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Patent applications and USPTO patent grants for Henschel; Mark E..The latest application filed is for "feedthrough header assembly and device including same".
Patent | Date |
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Feedthrough Header Assembly And Device Including Same App 20220241598 - Henschel; Mark E. ;   et al. | 2022-08-04 |
Integrated Circuit Package And Method Of Forming Same App 20220157676 - Kim; Chunho ;   et al. | 2022-05-19 |
Integrated Circuit Package And System Using Same App 20220158021 - Boone; Mark R. ;   et al. | 2022-05-19 |
Electronic Package And Implantable Medical Device Including Same App 20220077085 - Henschel; Mark E. ;   et al. | 2022-03-10 |
Integrated circuit package and method of forming same Grant 11,270,920 - Kim , et al. March 8, 2 | 2022-03-08 |
Integrated circuit package and system using same Grant 11,264,527 - Boone , et al. March 1, 2 | 2022-03-01 |
System And Method For Valve Control App 20220032018 - SUTANTO; Jemmy ;   et al. | 2022-02-03 |
System And Method For Valve Control App 20220032017 - SUTANTO; Jemmy ;   et al. | 2022-02-03 |
Method For Applying Conductors To Catheter Based Balloons App 20220000550 - Henschel; Mark E. ;   et al. | 2022-01-06 |
Feedthrough Assembly And Device Including Same App 20210187307 - Ries; Andrew J. ;   et al. | 2021-06-24 |
Hermetic Assembly And Device Including Same App 20210178518 - Ruben; David A. ;   et al. | 2021-06-17 |
Die Carrier Package And Method Of Forming Same App 20210159131 - Boone; Mark R. ;   et al. | 2021-05-27 |
Laser Cutting System App 20210154772 - He; Xiangnan ;   et al. | 2021-05-27 |
Electronics Assembly For Implantable Medical Device App 20210121705 - Ries; Andrew J. ;   et al. | 2021-04-29 |
Die carrier package and method of forming same Grant 10,950,511 - Boone , et al. March 16, 2 | 2021-03-16 |
Antenna for implantable medical devices Grant 10,737,099 - Wasson , et al. A | 2020-08-11 |
Electrical Component And Method Of Forming Same App 20200154567 - KIM; Chunho ;   et al. | 2020-05-14 |
Die Carrier Package And Method Of Forming Same App 20200135597 - Boone; Mark R. ;   et al. | 2020-04-30 |
Electronic Assembly And Method Of Forming Same App 20200111765 - KIM; Chunho ;   et al. | 2020-04-09 |
Integrated Circuit Package And System Using Same App 20200105961 - Boone; Mark R. ;   et al. | 2020-04-02 |
Integrated Circuit Package And Method Of Forming Same App 20200058567 - KIM; Chunho ;   et al. | 2020-02-20 |
Antenna For Implantable Medical Devices App 20180333586 - WASSON; James R. ;   et al. | 2018-11-22 |
Spinal implant system and method Grant 10,123,882 - Stevenson , et al. November 13, 2 | 2018-11-13 |
Method For Applying Conductors To Catheter Based Balloons App 20180236211 - HENSCHEL; Mark E. | 2018-08-23 |
Medical device with surface mounted lead connector Grant 9,579,511 - Henschel , et al. February 28, 2 | 2017-02-28 |
Spinal Implant System And Method App 20170007420 - Stevenson; Tyler S. ;   et al. | 2017-01-12 |
Medical Device With Surface Mounted Lead Connector App 20160166825 - Henschel; Mark E. ;   et al. | 2016-06-16 |
Non-destructive tilt data measurement to detect defective bumps Grant 8,860,456 - Huang , et al. October 14, 2 | 2014-10-14 |
Implantable medical device having a multi-axis magnetic sensor Grant 8,750,961 - Ries , et al. June 10, 2 | 2014-06-10 |
Non-Destructive Tilt Data Measurement to Detect Defective Bumps App 20130033286 - Huang; Sa ;   et al. | 2013-02-07 |
Accelerometer for implantable medical device Grant 6,216,537 - Henschel , et al. April 17, 2 | 2001-04-17 |
Shock resistant accelerometer for implantable medical device Grant 5,885,471 - Ruben , et al. March 23, 1 | 1999-03-23 |
Packaged integrated accelerometer Grant 5,674,258 - Henschel , et al. October 7, 1 | 1997-10-07 |
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