturing semiconductor integrated circuit device
Grant 6,800,557 - Ohashi , et al. October 5, 2
2004-10-05
Process for manufacturing semiconductor integrated circuit device
App 20040152298 - Ohashi, Naofumi ;   et al.
2004-08-05
Semiconductor device and process for producing the same
Grant 6,680,541 - Furusawa , et al. January 20, 2
2004-01-20
Process for manufacturing semiconductor integrated circuit device
App 20030153187 - Ohashi, Naofumi ;   et al.
2003-08-14
Polishing method
Grant 6,596,638 - Kondo , et al. July 22, 2
2003-07-22
Semiconductor device and method manufacuring the same
App 20030111730 - Takeda, Kenichi ;   et al.
2003-06-19
Semiconductor device
App 20030080433 - Hanaoka, Yuko ;   et al.
2003-05-01
Process for manufacturing semiconductor integrated circuit device
App 20020192967 - Ohashi, Naofumi ;   et al.
2002-12-19
Semiconductor device and process for producing the same
App 20020105085 - Furusawa, Takeshi ;   et al.
2002-08-08
Process for manufacturing semiconductor integrated circuit device
App 20020058363 - Ohashi, Naofumi ;   et al.
2002-05-16
Process for manufacturing semiconductor integrated circuit device
Grant 6,376,345 - Ohashi , et al. April 23, 2
2002-04-23
Semiconductor device and process for producing the same
Grant 6,358,838 - Furusawa , et al. March 19, 2
2002-03-19
Semiconductor device and process for producing the same
App 20010009295 - Furusawa, Takeshi ;   et al.
2001-07-26
Polishing method
Grant 6,117,775 - Kondo , et al. September 12, 2
2000-09-12
Titanium nitride film in contact hole with large aspect ratio
Grant 4,897,709 - Yokoyama , et al. January 30, 1
1990-01-30
Semiconductor device
Grant 4,887,146 - Hinode December 12, 1
1989-12-12

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