HINO; Hirohisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for HINO; Hirohisa.The latest application filed is for "reinforcing resin composition, electronic component, method for manufacturing electronic component, mounting structure, and method for manufacturing mounting structure".

Company Profile

7.7.18

HINO; Hirohisa - Osaka JP
Hino; Hirohisa - Kadoma JP
Hino; Hirohisa - Kadoma-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reinforcing Resin Composition, Electronic Component, Method For Manufacturing Electronic Component, Mounting Structure, And Method For Manufacturing Mounting Structure App 20220049085 - YAMATSU; Shigeru ; et al.	2022-02-17
Resin Flux Solder Paste And Mount Structure App 20210354251 - Hino; Hirohisa ; et al.	2021-11-18
Solder Paste And Mount Structure App 20200306893 - SUZUKI; YASUHIRO ; et al.	2020-10-01
Electrolytic Capacitor App 20200013557 - MATSUMOTO; TAKAYUKI ; et al.	2020-01-09
Resin composition, and electronic component and electronic device using same Grant 10,501,628 - Nishino , et al. Dec	2019-12-10
Resin fluxed solder paste, and mount structure Grant 10,440,834 - Hino , et al. O	2019-10-08
Heat-dissipating resin composition, and component and electronic device including the same Grant 10,407,604 - Nawa , et al. Sept	2019-09-10
Solder Paste And Mount Structure App 20190232438 - HINO; HIROHISA ; et al.	2019-08-01
Heat Insulator App 20190177911 - HINO; HIROHISA ; et al.	2019-06-13
Heat Insulating Material And Method For Forming Coating Of The Same App 20190144701 - NAKAMURA; Taichi ; et al.	2019-05-16
Resin Composition, And Electronic Component And Electronic Device Using Same App 20180305546 - NISHINO; HONAMI ; et al.	2018-10-25
Solder Paste And Mount Structure Obtained By Using Same App 20180229333 - HINO; HIROHISA ; et al.	2018-08-16
Mounting structure and method for producing mounting structure Grant 9,881,813 - Hino , et al. January 30, 2	2018-01-30
Resin structure, and electronic component and electronic device using the structure Grant 9,859,190 - Nawa , et al. January 2, 2	2018-01-02
Structure, And Electronic Component And Electronic Device Including The Structure App 20170338166 - NAWA; HONAMI ; et al.	2017-11-23
Resin Structure, And Electronic Component And Electronic Device Using The Structure App 20170243804 - NAWA; HONAMI ; et al.	2017-08-24
Resin Fluxed Solder Paste, And Mount Structure App 20170188468 - HINO; HIROHISA ; et al.	2017-06-29
Solder Paste And Soldering Flux, And Mounted Structure Using Same App 20170120396 - OHASHI; NAOMICHI ; et al.	2017-05-04
Mounting Structure And Method For Producing Mounting Structure App 20170040184 - HINO; HIROHISA ; et al.	2017-02-09
Cooling structure Grant 9,322,541 - Hino , et al. April 26, 2	2016-04-26
Heat-dissipating Resin Composition, And Component And Electronic Device Including The Same App 20150327393 - NAWA; Honami ; et al.	2015-11-12
Cooling Structure App 20150180099 - HINO; HIROHISA ; et al.	2015-06-25
Thermosetting resin composition, method of manufacturing the same and circuit board Grant 8,697,237 - Hino , et al. April 15, 2	2014-04-15
Thermosetting Resin Composition, Method Of Manufacturing The Same And Circuit Board App 20130237645 - Hino; Hirohisa ; et al.	2013-09-12
Thermosetting Resin Composition, Method of Manufacturing the Same and Circuit Board App 20100147567 - Hino; Hirohisa ; et al.	2010-06-17

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