Harr; Kyoung Moo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Harr; Kyoung Moo.The latest application filed is for "electronic component package".

Company Profile

4.12.17

Harr; Kyoung Moo - Suwon-Si KR
Harr; Kyoung-Moo - Jindo-gun KR
Harr; Kyoung Moo - Suwon KR
Harr; Kyoung Moo - Gyunggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fan-out semiconductor package Grant 10,741,461 - Kim , et al. A	2020-08-11
Fan-out semiconductor package and method of manufacturing the fan-out semiconductor Grant 10,622,322 - Kim , et al.	2020-04-14
Electronic Component Package App 20200027833 - Lee; Ji Hyun ; et al.	2020-01-23
Fan-out semiconductor package and method of manufacturing same Grant 10,388,614 - Lee , et al. A	2019-08-20
Fan-out semiconductor package Grant 10,224,288 - Oh , et al.	2019-03-05
Fan-out semiconductor package Grant 10,211,149 - Harr , et al. Feb	2019-02-19
Fan-out semiconductor package Grant 10,170,382 - Kim , et al. J	2019-01-01
Printed circuit board Grant 10,154,594 - Lee , et al. Dec	2018-12-11
Fan-out Semiconductor Package App 20180323119 - KIM; Hyoung Joon ; et al.	2018-11-08
Fan-out semiconductor package and method of manufacturing same Grant 10,062,652 - Lee , et al. August 28, 2	2018-08-28
Fan-out Semiconductor Package App 20180240751 - HARR; Kyoung Moo ; et al.	2018-08-23
Fan-out Semiconductor Package App 20180226350 - LEE; Ji Hyun ; et al.	2018-08-09
Fan-out semiconductor package Grant 10,043,758 - Lee , et al. August 7, 2	2018-08-07
Fan-out Semiconductor Package And Method Of Manufacturing Same App 20180197827 - LEE; Ji Hyun ; et al.	2018-07-12
Fan-out Semiconductor Package And Method Of Manufacturing The Fan-out Semiconductor App 20180122759 - KIM; Hyoung Joon ; et al.	2018-05-03
Fan-out Semiconductor Package App 20180090402 - KIM; Hyoung Joon ; et al.	2018-03-29
Electronic component package and method of manufacturing the same Grant 9,905,526 - Harr , et al. February 27, 2	2018-02-27
Fan-out Semiconductor Package App 20180033733 - OH; Kyung Seob ; et al.	2018-02-01
Fan-out semiconductor package Grant 9,881,873 - Oh , et al. January 30, 2	2018-01-30
Fan-out Semiconductor Package App 20170365558 - OH; Kyung Seob ; et al.	2017-12-21
Fan-out Semiconductor Package And Method Of Manufacturing Same App 20170271272 - LEE; Ji Hyun ; et al.	2017-09-21
Electronic Component Package And Method Of Manufacturing The Same App 20170125318 - HARR; Kyoung Moo ; et al.	2017-05-04
Printed Circuit Board, Manufacturing Method Thereof And Electronic Component Module App 20160316557 - LEE; Jeong-Ho ; et al.	2016-10-27
Printed Circuit Board And Electronic Component Module App 20160198568 - PARK; Mi Jin ; et al.	2016-07-07
Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the same Grant 8,957,319 - Han , et al. February 17, 2	2015-02-17
Printed Circuit Board And Method Of Fabricating The Same App 20150000958 - HARR; Kyoung Moo ; et al.	2015-01-01
Printed Circuit Board Having Copper Plated Layer With Roughness And Method Of Manufacturing The Same App 20140186651 - Han; Sung ; et al.	2014-07-03
Method For Removing Seed Layer In Manufacturing Printed Circuit Board And Printed Circuit Board Manufactured By Using The Same App 20140076619 - Han; Sung ; et al.	2014-03-20
Three-dimensional (3d) Semiconductor Package App 20140042604 - Jeon; Hyung Jin ; et al.	2014-02-13

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