Han; Kwon Whan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Han; Kwon Whan.The latest application filed is for "methods of fabricating semiconductor packages including reinforcement top die".

Company Profile

0.25.30

Han; Kwon Whan - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods of fabricating semiconductor packages including reinforcement top die Grant 10,770,445 - Han Sep	2020-09-08
Methods Of Fabricating Semiconductor Packages Including Reinforcement Top Die App 20190259743 - HAN; Kwon Whan	2019-08-22
Package of electronic device including connecting bump, system including the same and method for fabricating the same Grant 9,099,456 - Han August 4, 2	2015-08-04
Chip carriers, semiconductor devices including the same, semiconductor packages including the same, and methods of fabricating the same Grant 8,922,000 - Han December 30, 2	2014-12-30
Semiconductor chip capable of improving mounting reliability and semiconductor package having the same Grant 8,836,054 - Han September 16, 2	2014-09-16
Semiconductor Chip Module And Semiconductor Package Having The Same App 20140014958 - OH; Tac Keun ; et al.	2014-01-16
Semiconductor chip embedded with a test circuit Grant 8,586,983 - Han November 19, 2	2013-11-19
Semiconductor package Grant 8,441,098 - Han May 14, 2	2013-05-14
Chip Carriers, Semiconductor Devices Including The Same, Semiconductor Packages Including The Same, And Methods Of Fabricating The Same App 20130099368 - HAN; Kwon Whan	2013-04-25
Semiconductor Wafer And Method For Manufacturing Stack Package Using The Same App 20130099235 - HAN; Kwon Whan	2013-04-25
Package Of Electronic Device Including Connecting Bump, System Including The Same And Method For Fabricating The Same App 20130099374 - HAN; Kwon Whan	2013-04-25
Wafer Level Chip Scale Package Having An Enhanced Heat Exchange Efficiency With An Emf Shield And A Method For Fabricating The Same App 20130078807 - PARK; Chang Jun ; et al.	2013-03-28
Stacked semiconductor package and method for manufacturing the same Grant 8,399,355 - Han March 19, 2	2013-03-19
Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same Grant 8,338,921 - Park , et al. December 25, 2	2012-12-25
Semiconductor Chip And Semiconductor Package Having The Same App 20120153410 - HAN; Kwon Whan	2012-06-21
Wafer Level Chip Scale Package Having An Enhanced Heat Exchange Efficiency With An Emf Shield And A Method For Fabricating The Same App 20120049385 - PARK; Chang Jun ; et al.	2012-03-01
Semiconductor Chip With Fine Pitch Leads For Normal Testing Of Same App 20110309358 - KIM; Jong Hoon ; et al.	2011-12-22
Size Variable Type Semiconductor Chip And Semiconductor Package Using The Same App 20110272692 - HAN; Kwon Whan ; et al.	2011-11-10
Semiconductor Chip Embedded With A Test Circuit App 20110254000 - HAN; Kwon Whan	2011-10-20
Semiconductor Package App 20110140237 - HAN; Kwon Whan	2011-06-16
Stacked Semiconductor Package And Method For Manufacturing The Same App 20110092024 - HAN; Kwon Whan	2011-04-21
Semiconductor chip with chip selection structure and stacked semiconductor package having the same Grant 7,898,834 - Kim , et al. March 1, 2	2011-03-01
Stacked semiconductor package and method for manufacturing the same Grant 7,880,311 - Han February 1, 2	2011-02-01
Multi-layer stacked wafer level semiconductor package module Grant 7,859,102 - Kim , et al. December 28, 2	2010-12-28
Stack package having pattern die redistribution Grant 7,834,463 - Kim , et al. November 16, 2	2010-11-16
Method for manufacturing semiconductor package Grant 7,795,139 - Han , et al. September 14, 2	2010-09-14
Method for manufacturing stack package using through-electrodes Grant 7,795,073 - Han , et al. September 14, 2	2010-09-14
Through-silicon Via And Method For Forming The Same App 20100148370 - HAN; Kwon Whan	2010-06-17
Wafer level semiconductor package and method for manufacturing the same Grant 7,705,457 - Han April 27, 2	2010-04-27
Through-silicon via and method for forming the same Grant 7,691,748 - Han April 6, 2	2010-04-06
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same Grant 7,595,268 - Han September 29, 2	2009-09-29
Method For Manufacturing Stack Package Using Through-electrodes App 20090197372 - HAN; Kwon Whan ; et al.	2009-08-06
Semiconductor Package And A Method For Manufacturing The Same App 20090189281 - HAN; Kwon Whan	2009-07-30
Semiconductor Chip With Chip Selection Structure And Stacked Semiconductor Package Having The Same App 20090189267 - Kim; Sung Min ; et al.	2009-07-30
Wafer Level Chip Scale Package Having An Enhanced Heat Exchange Efficiency With An Emf Shield And A Method For Fabricating The Same App 20090184414 - PARK; Chang Jun ; et al.	2009-07-23
Multi-layer Stacked Wafer Level Semiconductor Package Module App 20090166853 - Kim; Sung Min ; et al.	2009-07-02
Wafer Level Semiconductor Package And Method For Manufacturing The Same App 20090140424 - HAN; Kwon Whan	2009-06-04
Stacked Semiconductor Package And Method For Manufacturing The Same App 20090108468 - HAN; Kwon Whan	2009-04-30
Method For Manufacturing Semiconductor Package App 20080318361 - HAN; Kwon Whan ; et al.	2008-12-25
Semiconductor Package And A Method For Manufacturing The Same App 20080315394 - HAN; Kwon Whan	2008-12-25
High-performance semiconductor package Grant 7,468,550 - Han December 23, 2	2008-12-23
Wafer level chip scale package (WLCSP) with high reliability against thermal stress Grant 7,446,405 - Kim , et al. November 4, 2	2008-11-04
Through-silicon via and method for forming the same App 20080079121 - Han; Kwon Whan	2008-04-03
Stack package having pattern die redistribution App 20080001304 - Kim; Sung Min ; et al.	2008-01-03
High-performance semiconductor package App 20070228563 - Han; Kwon Whan	2007-10-04
Wafer level chip scale package (WLCSP) with high reliability against thermal stress App 20070182022 - Kim; Jong Hoon ; et al.	2007-08-09

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