Hegde; Shashikant

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hegde; Shashikant.The latest application filed is for "liquid electrical interconnect and devices using same".

Company Profile

0.5.9

Hegde; Shashikant - Boise ID US
Hegde; Shashikant - US
Hegde; Shashikant - Boide ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Liquid electrical interconnect and devices using same Grant 8,445,831 - Lake , et al. May 21, 2	2013-05-21
Liquid Electrical Interconnect And Devices Using Same App 20120061787 - Lake; Rick ; et al.	2012-03-15
Thermal embossing of resist reflowed lenses to make aspheric lens master wafer Grant 7,919,230 - Oliver , et al. April 5, 2	2011-04-05
Method of forming lens arrays and transferring such onto movable-MEMS structures Grant 7,920,343 - Lake , et al. April 5, 2	2011-04-05
Liquid Electrical Interconnect And Devices Using Same App 20100270458 - Lake; Rick ; et al.	2010-10-28
Method Of Forming Lens Arrays And Transferring Such Onto Movable-mems Structures App 20100177408 - Lake; Rick ; et al.	2010-07-15
Wafer Level Lens Replication On Micro-electrical-mechanical Systems App 20100177411 - Hegde; Shashikant ; et al.	2010-07-15
Stamp With Mask Pattern For Discrete Lens Replication App 20100123260 - Duparre; Jacques ; et al.	2010-05-20
Apparatus and Method of Manufacture for Movable Lens on Transparent Substrate App 20100123209 - Duparre; Jacques ; et al.	2010-05-20
Imaging module with symmetrical lens system and method of manufacture Grant 7,710,667 - Oliver , et al. May 4, 2	2010-05-04
Imaging Module With Symmetrical Lens System And Method Of Manufacture App 20090323206 - Oliver; Steve ; et al.	2009-12-31
Thermal embossing of resist reflowed lenses to make aspheric lens master wafer App 20090325107 - Oliver; Steve ; et al.	2009-12-31
Method and apparatus providing uniform separation of lens wafer and structure bonded thereto App 20090284837 - Lake; Rick ; et al.	2009-11-19

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