Haluzak; Charles C.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Haluzak; Charles C..The latest application filed is for "electrode structures for micro-valves for use in jetting assemblies".
Company Profile
7.52.65
- Haluzak; Charles C. - Philomath OR
- Haluzak; Charles C. - Corvallis OR US
- Haluzak; Charles C - Corvallis OR
- Haluzak; Charles C. - Corvalls OR
Patent Activity
| Patent | Date |
|---|---|
| Electrode Structures For Micro-valves For Use In Jetting Assemblies App 20220219455 - Buskirk; William A. ; et al. | 2022-07-14 |
| Systems And Methods For Controlling Operation Of Micro-valves For Use In Jetting Assemblies App 20220088924 - Buskirk; William A. ; et al. | 2022-03-24 |
| Electrode structures for micro-valves for use in jetting assemblies Grant 11,186,084 - Buskirk , et al. November 30, 2 | 2021-11-30 |
| Systems and methods for controlling operation of micro-valves for use in jetting assemblies Grant 10,994,535 - Buskirk , et al. May 4, 2 | 2021-05-04 |
| Micro-valves For Use In Jetting Assemblies App 20190346066 - Buskirk; William A. ; et al. | 2019-11-14 |
| Electrode Structures For Micro-valves For Use In Jetting Assemblies App 20190346067 - Buskirk; William A. ; et al. | 2019-11-14 |
| Methods Of Fabricating Micro-valves And Jetting Assemblies Including Such Micro-valves App 20190344568 - Buskirk; William A. ; et al. | 2019-11-14 |
| Systems And Methods For Controlling Operation Of Micro-valves For Use In Jetting Assemblies App 20190344564 - Buskirk; William A. ; et al. | 2019-11-14 |
| Systems And Methods For Sealing Micro-valves For Use In Jetting Assemblies App 20190346051 - Buskirk; William A. ; et al. | 2019-11-14 |
| Cantilevered Micro-valve And Inkjet Printer Using Said Valve App 20180162140 - BUSKIRK; William A. ; et al. | 2018-06-14 |
| Thermal inkjet print head with solvent resistance Grant 8,960,886 - Lambright , et al. February 24, 2 | 2015-02-24 |
| Cantilevered Micro-Valve and Inkjet Printer Using Said Valve App 20140333703 - Buskirk; William A. ; et al. | 2014-11-13 |
| Thermal inkjet print head with solvent resistance Grant 8,733,900 - Lambright , et al. May 27, 2 | 2014-05-27 |
| Thermal Inkjet Print Head With Solvent Resistance App 20140118441 - Lambright; Terry M. ; et al. | 2014-05-01 |
| Thermal Inkjet Print Head With Solvent Resistance App 20130257989 - Lambright; Terry M. ; et al. | 2013-10-03 |
| Micro electrical mechanical system Grant 8,497,577 - Chen , et al. July 30, 2 | 2013-07-30 |
| Thermal inkjet print head with solvent resistance Grant 8,454,149 - Lambright , et al. June 4, 2 | 2013-06-04 |
| System and method for maintaining or recovering nozzle function for an inkjet printhead Grant 8,113,613 - Folkers , et al. February 14, 2 | 2012-02-14 |
| Microelectronic device Grant 8,043,880 - Haluzak , et al. October 25, 2 | 2011-10-25 |
| Microfluidic device and a fluid ejection device incorporating the same Grant 8,007,078 - Haluzak , et al. August 30, 2 | 2011-08-30 |
| Method for forming a fluid ejection device Grant 7,988,264 - Haluzak , et al. August 2, 2 | 2011-08-02 |
| System And Method For Maintaining Or Recovering Nozzle Fuction For A Printhead App 20110141191 - Folkers; John P. ; et al. | 2011-06-16 |
| Microfluidic Device And A Fluid Ejection Device Incorporating The Same App 20110025782 - Haluzak; Charles C. ; et al. | 2011-02-03 |
| Thermal Inkjet Print Head With Solvent Resistance App 20100328398 - LAMBRIGHT; Terry M. ; et al. | 2010-12-30 |
| Microfluidic device and a fluid ejection device incorporating the same Grant 7,828,417 - Haluzak , et al. November 9, 2 | 2010-11-09 |
| Method For Forming A Fluid Ejection Device App 20100259583 - Haluzak; Charles C. ; et al. | 2010-10-14 |
| Electro-wetting on dielectric for pin-style fluid delivery Grant 7,780,830 - Haluzak , et al. August 24, 2 | 2010-08-24 |
| Method for forming a fluid ejection device Grant 7,766,462 - Haluzak , et al. August 3, 2 | 2010-08-03 |
| System and method for direct bonding of substrates Grant 7,741,157 - Haluzak , et al. June 22, 2 | 2010-06-22 |
| Packaged MEMS device assembly Grant 7,723,811 - Haluzak , et al. May 25, 2 | 2010-05-25 |
| Methods of controlling flow Grant 7,655,275 - Nelson , et al. February 2, 2 | 2010-02-02 |
| System And Method For Maintaining Or Recovering Nozzle Function For An Inkjet Printhead App 20090273621 - Folkers; John P. ; et al. | 2009-11-05 |
| Bonding interface for micro-device packaging Grant 7,611,919 - Sand , et al. November 3, 2 | 2009-11-03 |
| Method of forming a printhead Grant 7,549,225 - Chen , et al. June 23, 2 | 2009-06-23 |
| Method of forming a device package having edge interconnect pad Grant 7,541,209 - Haluzak , et al. June 2, 2 | 2009-06-02 |
| Methods for hermetic sealing of post media-filled MEMS package Grant 7,534,662 - Chen , et al. May 19, 2 | 2009-05-19 |
| Drop generator for ultra-small droplets Grant 7,490,924 - Haluzak , et al. February 17, 2 | 2009-02-17 |
| System And Method For Direct Bonding Of Substrates App 20080280398 - Haluzak; Charles C. ; et al. | 2008-11-13 |
| Packaged MEMS device assembly App 20080272446 - Haluzak; Charles C. ; et al. | 2008-11-06 |
| Package having bond-sealed underbump Grant 7,443,017 - Haluzak , et al. October 28, 2 | 2008-10-28 |
| Preparation of microelectromechanical system device using an anti-stiction material and selective plasma sputtering Grant 7,443,001 - Chen , et al. October 28, 2 | 2008-10-28 |
| Microfluidic Device And A Fluid Ejection Device Incorporating The Same App 20080259125 - Haluzak; Charles C. ; et al. | 2008-10-23 |
| Micro-displays Grant 7,436,571 - Sterner , et al. October 14, 2 | 2008-10-14 |
| System and method for direct-bonding of substrates Grant 7,417,307 - Haluzak , et al. August 26, 2 | 2008-08-26 |
| Method For Forming A Fluid Ejection Device App 20080199981 - Haluzak; Charles C. ; et al. | 2008-08-21 |
| Fluidic MEMS device Grant 7,393,712 - Smith , et al. July 1, 2 | 2008-07-01 |
| Flextensional transducer and method of forming flextensional transducer Grant 7,378,030 - Truninger , et al. May 27, 2 | 2008-05-27 |
| Microelectromechanical system device and method for preparing the same for subsequent processing App 20080108163 - Chen; Chien-Hua ; et al. | 2008-05-08 |
| Micro-Displays and Their Manufacture App 20080068697 - Haluzak; Charles C. ; et al. | 2008-03-20 |
| Micro Electrical Mechanical System App 20080029880 - Chen; Chien-Hua ; et al. | 2008-02-07 |
| Micro-displays and their manufacture Grant 7,320,899 - Haluzak , et al. January 22, 2 | 2008-01-22 |
| Micro-optoelectromechanical system packages for a light modulator and methods of making the same Grant 7,307,773 - Chen , et al. December 11, 2 | 2007-12-11 |
| Multi-element thin-film fuel cell Grant 7,306,866 - Haluzak December 11, 2 | 2007-12-11 |
| Micro electrical mechanical system Grant 7,300,812 - Chen , et al. November 27, 2 | 2007-11-27 |
| Optical device and method of forming the same App 20070267057 - Haluzak; Charles C. ; et al. | 2007-11-22 |
| MEMS packaging structure and methods Grant 7,288,464 - Haluzak , et al. October 30, 2 | 2007-10-30 |
| Assembly with a ring and bonding pads formed of a same material on a substrate Grant 7,262,498 - Craig , et al. August 28, 2 | 2007-08-28 |
| Method of forming a printhead App 20070188551 - Chen; Chien-Hua ; et al. | 2007-08-16 |
| Method of forming a device package having edge interconnect pad App 20070087462 - Haluzak; Charles C. ; et al. | 2007-04-19 |
| Fluidic MEMS device App 20070042565 - Smith; Mark A. ; et al. | 2007-02-22 |
| Bonding surfaces together via plasma treatment on both surfaces with wet treatment on only one surface App 20070023850 - Chen; Chien-Hua ; et al. | 2007-02-01 |
| System and method for direct-bonding of substrates App 20070026559 - Haluzak; Charles C. ; et al. | 2007-02-01 |
| Microelectronic device App 20070023890 - Haluzak; Charles C. ; et al. | 2007-02-01 |
| Package having bond-sealed underbump App 20060292748 - Haluzak; Charles C. ; et al. | 2006-12-28 |
| Drop generator for ultra-small droplets App 20060243387 - Haluzak; Charles C. ; et al. | 2006-11-02 |
| Bonding interface for micro-device packaging App 20060237810 - Sand; Kirby ; et al. | 2006-10-26 |
| Drop generator for ultra-small droplets Grant 7,125,731 - Haluzak , et al. October 24, 2 | 2006-10-24 |
| MEMS packaging structure and methods App 20060228869 - Haluzak; Charles C. ; et al. | 2006-10-12 |
| Method of fabricating a fluid ejection device Grant 7,103,972 - Chen , et al. September 12, 2 | 2006-09-12 |
| System and method for direct-bonding of substrates Grant 7,087,134 - Chen , et al. August 8, 2 | 2006-08-08 |
| System And Method For Direct-bonding Of Substrates App 20060163712 - Chen; Chien-Hua ; et al. | 2006-07-27 |
| Micro-optoelectromechanical system packages for a light modulator and methods of making the same App 20060146426 - Chen; Chien-Hua ; et al. | 2006-07-06 |
| Package having bond-sealed underbump Grant 7,067,355 - Haluzak , et al. June 27, 2 | 2006-06-27 |
| Multi-element thin-film fuel cell App 20060134490 - Haluzak; Charles C. | 2006-06-22 |
| Micro-displays and their manufacture App 20060094143 - Haluzak; Charles C. ; et al. | 2006-05-04 |
| Micro electrical mechanical system App 20060094149 - Chen; Chien-Hua ; et al. | 2006-05-04 |
| Electro-wetting on dielectric for pin-style fluid delivery App 20060081643 - Haluzak; Charles C. ; et al. | 2006-04-20 |
| Micro-displays App 20060082737 - Sterner; John R. ; et al. | 2006-04-20 |
| Assembly App 20060081994 - Craig; David M. ; et al. | 2006-04-20 |
| Multi-element thin-film fuel cell Grant 7,018,734 - Haluzak March 28, 2 | 2006-03-28 |
| Substrate and method of forming substrate for fluid ejection device Grant 7,018,015 - Truninger , et al. March 28, 2 | 2006-03-28 |
| Methods of controlling flow App 20060024504 - Nelson; Curtis L. ; et al. | 2006-02-02 |
| Micro-electromechanical system Grant 6,979,585 - Nikkel , et al. December 27, 2 | 2005-12-27 |
| Package having bond-sealed underbump App 20050275072 - Haluzak, Charles C. ; et al. | 2005-12-15 |
| System and method for direct-bonding of substrates App 20050224155 - Chen, Chien-Hua ; et al. | 2005-10-13 |
| System and methods for hermetic sealing of post media-filled MEMS package Grant 6,946,728 - Chen , et al. September 20, 2 | 2005-09-20 |
| System and methods for hermetic sealing of post media-filled MEMS package App 20050202591 - Chen, Chien-Hua ; et al. | 2005-09-15 |
| Method of forming a printhead using a silicon on insulator substrate Grant 6,938,340 - Haluzak , et al. September 6, 2 | 2005-09-06 |
| System And Methods For Hermetic Sealing Of Post Media-filled Mems Package App 20050184382 - Chen, Chien-Hua ; et al. | 2005-08-25 |
| Flextensional transducer and method of forming flextensional transducer App 20050157096 - Truninger, Martha A. ; et al. | 2005-07-21 |
| Substrate and method of forming substrate for fluid ejection device App 20050088491 - Truninger, Martha A. ; et al. | 2005-04-28 |
| Flextensional transducer and method of forming flextensional transducer Grant 6,883,903 - Truninger , et al. April 26, 2 | 2005-04-26 |
| Bond ring for micro-electromechanical system App 20050077612 - Nikkel, Eric L. ; et al. | 2005-04-14 |
| Multi-level integrated circuit for wide-gap substrate bonding Grant 6,878,638 - Regan , et al. April 12, 2 | 2005-04-12 |
| Fluidic MEMS device App 20050012197 - Smith, Mark A. ; et al. | 2005-01-20 |
| Substrate and method of forming substrate for fluid ejection device Grant 6,821,450 - Truninger , et al. November 23, 2 | 2004-11-23 |
| Substrate and method of forming substrate for fluid ejection device App 20040141027 - Truninger, Martha A. ; et al. | 2004-07-22 |
| Flextensional transducer and method of forming flextensional transducer App 20040140732 - Truninger, Martha A. ; et al. | 2004-07-22 |
| Fluid ejection device with a composite substrate App 20040104198 - Chen, Chien-Hua ; et al. | 2004-06-03 |
| Thermal drop generator for ultra-small droplets Grant 6,698,868 - Trueba , et al. March 2, 2 | 2004-03-02 |
| Multi-level integrated circuit for wide-gap substrate bonding Grant 6,686,642 - Regan , et al. February 3, 2 | 2004-02-03 |
| Fluid ejection device with a composite substrate Grant 6,679,587 - Chen , et al. January 20, 2 | 2004-01-20 |
| Multi-level integrated circuit for wide-gap substrate bonding App 20030201513 - Regan, Michael J. ; et al. | 2003-10-30 |
| Drop generator for ultra-small droplets App 20030186474 - Haluzak, Charles C. ; et al. | 2003-10-02 |
| Fuel cell with fuel droplet fuel supply App 20030143444 - Liu, Qin ; et al. | 2003-07-31 |
| Fluid ejection device with a composite substrate App 20030081073 - Chen, Chien-Hua ; et al. | 2003-05-01 |
| Feature in firing chamber of fluid ejection device App 20030063163 - Seaver, Richard W. ; et al. | 2003-04-03 |
| Fully integrated printhead using silicon on insulator wafer App 20030058309 - Haluzak, Charles C. ; et al. | 2003-03-27 |
| Multi-element thin-film fuel cell App 20030022051 - Haluzak, Charles C. | 2003-01-30 |
| Multi-level integrated circuit for wide-gap substrate bonding App 20020185737 - Regan, Michael J. ; et al. | 2002-12-12 |
| Ink feed trench etch technique for a fully integrated thermal inkjet printhead App 20020129495 - Trueba, Kenneth E. ; et al. | 2002-09-19 |
| In-situ fluid jet orifice Grant 6,315,397 - Truninger , et al. November 13, 2 | 2001-11-13 |
| In-situ fluid jet orifice App 20010015737 - Truninger, Martha ; et al. | 2001-08-23 |
| In-situ fluid jet orifice Grant 6,204,182 - Truninger , et al. March 20, 2 | 2001-03-20 |
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