loadpatents
name:-0.031714916229248
name:-0.016883850097656
name:-0.0071439743041992
Ha; Sungwon Patent Filings

Ha; Sungwon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ha; Sungwon.The latest application filed is for "processing chamber deposition confinement".

Company Profile
6.7.16
  • Ha; Sungwon - Palo Alto CA
  • Ha; Sungwon - San Jose CA
  • Ha; Sungwon - Mountain View CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Processing Chamber Deposition Confinement
App 20220130650 - Bobek; Sarah Michelle ;   et al.
2022-04-28
Chamber Configurations And Processes For Particle Control
App 20220122823 - Wu; Fei ;   et al.
2022-04-21
Plasma processing using multiple radio frequency power feeds for improved uniformity
Grant 11,276,562 - Ye , et al. March 15, 2
2022-03-15
Systems And Methods For Faceplate Temperature Control
App 20220020612 - Parimi; Venkata Sharat Chandra ;   et al.
2022-01-20
Targeted Heat Control Systems
App 20210202218 - Parimi; Venkata Sharat Chandra ;   et al.
2021-07-01
Radiation Shield Modification For Improving Substrate Temperature Uniformity
App 20210166921 - Neville; Elizabeth ;   et al.
2021-06-03
Plasma-enhanced Chemical Vapor Deposition Of Carbon Hard-mask
App 20210043455 - KWON; Byung Seok ;   et al.
2021-02-11
Process Chamber With Reduced Plasma Arc
App 20200365370 - WU; Fei ;   et al.
2020-11-19
Pedestal For Substrate Processing Chambers
App 20200224310 - BOBEK; Sarah Michelle ;   et al.
2020-07-16
Plasma Processing Using Multiple Radio Frequency Power Feeds For Improved Uniformity
App 20200203132 - YE; Zheng John ;   et al.
2020-06-25
Plasma processing using multiple radio frequency power feeds for improved uniformity
Grant 10,580,623 - Ye , et al.
2020-03-03
Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition system
Grant 10,403,535 - Ye , et al. Sep
2019-09-03
Edge hump reduction faceplate by plasma modulation
Grant 10,100,408 - Ha , et al. October 16, 2
2018-10-16
Uniform Wafer Temperature Achievement In Unsymmetric Chamber Environment
App 20170178758 - HA; Sungwon ;   et al.
2017-06-22
Method And Apparatus Of Processing Wafers With Compressive Or Tensile Stress At Elevated Temperatures In A Plasma Enhanced Chemical Vapor Deposition System
App 20160049323 - YE; Zheng John ;   et al.
2016-02-18
Edge Hump Reduction Faceplate By Plasma Modulation
App 20150247237 - HA; Sungwon ;   et al.
2015-09-03
Plasma Processing Using Multiple Radio Frequency Power Feeds For Improved Uniformity
App 20150136325 - YE; Zheng John ;   et al.
2015-05-21
Thread based scalable routing for an active router
Grant 7,145,913 - Craig , et al. December 5, 2
2006-12-05
Quality of service management for multiple connections within a network communication system
Grant 7,136,353 - Ha , et al. November 14, 2
2006-11-14
Data transport acceleration and management within a network communication system
Grant 7,099,273 - Ha , et al. August 29, 2
2006-08-29
Quality of service management for multiple connections within a network communication system
App 20030063564 - Ha, Sungwon ;   et al.
2003-04-03
Data transport acceleration and management within a network communication system
App 20020150048 - Ha, Sungwon ;   et al.
2002-10-17
Thread based scalable routing for an active router
App 20020114338 - Craig, David ;   et al.
2002-08-22

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