| Patent | Date |
|---|
Semiconductor process evaluation methods including variable ion implanting conditions
Grant 7,972,874 - Jang , et al. July 5, 2 | 2011-07-05 |
Semiconductor Process Evaluation Methods Including Variable Ion Implanting Conditions
App 20100279442 - Jang; Won-bae ; et al. | 2010-11-04 |
Inductor for a system-on-a-chip and a method for manufacturing the same
Grant 7,807,337 - Lee , et al. October 5, 2 | 2010-10-05 |
Semiconductor process evaluation methods including variable ion implanting conditions
Grant 7,781,234 - Jang , et al. August 24, 2 | 2010-08-24 |
Polishing apparatus and related polishing methods
Grant 7,488,235 - Park , et al. February 10, 2 | 2009-02-10 |
Metal-insulator-metal (mim) Capacitor And Method For Fabricating The Same
App 20080166851 - HONG; Uk-Sun ; et al. | 2008-07-10 |
Inductor For A System-on-a-chip And A Method For Manufacturing The Same
App 20080102409 - LEE; Hyo-Jong ; et al. | 2008-05-01 |
Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same
App 20070155178 - Park; Young-rae ; et al. | 2007-07-05 |
Semiconductor Process Evaluation Methods Including Variable Ion Implanting Conditions
App 20070155028 - Jang; Won-bae ; et al. | 2007-07-05 |
Apparatus for cleaning semiconductor wafer including heating using a light source and method for cleaning wafer using the same
Grant 7,237,561 - Park , et al. July 3, 2 | 2007-07-03 |
Method of forming a trench for use in manufacturing a semiconductor device
App 20070117378 - Lee; Sung-Bae ; et al. | 2007-05-24 |
Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same
Grant 7,196,010 - Park , et al. March 27, 2 | 2007-03-27 |
Method of forming a trench for use in manufacturing a semiconductor device
Grant 7,183,226 - Lee , et al. February 27, 2 | 2007-02-27 |
Method of forming metal interconnection layer of semiconductor device
Grant 7,157,366 - Kim , et al. January 2, 2 | 2007-01-02 |
Method of cleaning semiconductor wafer
Grant 7,153,370 - Lee , et al. December 26, 2 | 2006-12-26 |
Chemical mechanical polishing slurry
Grant 7,144,815 - Lee , et al. December 5, 2 | 2006-12-05 |
Method of forming metal pattern using selective electroplating process
App 20060270228 - Lee; Hyo-Jong ; et al. | 2006-11-30 |
Cleaning solution for removing damaged portion of ferroelectric layer and cleaning method using the same
Grant 7,135,413 - Lee , et al. November 14, 2 | 2006-11-14 |
Polishing Apparatus And Related Polishing Methods
App 20060189259 - Park; Moo-Yong ; et al. | 2006-08-24 |
Apparatus and method for cleaning a semiconductor wafer
Grant 7,089,947 - Yeo , et al. August 15, 2 | 2006-08-15 |
Polishing apparatus and related polishing methods
Grant 7,066,785 - Park , et al. June 27, 2 | 2006-06-27 |
Dry cleaning apparatus used to manufacture semiconductor devices
App 20060096622 - Lee; Sang-Eon ; et al. | 2006-05-11 |
Dual damascene process
Grant 7,033,944 - Park , et al. April 25, 2 | 2006-04-25 |
Method for filling a hole with a metal
Grant 7,026,242 - Son , et al. April 11, 2 | 2006-04-11 |
Megasonic cleaning apparatus for fabricating semiconductor device
Grant 7,017,597 - Yoon , et al. March 28, 2 | 2006-03-28 |
Chemical mechanical polishing apparatus
Grant 6,976,902 - Koo , et al. December 20, 2 | 2005-12-20 |
Slurry composition for use in chemical mechanical polishing of metal wiring
Grant 6,930,054 - Lee , et al. August 16, 2 | 2005-08-16 |
Method of forming a via contact structure using a dual damascene technique
Grant 6,924,228 - Kim , et al. August 2, 2 | 2005-08-02 |
Method of fabricating a metal-insulator-metal capacitor
Grant 6,924,207 - Son , et al. August 2, 2 | 2005-08-02 |
Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper
Grant 6,924,234 - Han , et al. August 2, 2 | 2005-08-02 |
Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper
App 20050148292 - Hau, Ja-Hyung ; et al. | 2005-07-07 |
Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same
Grant 6,914,001 - Lee , et al. July 5, 2 | 2005-07-05 |
Single type of semiconductor wafer cleaning apparatus and method of using the same
App 20050121053 - Lee, Kun-tack ; et al. | 2005-06-09 |
Inductor for a system-on-a-chip and method for manufacturing the same
App 20050116317 - Lee, Hyo-Jong ; et al. | 2005-06-02 |
Method of forming metal pattern using selective electroplating process
App 20050070090 - Lee, Hyo-Jong ; et al. | 2005-03-31 |
Chemical mechanical polishing apparatus
App 20050048875 - Koo, Ja-Eung ; et al. | 2005-03-03 |
Single type of semiconductor wafer cleaning device
Grant 6,860,277 - Lee , et al. March 1, 2 | 2005-03-01 |
Method of forming metal interconnection layer of semiconductor device
App 20050037605 - Kim, Il-Goo ; et al. | 2005-02-17 |
Chemical mechanical polishing slurry
Grant 6,855,267 - Lee , et al. February 15, 2 | 2005-02-15 |
Wafer cleaning system
Grant 6,843,257 - Yeo , et al. January 18, 2 | 2005-01-18 |
Method for filling a hole with a metal
App 20040253813 - Son, Hong-Seong ; et al. | 2004-12-16 |
Sluury composition for use in chemical mechanical polishing of metal wiring
App 20040244911 - Lee, Jae Seok ; et al. | 2004-12-09 |
Apparatus for cleaning semiconductor wafer and method for cleaning wafer using the same
App 20040173236 - Park, Im-soo ; et al. | 2004-09-09 |
Method of forming a via contact structure using a dual damascene technique
App 20040175932 - Kim, Il-Goo ; et al. | 2004-09-09 |
Method of forming a trench for use in manufacturing a semiconductor device
App 20040171211 - Lee, Sung-Bae ; et al. | 2004-09-02 |
Method of forming a conductive metal line over a semiconductor wafer
App 20040171277 - Oh, Jun-Hwan ; et al. | 2004-09-02 |
Chemical mechanical polishing slurry
App 20040154231 - Lee, Jae-dong ; et al. | 2004-08-12 |
Polishing apparatus and related polishing methods
App 20040137829 - Park, Moo-Yong ; et al. | 2004-07-15 |
Method of fabricating a metal-insulator-metal capacitor
App 20040126984 - Son, Hong-Seong ; et al. | 2004-07-01 |
Cleaning solution for removing damaged portion of ferroelectric layer and cleaning method using the same
App 20040112870 - Lee, Kwang-Wook ; et al. | 2004-06-17 |
Method of fabricating a semiconductor device using two chemical mechanical polishing processes to polish regions having different conductive pattern densities
Grant 6,723,644 - Kim , et al. April 20, 2 | 2004-04-20 |
Method for fabricating a contact pad of semiconductor device
Grant 6,716,732 - Park , et al. April 6, 2 | 2004-04-06 |
Apparatus for cleaning semiconductor wafer and method for cleaning wafer using the same
Grant 6,712,078 - Park , et al. March 30, 2 | 2004-03-30 |
Dual damamscene process
App 20040058538 - Park, Wan-Jae ; et al. | 2004-03-25 |
Method for manufacturing a metal-insulator-metal capacitor
Grant 6,699,749 - Lee , et al. March 2, 2 | 2004-03-02 |
Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same
App 20040033693 - Park, Young-Rae ; et al. | 2004-02-19 |
Metal-insulator-metal (MIM) capacitor and method for fabricating the same
App 20030231458 - Hong, Uk-Sun ; et al. | 2003-12-18 |
Method of planarizing non-volatile memory device
Grant 6,649,471 - Cho , et al. November 18, 2 | 2003-11-18 |
Method of forming metal interconnection using plating and semiconductor device manufactured by the method
App 20030201538 - Lee, Jong-won ; et al. | 2003-10-30 |
Wafer cleaning system
App 20030200986 - Yeo, In-Jun ; et al. | 2003-10-30 |
Apparatus and method for cleaning a semiconductor wafer
App 20030192571 - Yeo, In-Jun ; et al. | 2003-10-16 |
Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same
Grant 6,626,968 - Park , et al. September 30, 2 | 2003-09-30 |
Megasonic cleaning apparatus for fabricating semiconductor device
App 20030178049 - Yoon, Byoung-moon ; et al. | 2003-09-25 |
Method of forming metal interconnection using plating and semiconductor device manufactured by the method
Grant 6,610,596 - Lee , et al. August 26, 2 | 2003-08-26 |
Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same
App 20030148616 - Lee, Jong-Won ; et al. | 2003-08-07 |
Wet Process For Semiconductor Device Fabrication Using Anode Water Containing Oxidative Substances And Cathode Water Containing Reductive Substances, And Anode Water And Cathode Water Used In The Wet Process
Grant 6,565,736 - Park , et al. May 20, 2 | 2003-05-20 |
Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper
App 20030064587 - Han, Ja-Hyung ; et al. | 2003-04-03 |
Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same
Grant 6,540,935 - Lee , et al. April 1, 2 | 2003-04-01 |
Wafer polishing slurry and chemical mechanical polishing (CMP) method using the same
Grant 6,514,862 - Lee , et al. February 4, 2 | 2003-02-04 |
Method of planarizing non-volatile memory device
App 20030022442 - Cho, Min-Soo ; et al. | 2003-01-30 |
Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same
App 20030022499 - Lee, Jong-Won ; et al. | 2003-01-30 |
Method of fabricating a semiconductor device using two chemical mechanical polishing processes to polish regions having different conductive pattern densities
App 20020132492 - Kim, Jung-yup ; et al. | 2002-09-19 |
Chemical mechanical polishing slurry
App 20020123224 - Lee, Jae-dong ; et al. | 2002-09-05 |
Single type of semiconductor wafer cleaning apparatus and method of using the same
App 20020108641 - Lee, Kun-Tack ; et al. | 2002-08-15 |
Apparatus for cleaning semiconductor wafer and method for cleaning wafer using the same
App 20020092542 - Park, Im-Soo ; et al. | 2002-07-18 |
Method for fabricating a contact pad of semiconductor device
App 20020086509 - Park, Young-Rae ; et al. | 2002-07-04 |
Wafer polishing slurry and chemical mechanical polishing (CMP) method using the same
App 20020064955 - Lee, Jae-dong ; et al. | 2002-05-30 |
Solution for chemical mechanical polishing and method of manufacturing copper metal interconnection layer using the same
App 20020061635 - Lee, Jong-won ; et al. | 2002-05-23 |
Method of controlling wafer polishing time using sample-skip algorithm and wafer polishing using the same
App 20020058460 - Lee, Jae-dong ; et al. | 2002-05-16 |
Semiconductor device including gate electrode having damascene structure and method of fabricating the same
App 20020052085 - Hwang, Hong-Kyu ; et al. | 2002-05-02 |
Methods of planarizing insulating layers on regions having different etching rates
App 20020045337 - Nam, Gee-won ; et al. | 2002-04-18 |
Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same
App 20020034875 - Park, Young-rae ; et al. | 2002-03-21 |
Wet process for semiconductor device fabrication using anode water containing oxidative substances and cathode water containing reductive substances, and anode water and cathode water used in the wet process
App 20020027084 - Park, Im-Soo ; et al. | 2002-03-07 |
Slurry for chemical mechanical polishing of metal layer, method of preparing the slurry, and metallization method using the slurry
App 20020019128 - Lee, Jong-Won ; et al. | 2002-02-14 |
Cleaning solution for removing damaged portion of ferroelectric layer and cleaning method using the same
App 20020003123 - Lee, Kwang-wook ; et al. | 2002-01-10 |
Method and apparatus for supplying chemical-mechanical polishing slurries
App 20010044265 - Kim, Jung-yup ; et al. | 2001-11-22 |
Method for planarizing a semiconductor device using ceria-based slurry
App 20010024879 - Kim, Jung-yup ; et al. | 2001-09-27 |
Semiconductor device manufacturing apparatus having controller detecting function of filter
Grant 6,254,767 - Shin , et al. July 3, 2 | 2001-07-03 |
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