Hinkle; S. Derek

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hinkle; S. Derek.The latest application filed is for "multi-part lead frame with dissimilar materials".

Company Profile

0.7.11

Hinkle; S. Derek - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-part lead frame Grant 7,321,160 - Hinkle , et al. January 22, 2	2008-01-22
Semiconductor device structures including protective layers formed from healable materials Grant 7,199,464 - Luo , et al. April 3, 2	2007-04-03
Multi-part lead frame with dissimilar materials App 20070057353 - Hinkle; S. Derek ; et al.	2007-03-15
Multi-part lead frame with dissimilar materials App 20070057354 - Hinkle; S. Derek ; et al.	2007-03-15
Multi-part lead frame with dissimilar materials App 20070001274 - Hinkle; S. Derek ; et al.	2007-01-04
Multi-part lead frame with dissimilar materials App 20060125065 - Hinkle; S. Derek ; et al.	2006-06-15
Multi-part lead frame with dissimilar materials App 20050224928 - Hinkle, S. Derek ; et al.	2005-10-13
Multi-part lead frame with dissimilar materials Grant 6,946,722 - Hinkle , et al. September 20, 2	2005-09-20
Semiconductor device structures including protective layers formed from healable materials App 20050156328 - Luo, Shijian ; et al.	2005-07-21
Multi-part lead frame with dissimilar materials App 20050146002 - Hinkle, S. Derek ; et al.	2005-07-07
Multi-part lead frame with dissimilar materials and method of manufacturing Grant 6,902,952 - Hinkle , et al. June 7, 2	2005-06-07
Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein Grant 6,885,108 - Luo , et al. April 26, 2	2005-04-26
Methods for forming protective layers on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein App 20040198023 - Luo, Shijian ; et al.	2004-10-07
Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein App 20040183210 - Luo, Shijian ; et al.	2004-09-23
Multi-part lead frame with dissimilar materials App 20030205790 - Hinkle, S. Derek ; et al.	2003-11-06
Multi-part lead frame with dissimilar materials and method of manufacturing App 20020076857 - Hinkle, S. Derek ; et al.	2002-06-20
Multi-part lead frame with dissimilar materials and method of manufacturing Grant 6,140,154 - Hinkle , et al. October 31, 2	2000-10-31
Multi-part lead frame with dissimilar materials and method of manufacturing Grant 6,072,228 - Hinkle , et al. June 6, 2	2000-06-06

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