HAIGH; THOMAS JASPER
Patent Applications and Registrations
Patent applications and USPTO patent grants for HAIGH; THOMAS JASPER.The latest application filed is for "adhesion layer and multiphase ultra-low k dielectric material".
- HAIGH; THOMAS JASPER - CLAVERACK NY
| Patent | Date |
|---|---|
| ADHESION LAYER AND MULTIPHASE ULTRA-LOW k DIELECTRIC MATERIAL App 20140203336 - GRILL; ALFRED ; et al. | 2014-07-24 |
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