HEO; Cheol Ho

Patent Applications and Registrations

Patent applications and USPTO patent grants for HEO; Cheol Ho.The latest application filed is for "printed circuit board and manufacturing method thereof".

Company Profile

0.7.20

HEO; Cheol Ho - Busan KR
HEO; Cheol Ho - Suwon KR
Heo; Cheol Ho - Busan-si KR
Heo; Cheol-Ho - Busanjin-gu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed Circuit Board And Manufacturing Method Thereof App 20150017477 - HEO; Cheol Ho ; et al.	2015-01-15
Substrate For Led Module And Method For Manufacturing The Same App 20140021851 - HEO; Cheol Ho	2014-01-23
Printed circuit board Grant 8,624,123 - Heo , et al. January 7, 2	2014-01-07
Metallic laminate and manufacturing method of light emitting diode package using the same Grant 8,568,861 - Chong , et al. October 29, 2	2013-10-29
Method Of Manufacturing Substrate For Led Module And Substrate For Led Module Manufactured By The Same App 20130256709 - Lee; Yang Je ; et al.	2013-10-03
Metalic Laminate And Manufacturing Method Of Light Emitting Diode Package Using The Same App 20130183479 - CHONG; Myung Gun ; et al.	2013-07-18
Metallic laminate and manufacturing method of light emitting diode package using the same Grant 8,481,171 - Chong , et al. July 9, 2	2013-07-09
Heat Dissipating Substrate And Method Of Manufacturing The Same App 20130160978 - SHIN; Sang Hyun ; et al.	2013-06-27
Printed Circuit Board and Method Of Manufacturing The Same App 20130139383 - Choi; Kye Won ; et al.	2013-06-06
Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate Grant 8,368,291 - Seo , et al. February 5, 2	2013-02-05
Heat Radiating Substrate App 20120275116 - HEO; Cheol Ho	2012-11-01
Printed Circuit Board App 20120199381 - Heo; Cheol Ho ; et al.	2012-08-09
Heat radiating substrate and method of manufacturing the same App 20120085574 - Park; Ji Hyun ; et al.	2012-04-12
Radiant Heat Substrate And Method For Manufacturing The Radiant Heat Substrate, And Luminous Element Package With The Radiant Heat Substrate App 20120043875 - Seo; Ki Ho ; et al.	2012-02-23
Light Emitting Module And Method Of Manufacturing The Same App 20120001544 - KIM; Tae Hoon ; et al.	2012-01-05
Heat Dissipating Substrate And Method Of Manufacturing The Same App 20110316035 - Shin; Sang Hyun ; et al.	2011-12-29
Printed Circuit Board Adn Method Of Manufacturing The Same App 20110266038 - CHOI; Kye Won ; et al.	2011-11-03
Heat radiating structure and method for manufacturing the same App 20110100616 - Heo; Cheol Ho	2011-05-05
Light emitting device package and method for manufacturing the same App 20110101406 - Heo; Cheol Ho ; et al.	2011-05-05
Metallic Laminate And Manufacturing Method Of Light Emitting Diode Package Using The Same App 20100304162 - CHONG; Myung Gun ; et al.	2010-12-02
Method of manufacturing PCB and PCB manufactured by the same App 20090277679 - Jung; Ha Yong ; et al.	2009-11-12
Printed circuit board and manufacturing method of the same App 20090133920 - Kim; Keun-Ho ; et al.	2009-05-28
Radiant heat printed circuit board and method of fabricating the same App 20080277146 - Hwang; Yun Seok ; et al.	2008-11-13

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