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Tight pitch wirings and capacitor(s) Grant 11,380,615 - Stamper , et al. July 5, 2 | 2022-07-05 |
Tight Pitch Wirings And Capacitor(s) App 20210134716 - STAMPER; Anthony K. ;   et al. | 2021-05-06 |
Tight pitch wirings and capacitor(s) Grant 10,910,304 - Stamper , et al. February 2, 2 | 2021-02-02 |
Tight Pitch Wirings And Capacitor(s) App 20200243439 - STAMPER; Anthony K. ;   et al. | 2020-07-30 |
Semiconductor Structures Having Low Resistance Paths Throughout A Wafer App 20190362977 - GAMBINO; Jeffrey P. ;   et al. | 2019-11-28 |
Semiconductor structures having low resistance paths throughout a wafer Grant 10,438,803 - Gambino , et al. O | 2019-10-08 |
Integrated circuit including wire structure, related method and design structure Grant 10,224,276 - Cooney, III , et al. | 2019-03-05 |
Air gap over transistor gate and related method Grant 10,211,146 - He , et al. Feb | 2019-02-19 |
Semiconductor structures having low resistance paths throughout a wafer Grant 10,177,000 - Gambino , et al. J | 2019-01-08 |
Air gap over transistor gate and related method Grant 10,157,777 - He , et al. Dec | 2018-12-18 |
Segmented Guard-ring And Chip Edge Seals App 20180248001 - STAMPER; Anthony K. ;   et al. | 2018-08-30 |
Segmented guard-ring and chip edge seals Grant 10,062,748 - Stamper , et al. August 28, 2 | 2018-08-28 |
Integrated Circuit Including Wire Structure, Related Method And Design Structure App 20180040556 - Cooney, III; Edward C. ;   et al. | 2018-02-08 |
Integrated circuit including wire structure, related method and design structure Grant 9,831,122 - Cooney, III , et al. November 28, 2 | 2017-11-28 |
Air Gap Over Transistor Gate And Related Method App 20170330832 - He; Zhong-Xiang ;   et al. | 2017-11-16 |
Air Gap Over Transistor Gate And Related Method App 20170330790 - He; Zhong-Xiang ;   et al. | 2017-11-16 |
Dielectric region in a bulk silicon substrate providing a high-Q passive resonator Grant 9,818,688 - Dunn , et al. November 14, 2 | 2017-11-14 |
Optoelectronic structures having multi-level optical waveguides and methods of forming the structures Grant 9,703,036 - He , et al. July 11, 2 | 2017-07-11 |
Semiconductor structures having low resistance paths throughout a wafer Grant 9,691,623 - Gambino , et al. June 27, 2 | 2017-06-27 |
Semiconductor Structures Having Low Resistance Paths Throughout A Wafer App 20170148672 - GAMBINO; Jeffrey P. ;   et al. | 2017-05-25 |
Semiconductor structures having low resistance paths throughout a wafer Grant 9,620,371 - Gambino , et al. April 11, 2 | 2017-04-11 |
Copper wire and dielectric with air gaps Grant 9,613,853 - Chen , et al. April 4, 2 | 2017-04-04 |
Dielectric cover for a through silicon via Grant 9,524,924 - Couture , et al. December 20, 2 | 2016-12-20 |
Semiconductor structures having low resistance paths throughout a wafer Grant 9,478,427 - Gambino , et al. October 25, 2 | 2016-10-25 |
Semiconductor Structures Having Low Resistance Paths Throughout A Wafer App 20160284645 - GAMBINO; Jeffrey P. ;   et al. | 2016-09-29 |
Dielectric region in a bulk silicon substrate providing a high-Q passive resonator Grant 9,437,539 - Dunn , et al. September 6, 2 | 2016-09-06 |
Complimentary metal-insulator-metal (MIM) capacitors and method of manufacture Grant 9,424,992 - Dunn , et al. August 23, 2 | 2016-08-23 |
Planar cavity MEMS and related structures, methods of manufacture and design structures Grant 9,406,472 - Dang , et al. August 2, 2 | 2016-08-02 |
Integrated circuit and interconnect, and method of fabricating same Grant 9,390,969 - DeMuynck , et al. July 12, 2 | 2016-07-12 |
Optoelectronic Structures Having Multi-level Optical Waveguides And Methods Of Forming The Structures App 20160170140 - He; Zhong-Xiang ;   et al. | 2016-06-16 |
Method for making a dielectric region in a bulk silicon substrate providing a high-Q passive resonator Grant 9,355,972 - Dunn , et al. May 31, 2 | 2016-05-31 |
Optoelectronic structures having multi-level optical waveguides and methods of forming the structures Grant 9,323,008 - He , et al. April 26, 2 | 2016-04-26 |
Dielectric Cover For A Through Silicon Via App 20160111352 - Couture; Daniel J. ;   et al. | 2016-04-21 |
Semiconductor structures having low resistance paths throughout a wafer Grant 9,312,140 - Gambino , et al. April 12, 2 | 2016-04-12 |
Semiconductor structure with thin film resistor and terminal bond pad Grant 9,287,345 - Chen , et al. March 15, 2 | 2016-03-15 |
Dielectric Region In A Bulk Silicon Substrate Providing A High-q Passive Resonator App 20160071796 - Dunn; James S. ;   et al. | 2016-03-10 |
Methods for selective reverse mask planarization and interconnect structures formed thereby Grant 9,269,666 - He , et al. February 23, 2 | 2016-02-23 |
Copper Wire And Dielectric With Air Gaps App 20160035621 - CHEN; Fen ;   et al. | 2016-02-04 |
Dielectric cover for a through silicon via Grant 9,252,080 - Couture , et al. February 2, 2 | 2016-02-02 |
Capacitor using barrier layer metallurgy Grant 9,231,046 - Daubenspeck , et al. January 5, 2 | 2016-01-05 |
Semiconductor structures and methods of manufacture Grant 9,230,929 - Daubenspeck , et al. January 5, 2 | 2016-01-05 |
Copper wire and dielectric with air gaps Grant 9,230,914 - Chen , et al. January 5, 2 | 2016-01-05 |
Semiconductor Structures Having Low Resistance Paths Throughout A Wafer App 20150364367 - GAMBINO; Jeffrey P. ;   et al. | 2015-12-17 |
Semiconductor Structures Having Low Resistance Paths Throughout A Wafer App 20150364368 - GAMBINO; Jeffrey P. ;   et al. | 2015-12-17 |
Semiconductor Structures Having Low Resistance Paths Throughout A Wafer App 20150364416 - GAMBINO; Jeffrey P. ;   et al. | 2015-12-17 |
Dielectric Region In A Bulk Silicon Substrate Providing A High-q Passive Resonator App 20150357295 - Dunn; James S. ;   et al. | 2015-12-10 |
Semiconductor Structures Having Low Resistance Paths Throughout A Wafer App 20150332925 - GAMBINO; Jeffrey P. ;   et al. | 2015-11-19 |
Copper wire and dielectric with air gaps Grant 9,159,671 - Chen , et al. October 13, 2 | 2015-10-13 |
Optoelectronic Structures Having Multi-level Optical Waveguides And Methods Of Forming The Structures App 20150277064 - He; Zhong-Xiang ;   et al. | 2015-10-01 |
Tsv With End Cap, Method And 3d Integrated Circuit App 20150262911 - Chen; Fen ;   et al. | 2015-09-17 |
Dielectric Region In A Bulk Silicon Substrate Providing A High-q Passive Resonator App 20150255528 - Dunn; James S. ;   et al. | 2015-09-10 |
Semiconductor chip with a dual damascene wire and through-substrate via (TSV) structure Grant 9,093,503 - Chen , et al. July 28, 2 | 2015-07-28 |
Fabricating polysilicon MOS devices and passive ESD devices Grant 9,087,808 - Ellis-Monaghan , et al. July 21, 2 | 2015-07-21 |
Semiconductor structures with metal lines Grant 9,087,839 - Adderly , et al. July 21, 2 | 2015-07-21 |
Semiconductor Chip With A Dual Damascene Wire And Through-substrate Via (tsv) Structure App 20150194345 - Chen; Fen ;   et al. | 2015-07-09 |
Structure of very high insertion loss of the substrate noise decoupling Grant 9,059,183 - Ding , et al. June 16, 2 | 2015-06-16 |
Heterojunction bipolar transistor with reduced sub-collector length, method of manufacture and design structure Grant 9,059,138 - Camillo-Castillo , et al. June 16, 2 | 2015-06-16 |
Copper Wire And Dielectric With Air Gaps App 20150137375 - CHEN; Fen ;   et al. | 2015-05-21 |
Copper Wire And Dielectric With Air Gaps App 20150137374 - CHEN; Fen ;   et al. | 2015-05-21 |
Integrated Circuit And Interconnect, And Method Of Fabricating Same App 20150140809 - DeMuynck; David A. ;   et al. | 2015-05-21 |
Composite copper wire interconnect structures and methods of forming Grant 8,975,531 - Anderson , et al. March 10, 2 | 2015-03-10 |
Integrated Circuit Including Wire Structure And Related Method App 20150056799 - Cooney, III; Edward C. ;   et al. | 2015-02-26 |
Fabricating polysilicon MOS devices and passive ESD devices Grant 8,951,893 - Ellis-Monaghan , et al. February 10, 2 | 2015-02-10 |
Semiconductor Structures And Methods Of Manufacture App 20150021793 - DAUBENSPECK; Timothy H. ;   et al. | 2015-01-22 |
Semiconductor structures and methods of manufacture Grant 8,927,869 - Daubenspeck , et al. January 6, 2 | 2015-01-06 |
Inductors and wiring structures fabricated with limited wiring material Grant 8,900,964 - Ding , et al. December 2, 2 | 2014-12-02 |
Interdigitated capacitors with a zero quadratic voltage coefficient of capacitance or zero linear temperature coefficient of capacitance Grant 8,901,710 - Anderson , et al. December 2, 2 | 2014-12-02 |
Fabricating Polysilicon Mos Devices And Passive Esd Devices App 20140339607 - Ellis-Monaghan; John J. ;   et al. | 2014-11-20 |
Planar cavity MEMS and related structures, methods of manufacture and design structures Grant 8,865,497 - Dunbar, III , et al. October 21, 2 | 2014-10-21 |
Method of manufacturing complimentary metal-insulator-metal (MIM) capacitors Grant 8,857,022 - Dunn , et al. October 14, 2 | 2014-10-14 |
On-chip transmission line structures with balanced phase delay Grant 8,860,191 - Ding , et al. October 14, 2 | 2014-10-14 |
Semiconductor Structures With Metal Lines App 20140291802 - Adderly; Shawn A. ;   et al. | 2014-10-02 |
Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structure Grant 8,847,401 - Chen , et al. September 30, 2 | 2014-09-30 |
Local wiring for a bipolar junction transistor including a self-aligned emitter region Grant 8,841,750 - Harame , et al. September 23, 2 | 2014-09-23 |
Tapered via and MIM capacitor Grant 8,842,412 - Dunn , et al. September 23, 2 | 2014-09-23 |
Capacitor Using Barrier Layer Metallurgy App 20140264741 - Daubenspeck; Timothy H. ;   et al. | 2014-09-18 |
Integrated circuit including sensor structure, related method and design structure Grant 8,822,993 - Cooney, III , et al. September 2, 2 | 2014-09-02 |
Interdigitated Capacitors With A Zero Quadratic Voltage Coefficient Of Capacitance Or Zero Linear Temperature Coefficient Of Capacitance App 20140239448 - Anderson; Frederick G. ;   et al. | 2014-08-28 |
Isolated wire structures with reduced stress, methods of manufacturing and design structures Grant 8,815,733 - Gambino , et al. August 26, 2 | 2014-08-26 |
Back-end-of-line metal-oxide-semiconductor varactors Grant 8,809,155 - Ellis-Monaghan , et al. August 19, 2 | 2014-08-19 |
Thick on-chip high-performance wiring structures Grant 8,803,284 - Cooney, III , et al. August 12, 2 | 2014-08-12 |
Interconnect structures and design structures for a radiofrequency integrated circuit Grant 8,791,545 - Dalton , et al. July 29, 2 | 2014-07-29 |
Composite Copper Wire Interconnect Structures And Methods Of Forming App 20140202746 - Anderson; Felix ;   et al. | 2014-07-24 |
Isolated Wire Structures With Reduced Stress, Methods Of Manufacturing And Design Structures App 20140193970 - Gambino; Jeffrey P. ;   et al. | 2014-07-10 |
Fabricating Polysilicon Mos Devices And Passive Esd Devices App 20140183753 - Ellis-Monaghan; John J. ;   et al. | 2014-07-03 |
Thick on-chip high-performance wiring structures Grant 8,765,595 - Cooney, III , et al. July 1, 2 | 2014-07-01 |
Thick On-Chip High-Performance Wiring Structures App 20140167219 - Cooney, III; Edward C. ;   et al. | 2014-06-19 |
Tapered Via And Mim Capacitor App 20140151851 - DUNN; JAMES STUART ;   et al. | 2014-06-05 |
Methods For Selective Reverse Mask Planarization And Interconnect Structures Formed Thereby App 20140131893 - He; Zhong-Xiang ;   et al. | 2014-05-15 |
Semiconductor Structure Incorporating A Contact Sidewall Spacer With A Self-aligned Airgap And A Method Of Forming The Semiconductor Structure App 20140117420 - Chen; Fen ;   et al. | 2014-05-01 |
Methods for selective reverse mask planarization and interconnect structures formed thereby Grant 8,710,661 - He , et al. April 29, 2 | 2014-04-29 |
Intralevel conductive light shield Grant 8,709,855 - Gambino , et al. April 29, 2 | 2014-04-29 |
Back-end-of-line Metal-oxide-semiconductor Varactors App 20140097434 - Ellis-Monaghan; John J. ;   et al. | 2014-04-10 |
Semiconductor structure having vias and high density capacitors Grant 8,674,423 - Collins , et al. March 18, 2 | 2014-03-18 |
Isolated wire structures with reduced stress, methods of manufacturing and design structures Grant 8,659,173 - Gambino , et al. February 25, 2 | 2014-02-25 |
Tapered via and MIM capacitor Grant 8,649,153 - Dunn , et al. February 11, 2 | 2014-02-11 |
Top Corner Rounding Of Damascene Wire For Insulator Crack Suppression App 20140035169 - Chrisman; Gregory S. ;   et al. | 2014-02-06 |
Structure and design structure for high-Q value inductor and method of manufacturing the same Grant 8,645,898 - Ding , et al. February 4, 2 | 2014-02-04 |
Integrated Circuit Including Sensor Structure, Related Method And Design Structure App 20140021469 - Cooney, III; Edward C. ;   et al. | 2014-01-23 |
Local Wiring For A Bipolar Junction Transistor Including A Self-aligned Emitter Region App 20140021587 - Harame; David L. ;   et al. | 2014-01-23 |
Semiconductor switching circuit employing quantum dot structures Grant 8,624,318 - He , et al. January 7, 2 | 2014-01-07 |
Method For Forming Thin Film Resistor And Terminal Bond Pad Simultaneously App 20140001599 - CHEN; Fen ;   et al. | 2014-01-02 |
Structure and method for reducing vertical crack propagation Grant 8,604,618 - Cooney, III , et al. December 10, 2 | 2013-12-10 |
Integrated Circuit Including Wire Structure, Related Method And Design Structure App 20130320536 - Cooney, III; Edward C. ;   et al. | 2013-12-05 |
On chip shielding structure for integrated circuits or devices on a substrate and method of shielding Grant 8,589,832 - Ding , et al. November 19, 2 | 2013-11-19 |
Top corner rounding of damascene wire for insulator crack suppression Grant 8,575,022 - Chrisman , et al. November 5, 2 | 2013-11-05 |
Method for forming thin film resistor and terminal bond pad simultaneously Grant 8,563,336 - Chen , et al. October 22, 2 | 2013-10-22 |
Structure for on chip shielding structure for integrated circuits or devices on a substrate Grant 8,566,759 - Ding , et al. October 22, 2 | 2013-10-22 |
Semiconductor Structures And Methods Of Manufacture App 20130269974 - DAUBENSPECK; Timothy H. ;   et al. | 2013-10-17 |
Method of electrolytic plating and semiconductor device fabrication Grant 8,518,817 - Anderson , et al. August 27, 2 | 2013-08-27 |
Integrated millimeter wave antenna and transceiver on a substrate Grant 8,519,892 - Ding , et al. August 27, 2 | 2013-08-27 |
Inductors And Wiring Structures Fabricated With Limited Wiring Material App 20130200521 - Ding; Hanyi ;   et al. | 2013-08-08 |
Semiconductor structures and methods of manufacture Grant 8,497,203 - Chen , et al. July 30, 2 | 2013-07-30 |
Heterojunction Bipolar Transistor With Reduced Sub-collector Length, Method Of Manufacture And Design Structure App 20130187198 - Camillo-Castillo; Renata ;   et al. | 2013-07-25 |
Thick On-Chip High-Performance Wiring Structures App 20130175073 - Cooney, III; Edward C. ;   et al. | 2013-07-11 |
Structure And Method For Reducing Vertical Crack Propagation App 20130171817 - Cooney, III; Edward C. ;   et al. | 2013-07-04 |
Top Corner Rounding Of Damascene Wire For Insulator Crack Suppression App 20130133919 - Chrisman; Gregory S. ;   et al. | 2013-05-30 |
Structure Of Very High Insertion Loss Of The Substrate Noise Decoupling App 20130134566 - DING; Hanyi ;   et al. | 2013-05-30 |
Semiconductor switching device employing a quantum dot structure Grant 8,445,967 - He , et al. May 21, 2 | 2013-05-21 |
Process for single and multiple level metal-insulator-metal integration with a single mask Grant 8,435,864 - Chinthakindi , et al. May 7, 2 | 2013-05-07 |
Structure of very high insertion loss of the substrate noise decoupling Grant 8,421,183 - Ding , et al. April 16, 2 | 2013-04-16 |
Method Of Manufacturing Complimentary Metal-insulator-metal (mim) Capacitors App 20130081240 - DUNN; James S. ;   et al. | 2013-04-04 |
Structure And Method For Reducing Vertical Crack Propagation App 20130075913 - Cooney, III; Edward C. ;   et al. | 2013-03-28 |
Semiconductor structure including a high performance fet and a high voltage fet on an SOI substrate Grant 8,399,927 - Ding , et al. March 19, 2 | 2013-03-19 |
MIM capacitor and method of making same Grant 8,390,038 - Coolbaugh , et al. March 5, 2 | 2013-03-05 |
Method of manufacturing complimentary metal-insulator-metal (MIM) capacitors Grant 8,375,539 - Dunn , et al. February 19, 2 | 2013-02-19 |
Interdigitated vertical parallel capacitor Grant 8,378,450 - Booth, Jr. , et al. February 19, 2 | 2013-02-19 |
Method and system for assessing reliability of integrated circuit Grant 8,362,794 - Chen , et al. January 29, 2 | 2013-01-29 |
On-chip Transmission Line Structures With Balanced Phase Delay App 20120326798 - Ding; Hanyi ;   et al. | 2012-12-27 |
Package integrated soft magnetic film for improvement in on-chip inductor performance Grant 8,338,920 - Cotte , et al. December 25, 2 | 2012-12-25 |
Corner-rounded Structures And Methods Of Manufacture App 20120319237 - COONEY, III; Edward C. ;   et al. | 2012-12-20 |
Interconnect Structures And Design Structures For A Radiofrequency Integrated Circuit App 20120292741 - Dalton; Timothy ;   et al. | 2012-11-22 |
Tapered Via And Mim Capacitor App 20120275080 - DUNN; JAMES S. ;   et al. | 2012-11-01 |
Interconnect structures, methods for fabricating interconnect structures, and design structures for a radiofrequency integrated circuit Grant 8,298,902 - Dalton , et al. October 30, 2 | 2012-10-30 |
Interlevel conductive light shield Grant 8,299,475 - Gambino , et al. October 30, 2 | 2012-10-30 |
Structure And Design Structure For High-q Value Inductor And Method Of Manufacturing The Same App 20120267794 - DING; Hanyi ;   et al. | 2012-10-25 |
Integrated Millimeter Wave Antenna And Transceiver On A Substrate App 20120266116 - Ding; Hanyi ;   et al. | 2012-10-18 |
Semiconductor Switching Device Employing A Quantum Dot Structure App 20120261745 - He; Zhong-Xiang ;   et al. | 2012-10-18 |
Structure for an on-chip high frequency electro-static discharge device Grant 8,279,572 - Ding , et al. October 2, 2 | 2012-10-02 |
Method For Managing Circuit Reliability App 20120218030 - Chen; Fen ;   et al. | 2012-08-30 |
Semiconductor Switching Circuit Employing Quantum Dot Structures App 20120205627 - He; Zhong-Xiang ;   et al. | 2012-08-16 |
Semiconductor switching device employing a quantum dot structure Grant 8,242,542 - He , et al. August 14, 2 | 2012-08-14 |
Method for managing circuit reliability Grant 8,237,463 - Chen , et al. August 7, 2 | 2012-08-07 |
Integrated millimeter wave antenna and transceiver on a substrate Grant 8,232,920 - Ding , et al. July 31, 2 | 2012-07-31 |
Structure and design structure for high-Q value inductor and method of manufacturing the same Grant 8,232,173 - Ding , et al. July 31, 2 | 2012-07-31 |
Complimentary Metal-insulator-metal (mim) Capacitors And Method Of Manufacture App 20120187536 - DUNN; James S. ;   et al. | 2012-07-26 |
Semiconductor switching circuit employing quantum dot structures Grant 8,227,300 - He , et al. July 24, 2 | 2012-07-24 |
Method and structure for creation of a metal insulator metal capacitor Grant 8,227,849 - Eshun , et al. July 24, 2 | 2012-07-24 |
Process For Single And Multiple Level Metal-insulator-metal Integration With A Single Mask App 20120184081 - CHINTHAKINDI; Anil K. ;   et al. | 2012-07-19 |
Interlevel Conductive Light Shield App 20120161299 - Gambino; Jeffrey P. ;   et al. | 2012-06-28 |
Process for single and multiple level metal-insulator-metal integration with a single mask Grant 8,207,568 - Chinthakindi , et al. June 26, 2 | 2012-06-26 |
Complimentary metal-insulator-metal (MIM) capacitors and method of manufacture Grant 8,191,217 - Dunn , et al. June 5, 2 | 2012-06-05 |
Semiconductor Structure Including A High Performance Fet And A High Voltage Fet On An Soi Substrate App 20120132992 - Ding; Hanyi ;   et al. | 2012-05-31 |
Structure And Design Structure For High-q Value Inductor And Method Of Manufacturing The Same App 20120104546 - DING; Hanyi ;   et al. | 2012-05-03 |
Integrated circuit structure incorporating an inductor, an associated design method and an associated design system Grant 8,171,435 - He , et al. May 1, 2 | 2012-05-01 |
Interlevel conductive light shield Grant 8,158,988 - Gambino , et al. April 17, 2 | 2012-04-17 |
Metal gate integration structure and method including metal fuse, anti-fuse and/or resistor Grant 8,159,040 - Coolbaugh , et al. April 17, 2 | 2012-04-17 |
Integrated Circuit And Interconnect, And Method Of Fabricating Same App 20120086101 - DeMuynck; David A. ;   et al. | 2012-04-12 |
Method Of Electrolytic Plating And Semiconductor Device Fabrication App 20120070979 - Anderson; Felix P. ;   et al. | 2012-03-22 |
Structure, Design Structure And Method Of Manufacturing A Structure Having Vias And High Density Capacitors App 20120061801 - COLLINS; David S. ;   et al. | 2012-03-15 |
Method of forming a metal silicide layer, devices incorporating metal silicide layers and design structures for the devices Grant 8,129,844 - Anderson , et al. March 6, 2 | 2012-03-06 |
Semiconductor structure including a high performance FET and a high voltage FET on a SOI substrate Grant 8,120,110 - Ding , et al. February 21, 2 | 2012-02-21 |
Semiconductor Structures And Methods Of Manufacture App 20120038037 - Chen; Fen ;   et al. | 2012-02-16 |
Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors Grant 8,101,494 - Collins , et al. January 24, 2 | 2012-01-24 |
Integrated BEOL thin film resistor Grant 8,093,679 - Chinthakindi , et al. January 10, 2 | 2012-01-10 |
Planar Cavity Mems And Related Structures, Methods Of Manufacture And Design Structures App 20110315527 - DANG; Dinh ;   et al. | 2011-12-29 |
Planar Cavity Mems And Related Structures, Methods Of Manufacture And Design Structures App 20110316099 - DUNBAR, III; George A. ;   et al. | 2011-12-29 |
Electromigration resistant aluminum-based metal interconnect structure Grant 8,084,864 - Chapple-Sokol , et al. December 27, 2 | 2011-12-27 |
Passive components in the back end of integrated circuits Grant 8,039,354 - Chinthakindi , et al. October 18, 2 | 2011-10-18 |
Electromigration Resistant Aluminum-based Metal Interconnect Structure App 20110221064 - Chapple-Sokol; Jonathan D. ;   et al. | 2011-09-15 |
Method of forming a high performance fet and a high voltage fet on a SOI substrate Grant 8,012,814 - Ding , et al. September 6, 2 | 2011-09-06 |
Electromigration resistant aluminum-based metal interconnect structure Grant 8,003,536 - Chapple-Sokol , et al. August 23, 2 | 2011-08-23 |
Structure Of Very High Insertion Loss Of The Substrate Noise Decoupling App 20110132652 - Ding; Hanyi ;   et al. | 2011-06-09 |
Integrated BEOL Thin Film Resistor App 20110127635 - Chinthakindi; Anil K. ;   et al. | 2011-06-02 |
Integrated millimeter wave antenna and transceiver on a substrate Grant 7,943,404 - Ding , et al. May 17, 2 | 2011-05-17 |
Structure of very high insertion loss of the substrate noise decoupling Grant 7,923,808 - Ding , et al. April 12, 2 | 2011-04-12 |
Method and structure for ballast resistor Grant 7,919,830 - Coolbaugh , et al. April 5, 2 | 2011-04-05 |
Method of integration of a MIM capacitor with a lower plate of metal gate material formed on an STI region or a silicide region formed in or on the surface of a doped well with a high K dielectric material Grant 7,915,134 - Chinthakindi , et al. March 29, 2 | 2011-03-29 |
Method for forming an on-chip high frequency electro-static discharge device Grant 7,915,158 - Ding , et al. March 29, 2 | 2011-03-29 |
Structures including means for lateral current carrying capability improvement in semiconductor devices Grant 7,904,868 - Feilchenfeld , et al. March 8, 2 | 2011-03-08 |
Integrated BEOL thin film resistor Grant 7,902,629 - Chinthakindi , et al. March 8, 2 | 2011-03-08 |
Interdigitated Vertical Parallel Capacitor App 20110049674 - Booth, Jr.; Roger A. ;   et al. | 2011-03-03 |
Complimentary Metal-insulator-metal (mim) Capacitors And Method Of Manufacture App 20110032659 - Dunn; James S. ;   et al. | 2011-02-10 |
Complimentary Metal-insulator-metal (mim) Capacitors And Method Of Manufacture App 20110032660 - Dunn; James S. ;   et al. | 2011-02-10 |
Method And System For Assessing Reliability Of Integrated Circuit App 20110018575 - Chen; Fen ;   et al. | 2011-01-27 |
Vertical parallel plate capacitor structures Grant 7,876,547 - Gebreselasie , et al. January 25, 2 | 2011-01-25 |
Method of forming a metal silicide layer, devices incorporating metal silicide layers and design structures for the devices Grant 7,851,353 - Anderson , et al. December 14, 2 | 2010-12-14 |
Passive Components in the Back End of Integrated Circuits App 20100297825 - Chinthakindi; Anil K. ;   et al. | 2010-11-25 |
Terminal pad structures and methods of fabricating same Grant 7,829,452 - Coolbaugh , et al. November 9, 2 | 2010-11-09 |
Electromigration Resistant Aluminum-based Metal Interconnect Structure App 20100237503 - Chapple-Sokol; Jonathan D. ;   et al. | 2010-09-23 |
Interconnect Structures, Methods for Fabricating Interconnect Structures, and Design Structures for a Radiofrequency Integrated Circuit App 20100237467 - Dalton; Timothy ;   et al. | 2010-09-23 |
Semiconductor Switching Circuit Employing Quantum Dot Structures App 20100237324 - He; Zhong-Xiang ;   et al. | 2010-09-23 |
Semiconductor Switching Device Employing A Quantum Dot Structure App 20100213547 - He; Zhong-Xiang ;   et al. | 2010-08-26 |
CMOS imager array with recessed dielectric Grant 7,781,781 - Adkisson , et al. August 24, 2 | 2010-08-24 |
Design structure for an on-chip high frequency electro-static discharge device Grant 7,768,762 - Ding , et al. August 3, 2 | 2010-08-03 |
Passive components in the back end of integrated circuits Grant 7,768,055 - Chinthakindi , et al. August 3, 2 | 2010-08-03 |
Post last wiring level inductor using patterned plate process Grant 7,763,954 - Chinthakindi , et al. July 27, 2 | 2010-07-27 |
Method for forming an on-chip high frequency electro-static discharge device Grant 7,759,243 - Ding , et al. July 20, 2 | 2010-07-20 |
Optimum padset for wire bonding RF technologies with high-Q inductors Grant 7,754,574 - Coolbaugh , et al. July 13, 2 | 2010-07-13 |
Integrated Circuit Structure Incorporating An Inductor, An Associated Design Method And An Associated Design System App 20100175035 - He; Zhong-Xiang ;   et al. | 2010-07-08 |
Integrated circuit structure incorporating an inductor, a conductive sheet and a protection circuit Grant 7,750,408 - He , et al. July 6, 2 | 2010-07-06 |
Method for Forming Thin Film Resistor and Terminal Bond Pad Simultaneously App 20100155893 - CHEN; Fen ;   et al. | 2010-06-24 |
Post last wiring level inductor using patterned plate process Grant 7,741,698 - Chinthakindi , et al. June 22, 2 | 2010-06-22 |
Method And Structure For Creation Of A Metal Insulator Metal Capacitor App 20100149723 - ESHUN; EBENEZER E. ;   et al. | 2010-06-17 |
Post last wiring level inductor using patterned plate process Grant 7,732,295 - Chinthakindi , et al. June 8, 2 | 2010-06-08 |
Post last wiring level inductor using patterned plate process Grant 7,732,294 - Chinthakindi , et al. June 8, 2 | 2010-06-08 |
Method and structure for creation of a metal insulator metal capacitor Grant 7,728,372 - Eshun , et al. June 1, 2 | 2010-06-01 |
Methods For Selective Reverse Mask Planarization And Interconnect Structures Formed Thereby App 20100127395 - He; Zhong-Xiang ;   et al. | 2010-05-27 |
Bipolar and CMOS integration with reduced contact height Grant 7,701,015 - He , et al. April 20, 2 | 2010-04-20 |
Increased power line noise immunity in IC using capacitor structure in fill area Grant 7,689,961 - Braun , et al. March 30, 2 | 2010-03-30 |
Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme Grant 7,687,867 - Coolbaugh , et al. March 30, 2 | 2010-03-30 |
Structure, Design Structure and Method of Manufacturing a Structure Having VIAS and High Density Capacitors App 20100041203 - Collins; David S. ;   et al. | 2010-02-18 |
Semiconductor Structure Including A High Performance Fet And A High Voltage Fet On A Soi Substrate App 20100032761 - Ding; Hanyi ;   et al. | 2010-02-11 |
Integrated Millimeter Wave Antenna And Transceiver On A Substrate App 20100033395 - Ding; Hanyi ;   et al. | 2010-02-11 |
Integrated Millimeter Wave Antenna And Transceiver On A Substrate App 20100035370 - Ding; Hanyi ;   et al. | 2010-02-11 |
Method Of Forming A High Performance Fet And A High Voltage Fet On A Soi Substrate App 20100035390 - Ding; Hanyi ;   et al. | 2010-02-11 |
Integrated parallel plate capacitors Grant 7,645,675 - Coolbaugh , et al. January 12, 2 | 2010-01-12 |
Design Structure For An On-chip High Frequency Electro-static Discharge Device App 20090316314 - Ding; Hanyi ;   et al. | 2009-12-24 |
Design Structure For An On-chip High Frequency Electro-static Discharge Device App 20090316313 - Ding; Hanyi ;   et al. | 2009-12-24 |
Method For Forming An On-chip High Frequency Electro-static Discharge Device App 20090317970 - Ding; Hanyi ;   et al. | 2009-12-24 |
Method Of Forming A Metal Silicide Layer, Devices Incorporating Metal Silicide Layers And Design Structures For The Devices App 20090317973 - Anderson; Felix Patrick ;   et al. | 2009-12-24 |
Method For Forming An 0n-chip High Frequency Electro-static Discharge Device App 20090317975 - Ding; Hanyi ;   et al. | 2009-12-24 |
Method Of Forming A Metal Silicide Layer, Devices Incorporating Metal Silicide Layers And Design Structures For The Devices App 20090317972 - Anderson; Felix Patrick ;   et al. | 2009-12-24 |
Interlevel Conductive Light Shield App 20090303366 - Gambino; Jeffrey P. ;   et al. | 2009-12-10 |
Intralevel Conductive Light Shield App 20090305499 - Gambino; Jeffrey P. ;   et al. | 2009-12-10 |
Metal Gate Integration Structure And Method Including Metal Fuse, Anti-fuse And/or Resistor App 20090283840 - Coolbaugh; Douglas D. ;   et al. | 2009-11-19 |
Design Structure For Metal-insulator-metal Capacitor Using Via As Top Plate And Method For Forming App 20090251848 - Anderson; Frederick G. ;   et al. | 2009-10-08 |
Method And Structure For Ballast Resistor App 20090253239 - Coolbaugh; Douglas D. ;   et al. | 2009-10-08 |
Dielectric layers for metal lines in semiconductor chips Grant 7,598,166 - He , et al. October 6, 2 | 2009-10-06 |
Tungsten Liner For Aluminum-based Electromigration Resistant Interconnect Structure App 20090230555 - Chapple-Sokol; Jonathan D. ;   et al. | 2009-09-17 |
Post last wiring level inductor using patterned plate process Grant 7,573,117 - Chinthakindi , et al. August 11, 2 | 2009-08-11 |
Vertical LC tank device Grant 7,564,319 - Ding , et al. July 21, 2 | 2009-07-21 |
Terminal Pad Structures And Methods Of Fabricating Same App 20090155993 - Coolbaugh; Douglas D. ;   et al. | 2009-06-18 |
Structure Of Very High Insertion Loss Of The Substrate Noise Decoupling App 20090127652 - Ding; Hanyi ;   et al. | 2009-05-21 |
Design Structure Incorporating Vertical Parallel Plate Capacitor Structures App 20090102016 - Gebreselasie; Ephrem G. ;   et al. | 2009-04-23 |
Design Structures Including Means For Lateral Current Carrying Capability Improvement In Semiconductor Devices App 20090106726 - Feilchenfeld; Natalie Barbara ;   et al. | 2009-04-23 |
Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask Grant 7,511,940 - Coolbaugh , et al. March 31, 2 | 2009-03-31 |
Integrated Beol Thin Film Resistor App 20090065898 - Chinthakindi; Anil K. ;   et al. | 2009-03-12 |
On Chip Shielding Structure For Integrated Circuits Or Devices On A Substrate And Method Of Shielding App 20090052153 - Ding; Hanyi ;   et al. | 2009-02-26 |
Design Structure For On Chip Shielding Structure For Integrated Circuits Or Devices On A Substrate App 20090055790 - DING; Hanyi ;   et al. | 2009-02-26 |
Terminal pad structures and methods of fabricating same Grant 7,494,912 - Coolbaugh , et al. February 24, 2 | 2009-02-24 |
Bipolar And Cmos Integration With Reduced Contact Height App 20090039522 - He; Zhong-Xiang ;   et al. | 2009-02-12 |
MIM capacitor and method of making same Grant 7,488,643 - Coolbaugh , et al. February 10, 2 | 2009-02-10 |
Integrated BEOL thin film resistor Grant 7,485,540 - Chinthakindi , et al. February 3, 2 | 2009-02-03 |
Semiconductor-insulator-silicide capacitor Grant 7,479,439 - Coolbaugh , et al. January 20, 2 | 2009-01-20 |
Method of Integration of a MIM Capacitor with a Lower Plate of Metal Gate Material Formed on an STI Region or a Silicide Region Formed in or on the Surface of a Doped Well with a High K Dielectric Material App 20090004809 - Chinthakindi; Anil Kumar ;   et al. | 2009-01-01 |
Lateral Current Carrying Capability Improvement In Semiconductor Devices App 20080308940 - Feilchenfeld; Natalie Barbara ;   et al. | 2008-12-18 |
Vertical Parallel Plate Capacitor Structures App 20080297975 - Gebreselasie; Ephrem G. ;   et al. | 2008-12-04 |
Post Last Wiring Level Inductor Using Patterned Plate Process App 20080293233 - Chinthakindi; Anil Kumar ;   et al. | 2008-11-27 |
Post Last Wiring Level Inductor Using Patterned Plate Process App 20080293210 - Chinthakindi; Anil Kumar ;   et al. | 2008-11-27 |
Post Last Wiring Level Inductor Using Patterned Plate Process App 20080290458 - Chinthakindi; Anil Kumar ;   et al. | 2008-11-27 |
Methods for lateral current carrying capability improvement in semiconductor devices Grant 7,453,151 - Feilchenfeld , et al. November 18, 2 | 2008-11-18 |
Post Last Wiring Level Inductor Using Patterned Plate Process App 20080277759 - Chinthakindi; Anil Kumar ;   et al. | 2008-11-13 |
Package Integrated Soft Magnetic Film for Improvement In On-Chip Inductor Performance App 20080277769 - Cotte; John Michael ;   et al. | 2008-11-13 |
Post Last Wiring Level Inductor Using Patterned Plate Process App 20080272458 - Chinthakindi; Anil Kumar ;   et al. | 2008-11-06 |
Semiconductor-insulator-silicide Capacitor App 20080258197 - Coolbaugh; Douglas D. ;   et al. | 2008-10-23 |
Integrated Circuit Stucture Incorporating An Inductor, An Associated Design Method And An Associated Design System App 20080237789 - He; Zhong-Xiang ;   et al. | 2008-10-02 |
Mim Capacitor And Method Of Making Same App 20080232025 - Coolbaugh; Douglas Duane ;   et al. | 2008-09-25 |
Post last wiring level inductor using patterned plate process Grant 7,410,894 - Chinthakindi , et al. August 12, 2 | 2008-08-12 |
Integrated Circuit (ic) Chip With One Or More Vertical Plate Capacitors And Method Of Making The Capacitors App 20080173981 - Chinthakindi; Anil K. ;   et al. | 2008-07-24 |
Method for symmetric capacitor formation Grant 7,402,890 - Collins , et al. July 22, 2 | 2008-07-22 |
Method for high performance inductor fabrication using a triple damascene process with copper BEOL Grant 7,399,696 - Coolbaugh , et al. July 15, 2 | 2008-07-15 |
Metal-oxide-semiconductor (mos) Varactors And Methods Of Forming Mos Varactors App 20080149983 - Rassel; Robert Mark ;   et al. | 2008-06-26 |
Symmetric Capacitor Structure App 20080142861 - Collins; David S. ;   et al. | 2008-06-19 |
Optimum Padset For Wire Bonding Rf Technologies With High-q Inductors App 20080132026 - Coolbaugh; Douglas D. ;   et al. | 2008-06-05 |
Integrated thin-film resistor with direct contact Grant 7,382,055 - Coker , et al. June 3, 2 | 2008-06-03 |
Methods For Lateral Current Carrying Capability Improvement In Semiconductor Devices App 20080122096 - Feilchenfeld; Natalie Barbara ;   et al. | 2008-05-29 |
Cmos Imager Array With Recessed Dielectric App 20080116537 - Adkisson; James W. ;   et al. | 2008-05-22 |
Terminal pad structures and methods of fabricating same Grant 7,361,993 - Coolbaugh , et al. April 22, 2 | 2008-04-22 |
Integration of a MIM capacitor with a plate formed in a well region and with a high-k dielectric Grant 7,361,950 - Chinthakindi , et al. April 22, 2 | 2008-04-22 |
Terminal Pad Structures And Methods Of Fabricating Same App 20080090407 - Coolbaugh; Douglas D. ;   et al. | 2008-04-17 |
Dielectric layers for metal lines in semiconductor chips App 20080061403 - He; Zhong-Xiang ;   et al. | 2008-03-13 |
Non-continuous encapsulation layer for MIM capacitor Grant 7,326,987 - Abadeer , et al. February 5, 2 | 2008-02-05 |
Vertical LC tank device Grant 7,323,948 - Ding , et al. January 29, 2 | 2008-01-29 |
Formation Of Metal-insulator-metal Capacitor Simultaneously With Aluminum Metal Wiring Level Using A Hardmask App 20080019077 - Coolbaugh; Douglas D. ;   et al. | 2008-01-24 |
Vertical Lc Tank Device App 20080012091 - Ding; Hanyi ;   et al. | 2008-01-17 |
Mim Capacitor And Method Of Making Same App 20070296085 - Coolbaugh; Douglas Duane ;   et al. | 2007-12-27 |
Inexpensive Method Of Fabricating A Higher Performance Capacitance Density Mimcap Integrable Into A Copper Interconnect Scheme App 20070290359 - Coolbaugh; Douglas D. ;   et al. | 2007-12-20 |
Integrated Thin-film Resistor With Direct Contact App 20070290272 - Coker; Eric M. ;   et al. | 2007-12-20 |
Method And Structure For Symmetric Capacitor Formation App 20070278618 - Collins; David S. ;   et al. | 2007-12-06 |
Integrated thin-film resistor with direct contact Grant 7,303,972 - Coker , et al. December 4, 2 | 2007-12-04 |
Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask Grant 7,301,752 - Coolbaugh , et al. November 27, 2 | 2007-11-27 |
Method And Structure For Creation Of A Metal Insulator Metal Capacitor App 20070262416 - Eshun; Ebenezer E. ;   et al. | 2007-11-15 |
On-chip signal transformer for ground noise isolation Grant 7,288,417 - Ding , et al. October 30, 2 | 2007-10-30 |
Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme Grant 7,282,404 - Coolbaugh , et al. October 16, 2 | 2007-10-16 |
On-chip inductor with magnetic core Grant 7,271,693 - Ding , et al. September 18, 2 | 2007-09-18 |
Integrated Parallel Plate Capacitors App 20070190760 - Coolbaugh; Douglas D. ;   et al. | 2007-08-16 |
Integrated Thin-film Resistor With Direct Contact App 20070166909 - Coker; Eric M. ;   et al. | 2007-07-19 |
Low cost bonding pad and method of fabricating same Grant 7,245,025 - Brigante , et al. July 17, 2 | 2007-07-17 |
One-mask High-k Metal-insulator-metal Capacitor Integration In Copper Back-end-of-line Processing App 20070158714 - Eshun; Ebenezer E. ;   et al. | 2007-07-12 |
Passive Components In The Back End Of Integrated Circuits App 20070123015 - Chinthakindi; Anil K. ;   et al. | 2007-05-31 |
Low Cost Bonding Pad And Method Of Fabricating Same App 20070120216 - Brigante; Jeffrey Alan ;   et al. | 2007-05-31 |
Process For Single And Multiple Level Metal-insulator-metal Integration With A Single Mask App 20070065966 - Chinthakindi; Anil K. ;   et al. | 2007-03-22 |
Integration Of A Mim Capacitor Over A Metal Gate Or Silicide With High-k Dielectric Materials App 20070057343 - Chinthakindi; Anil Kumar ;   et al. | 2007-03-15 |
Vertical Lc Tank Device App 20070052062 - Ding; Hanyi ;   et al. | 2007-03-08 |
Integrated Beol Thin Film Resistor App 20070040239 - Chinthakindi; Anil K. ;   et al. | 2007-02-22 |
Increased Power Line Noise Immunity In Ic Using Capacitor Structure In Fill Area App 20070038968 - Braun; Florian ;   et al. | 2007-02-15 |
Method For High Performance Inductor Fabrication Using A Triple Damascene Process With Copper Beol App 20070032030 - Coolbaugh; Douglas D. ;   et al. | 2007-02-08 |
Post Last Wiring Level Inductor Using Patterned Plate Process App 20070026659 - Chinthakindi; Anil Kumar ;   et al. | 2007-02-01 |
Optimum padset for wire bonding RF technologies with high-Q inductors Grant 7,170,181 - Coolbaugh , et al. January 30, 2 | 2007-01-30 |
Terminal Pad Structures And Methods Of Fabricating Same App 20060249848 - Coolbaugh; Douglas D. ;   et al. | 2006-11-09 |
Tri-metal and dual-metal stacked inductors Grant 7,129,561 - Coolbaugh , et al. October 31, 2 | 2006-10-31 |
On-chip inductor with magnetic core App 20060186983 - Ding; Hanyi ;   et al. | 2006-08-24 |
Multiple Layer Structure For Substrate Noise Isolation App 20060163688 - Ding; Hanyi ;   et al. | 2006-07-27 |
On-chip Signal Transformer For Ground Noise Isolation App 20060148106 - Ding; Hanyi ;   et al. | 2006-07-06 |
Multiple layer structure for substrate noise isolation Grant 7,071,530 - Ding , et al. July 4, 2 | 2006-07-04 |
On-chip inductor with magnetic core Grant 7,061,359 - Ding , et al. June 13, 2 | 2006-06-13 |
Inexpensive Method Of Fabricating A Higher Performance Capacitance Density Mimcap Integrable Into A Copper Interconnect Scheme App 20050274987 - Coolbaugh, Douglas D. ;   et al. | 2005-12-15 |
Formation Of Metal-insulator-metal Capacitor Simultaneously With Aluminum Metal Wiring Level Using A Hardmask App 20050272219 - Coolbaugh, Douglas D. ;   et al. | 2005-12-08 |
Non-continuous Encapsulation Layer For Mim Capacitor App 20050189615 - Abadeer, Wagdi W. ;   et al. | 2005-09-01 |
Metal-insulator-metal capacitor and method of fabrication App 20050156278 - Coolbaugh, Douglas D. ;   et al. | 2005-07-21 |
Non-Continuous encapsulation layer for MIM capacitor Grant 6,913,965 - Abadeer , et al. July 5, 2 | 2005-07-05 |
Optimum Padset For Wire Bonding Rf Technologies With High-q Inductors App 20050104188 - Coolbaugh, Douglas D. ;   et al. | 2005-05-19 |
Tri-metal And Dual-metal Stacked Inductors App 20050104157 - Coolbaugh, Douglas D. ;   et al. | 2005-05-19 |
Metal-insulator-metal capacitor and method of fabrication Grant 6,876,028 - Coolbaugh , et al. April 5, 2 | 2005-04-05 |
Metal-insulator-metal Capacitor And Method Of Fabrication App 20050067701 - Coolbaugh, Douglas D. ;   et al. | 2005-03-31 |
On-chip Inductor With Magnetic Core App 20040263310 - Ding, Hanyi ;   et al. | 2004-12-30 |
Non-continuous Encapsulation Layer For Mim Capacitor App 20040251514 - Abadeer, Wagdi William ;   et al. | 2004-12-16 |