loadpatents
Patent applications and USPTO patent grants for Hinode; Kenji.The latest application filed is for "process for manufacturing semiconductor integrated circuit device".
Patent | Date |
---|---|
Process for manufacturing semiconductor integrated circuit device Grant 8,129,275 - Ohashi , et al. March 6, 2 | 2012-03-06 |
Semiconductor device and method of manufacturing the same Grant 7,947,596 - Takeda , et al. May 24, 2 | 2011-05-24 |
Process For Manufacturing Semiconductor Integrated Circuit Device App 20100136786 - Ohashi; Naofumi ;   et al. | 2010-06-03 |
Process for manufacturing semiconductor integrated circuit device Grant 7,659,201 - Ohashi , et al. February 9, 2 | 2010-02-09 |
Polishing method Grant 7,563,716 - Kondo , et al. July 21, 2 | 2009-07-21 |
Process for manufacturing semiconductor integrated circuit device Grant 7,510,970 - Ohashi , et al. March 31, 2 | 2009-03-31 |
Process For Manufacturing Semiconductor Integrated Circuit Device App 20080233736 - Ohashi; Naofumi ;   et al. | 2008-09-25 |
Polishing method Grant 7,279,425 - Kondo , et al. October 9, 2 | 2007-10-09 |
Polishing Method App 20070167015 - Kondo; Seiichi ;   et al. | 2007-07-19 |
Polishing method App 20070029285 - Kondo; Seiichi ;   et al. | 2007-02-08 |
Semiconductor device and method of manufacturing the same App 20070018330 - Takeda; Kenichi ;   et al. | 2007-01-25 |
Polishing method Grant 7,132,367 - Kondo , et al. November 7, 2 | 2006-11-07 |
Semiconductor device and method manufacturing the same Grant 7,122,900 - Takeda , et al. October 17, 2 | 2006-10-17 |
Manufacturing method for electronic device and multiple layer circuits thereof Grant 7,081,417 - Hinode , et al. July 25, 2 | 2006-07-25 |
Process for manufacturing semiconductor integrated circuit device App 20060141792 - Ohashi; Naofumi ;   et al. | 2006-06-29 |
Polishing method App 20050074967 - Kondo, Seiichi ;   et al. | 2005-04-07 |
Semiconductor device Grant 6,864,584 - Hanaoka , et al. March 8, 2 | 2005-03-08 |
Manufacturing method for electronic device and multiple layer circuits thereof App 20040266209 - Hinode, Kenji ;   et al. | 2004-12-30 |
Polishing method App 20040229468 - Kondo, Seiichi ;   et al. | 2004-11-18 |
Process for manufacturing semiconductor integrated circuit device Grant 6,800,557 - Ohashi , et al. October 5, 2 | 2004-10-05 |
Process for manufacturing semiconductor integrated circuit device App 20040152298 - Ohashi, Naofumi ;   et al. | 2004-08-05 |
Semiconductor device and process for producing the same Grant 6,680,541 - Furusawa , et al. January 20, 2 | 2004-01-20 |
Process for manufacturing semiconductor integrated circuit device App 20030153187 - Ohashi, Naofumi ;   et al. | 2003-08-14 |
Polishing method Grant 6,596,638 - Kondo , et al. July 22, 2 | 2003-07-22 |
Semiconductor device and method manufacuring the same App 20030111730 - Takeda, Kenichi ;   et al. | 2003-06-19 |
Semiconductor device App 20030080433 - Hanaoka, Yuko ;   et al. | 2003-05-01 |
Process for manufacturing semiconductor integrated circuit device App 20020192967 - Ohashi, Naofumi ;   et al. | 2002-12-19 |
Semiconductor device and process for producing the same App 20020105085 - Furusawa, Takeshi ;   et al. | 2002-08-08 |
Process for manufacturing semiconductor integrated circuit device App 20020058363 - Ohashi, Naofumi ;   et al. | 2002-05-16 |
Process for manufacturing semiconductor integrated circuit device Grant 6,376,345 - Ohashi , et al. April 23, 2 | 2002-04-23 |
Semiconductor device and process for producing the same Grant 6,358,838 - Furusawa , et al. March 19, 2 | 2002-03-19 |
Semiconductor device and process for producing the same App 20010009295 - Furusawa, Takeshi ;   et al. | 2001-07-26 |
Polishing method Grant 6,117,775 - Kondo , et al. September 12, 2 | 2000-09-12 |
Titanium nitride film in contact hole with large aspect ratio Grant 4,897,709 - Yokoyama , et al. January 30, 1 | 1990-01-30 |
Semiconductor device Grant 4,887,146 - Hinode December 12, 1 | 1989-12-12 |
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