Hatcher, Jr.; Merrill Albert

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hatcher, Jr.; Merrill Albert.The latest application filed is for "rf devices with enhanced performance and methods of forming the same".

Company Profile

39.22.18

Hatcher, Jr.; Merrill Albert - Greensboro NC
- Greensboro NC US
Hatcher, Jr.; Merrill Albert - Greenboro NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
RF devices with enhanced performance and methods of forming the same Grant 11,387,157 - Costa , et al. July 12, 2	2022-07-12
RF devices with enhanced performance and methods of forming the same Grant 11,355,405 - Costa , et al. June 7, 2	2022-06-07
RF devices with enhanced performance and methods of forming the same Grant 11,322,420 - Costa , et al. May 3, 2	2022-05-03
RF devices with enhanced performance and methods of forming the same Grant 11,257,731 - Costa , et al. February 22, 2	2022-02-22
Microelectronics package with vertically stacked dies Grant 11,063,021 - Costa , et al. July 13, 2	2021-07-13
Microelectronics package with vertically stacked dies Grant 11,011,498 - Costa , et al. May 18, 2	2021-05-18
Microelectronics package with vertically stacked dies Grant 10,964,672 - Costa , et al. March 30, 2	2021-03-30
Wafer-level package with enhanced performance and manufacturing method thereof Grant 10,882,740 - Costa , et al. January 5, 2	2021-01-05
Wafer-level package with enhanced performance Grant 10,804,179 - Costa , et al. October 13, 2	2020-10-13
Microelectronics package with vertically stacked dies Grant 10,804,246 - Costa , et al. October 13, 2	2020-10-13
Wafer-level package with enhanced performance Grant 10,773,952 - Costa , et al. Sept	2020-09-15
Wafer-level packaging for enhanced performance Grant 10,755,992 - Costa , et al. A	2020-08-25
Rf Devices With Enhanced Performance And Methods Of Forming The Same App 20200235024 - Costa; Julio C. ; et al.	2020-07-23
Rf Devices With Enhanced Performance And Methods Of Forming The Same App 20200234978 - Costa; Julio C. ; et al.	2020-07-23
Wafer-level package with enhanced performance Grant 10676348 -	2020-06-09
Wafer-level package with enhanced performance Grant 10679918 -	2020-06-09
Wafer-level packaging for enhanced performance Grant 10658259 -	2020-05-19
Wafer-level package with enhanced performance Grant 10636720 -	2020-04-28
Wafer-level packaging for enhanced performance Grant 10622271 -	2020-04-14
Microelectronics package with vertically stacked dies Grant 10615147 -	2020-04-07
Wafer-level Package With Enhanced Performance App 20200102217 - Costa; Julio C. ; et al.	2020-04-02
Wafer-level package with enhanced performance Grant 10600711 -	2020-03-24
Wafer-level package with enhanced performance Grant 10589993 -	2020-03-17
Wafer-level packaging for enhanced performance Grant 10586747 -	2020-03-10
Wafer-level package with enhanced performance Grant 10549988 -	2020-02-04
Microelectronics package with vertically stacked dies Grant 10553564 -	2020-02-04
Wafer-level package with enhanced performance Grant 10529639 -	2020-01-07
Microelectronics Package With Vertically Stacked Dies App 20190378819 - Costa; Julio C. ; et al.	2019-12-12
Microelectronics Package With Vertically Stacked Dies App 20190378821 - Costa; Julio C. ; et al.	2019-12-12
Wafer-level package with enhanced performance Grant 10,486,963 - Hatcher, Jr. , et al. Nov	2019-11-26
Wafer-level package with enhanced performance Grant 10490476 -	2019-11-26
Wafer-level packaging for enhanced performance Grant 10,490,471 - Costa , et al. Nov	2019-11-26
Wafer-level packaging for enhanced performance Grant 10453765 -	2019-10-22
Wafer-level package with enhanced performance Grant 10442684 -	2019-10-15
Wafer-level packaging for enhanced performance Grant 10418297 -	2019-09-17
Wafer-level package with enhanced performance Grant 10377627 -	2019-08-13
Thermally enhanced semiconductor package with thermal additive and process for making the same Grant 10,262,915 - Costa , et al.	2019-04-16
Thermally enhanced semiconductor package with thermal additive and process for making the same Grant 10229860 -	2019-03-12
Wafer-level package with enhanced performance Grant 10227231 -	2019-03-12
Wafer-level Package With Enhanced Performance App 20190057922 - Costa; Julio C. ; et al.	2019-02-21
Wafer-level package with enhanced performance Grant 10196260 -	2019-02-05
Thermally enhanced semiconductor package with thermal additive and process for making the same Grant 10192803 -	2019-01-29
Wafer-level Packaging For Enhanced Performance App 20190013254 - Costa; Julio C. ; et al.	2019-01-10
Wafer-level Packaging For Enhanced Performance App 20190013255 - Costa; Julio C. ; et al.	2019-01-10
Thermally enhanced semiconductor package with thermal additive and process for making the same Grant 10,103,080 - Costa , et al. October 16, 2	2018-10-16
Thermally Enhanced Semiconductor Package With Thermal Additive And Process For Making The Same App 20180197803 - Costa; Julio C. ; et al.	2018-07-12
Wafer-level Package With Enhanced Performance App 20180047653 - Costa; Julio C. ; et al.	2018-02-15
Wafer-level Package With Enhanced Performance App 20180044169 - Hatcher, JR.; Merrill Albert ; et al.	2018-02-15
Thermally Enhanced Semiconductor Package With Thermal Additive And Process For Making The Same App 20170358511 - Costa; Julio C. ; et al.	2017-12-14
Wafer-level Package With Enhanced Performance App 20170334710 - Costa; Julio C. ; et al.	2017-11-23
Atomic layer deposition encapsulation for acoustic wave devices Grant 9,349,938 - Hatcher, Jr. , et al. May 24, 2	2016-05-24
Atomic layer deposition encapsulation for acoustic wave devices Grant 9,082,953 - Hatcher, Jr. , et al. July 14, 2	2015-07-14
Atomic Layer Deposition Encapsulation For Acoustic Wave Devices App 20130230643 - Hatcher, JR.; Merrill Albert ; et al.	2013-09-05
Atomic Layer Deposition Encapsulation For Acoustic Wave Devices App 20130221800 - Hatcher, JR.; Merrill Albert ; et al.	2013-08-29
Atomic layer deposition encapsulation for power amplifiers in RF circuits Grant 8,492,908 - Siomkos , et al. July 23, 2	2013-07-23
Atomic layer deposition encapsulation for acoustic wave devices Grant 8,440,012 - Hatcher, Jr. , et al. May 14, 2	2013-05-14
Atomic Layer Deposition Encapsulation For Power Amplifiers In Rf Circuits App 20130038390 - Siomkos; John R. ; et al.	2013-02-14
Atomic layer deposition encapsulation for power amplifiers in RF circuits Grant 8,313,985 - Hatcher, Jr. , et al. November 20, 2	2012-11-20
Atomic Layer Deposition Encapsulation For Power Amplifiers In Rf Circuits App 20120097970 - Siomkos; John Robert ; et al.	2012-04-26
Atomic Layer Deposition Encapsulation For Acoustic Wave Devices App 20120091855 - Hatcher, JR.; Merrill Albert ; et al.	2012-04-19

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