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Semiconductor microcooler
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Three-dimensional Microelectronic Package With Embedded Cooling Channels
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Planar Wafer Level Fan-out Of Multi-chip Modules Having Different Size Chips
App 20210091032 - Bonam; Ravi K. ; et al. | 2021-03-25 |
Planar wafer level fan-out of multi-chip modules having different size chips
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Three-dimensional microelectronic package with embedded cooling channels
Grant 10,937,764 - Sikka , et al. March 2, 2 | 2021-03-02 |
Semiconductor Wafer Having Trenches With Varied Dimensions For Multi-chip Modules
App 20210005573 - Bonam; Ravi K. ; et al. | 2021-01-07 |
Three-dimensional Microelectronic Package With Embedded Cooling Channels
App 20200294968 - Sikka; Kamal K. ; et al. | 2020-09-17 |
Semiconductor Microcooler
App 20200161216 - Canaperi; Donald F. ; et al. | 2020-05-21 |
Direct Bonded Heterogeneous Integration Packaging Structures
App 20200144187 - Sikka; Kamal K. ; et al. | 2020-05-07 |
Semiconductor Microcooler
App 20200118904 - Canaperi; Donald F. ; et al. | 2020-04-16 |
Direct bonded heterogeneous integration packaging structures
Grant 10,580,738 - Sikka , et al. | 2020-03-03 |
Semiconductor Microcooler
App 20200051896 - Canaperi; Donald F. ; et al. | 2020-02-13 |
Semiconductor Microcooler
App 20200051886 - Canaperi; Donald F. ; et al. | 2020-02-13 |
Semiconductor microcooler
Grant 10,553,522 - Canaperi , et al. Fe | 2020-02-04 |
Semiconductor microcooler
Grant 10,553,516 - Canaperi , et al. Fe | 2020-02-04 |
Copper microcooler structure and fabrication
Grant 10,490,480 - Lie , et al. Nov | 2019-11-26 |
Copper microcooler structure and fabrication
Grant 10,490,481 - Lie , et al. Nov | 2019-11-26 |
Direct Bonded Heterogeneous Integration Packaging Structures
App 20190295952 - Sikka; Kamal K. ; et al. | 2019-09-26 |
Machine readable products for single pass parallel hierarchical timing closure of integrated circuit designs
Grant 9,165,098 - Bhardwaj , et al. October 20, 2 | 2015-10-20 |
Multi-phase models for timing closure of integrated circuit designs
Grant 9,152,742 - Gupta , et al. October 6, 2 | 2015-10-06 |
Catheter with Gills
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Circuit design system and method of generating hierarchical block-level timing constraints from chip-level timing constraints
Grant 8,977,994 - Levitsky , et al. March 10, 2 | 2015-03-10 |
Methods for single pass parallel hierarchical timing closure of integrated circuit designs
Grant 8,935,642 - Bhardwaj , et al. January 13, 2 | 2015-01-13 |
Multi-phase models for timing closure of integrated circuit designs
Grant 8,640,066 - Gupta , et al. January 28, 2 | 2014-01-28 |
Systems for single pass parallel hierarchical timing closure of integrated circuit designs
Grant 8,539,402 - Bhardwaj , et al. September 17, 2 | 2013-09-17 |
Flow methodology for single pass parallel hierarchical timing closure of integrated circuit designs
Grant 8,365,113 - Bhardwaj , et al. January 29, 2 | 2013-01-29 |
Optical assemblies for transmitting and manipulating optical beams
Grant 8,089,133 - Gupta , et al. January 3, 2 | 2012-01-03 |
System and method of generating hierarchical block-level timing constraints from chip-level timing constraints
Grant 7,926,011 - Levitsky , et al. April 12, 2 | 2011-04-12 |
Methods and apparatus for deskewing VCAT/LCAS members
Grant 7,672,315 - Gupta , et al. March 2, 2 | 2010-03-02 |
Refractory metal core coatings
Grant 7,575,039 - Beals , et al. August 18, 2 | 2009-08-18 |
Combined hardware and software implementation of link capacity adjustment scheme (LCAS) in SONET (synchronous optical network) virtual concatenation (VCAT)
Grant 7,558,287 - Malik , et al. July 7, 2 | 2009-07-07 |
Refractory Metal Core Coatings
App 20090114797 - Beals; James T. ; et al. | 2009-05-07 |
Methods and apparatus for deskewing VCAT/LCAS members
App 20070047593 - Gupta; Dinesh ; et al. | 2007-03-01 |
Combined hardware and software implementation of link capacity adjustment scheme (LCAS) in SONET (synchronous optical network) virtual concatenation (VCAT)
App 20070047594 - Malik; Rakesh Kumar ; et al. | 2007-03-01 |
Optical assemblies for transmitting and manipulating optical beams
App 20050078376 - Gupta, Dinesh ; et al. | 2005-04-14 |
Optical assemblies for transmitting and manipulating optical beams
Grant 6,836,015 - Denneau , et al. December 28, 2 | 2004-12-28 |
Optical Assemblies For Transmitting And Manipulating Optical Beams
App 20040217464 - Denneau, Monty M. ; et al. | 2004-11-04 |
Apparatus and method for repairing electronic packages
Grant 6,713,686 - Becker , et al. March 30, 2 | 2004-03-30 |
Screening mask having a stress-relieving area
Grant 6,662,718 - Barrington , et al. December 16, 2 | 2003-12-16 |
Screening method for double pass screening
Grant 6,631,675 - Brody , et al. October 14, 2 | 2003-10-14 |
Hybrid thermal barrier coating and method of making the same
App 20030152814 - Gupta, Dinesh ; et al. | 2003-08-14 |
Apparatus and method for repairing electronic packages
App 20030136581 - Becker, Wiren D. ; et al. | 2003-07-24 |
Screening mask having a stress-relieving area
App 20030004076 - Barrington, Evelyn ; et al. | 2003-01-02 |
Mask and screening method for double pass screening
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Pre-patterned substrate layers for being personalized as needed
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Pre-patterned substrate layers for being personalized as needed
Grant 6,341,417 - Gupta , et al. January 29, 2 | 2002-01-29 |
Process For Screening Features On An Electronic Substrate With A Low Viscosity Paste
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Multilayer ceramic substrates having internal capacitor, and process for producing same
Grant 5,655,209 - Casey , et al. August 5, 1 | 1997-08-05 |
Method for making ceramic substrates from thin and thick ceramic greensheets
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Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
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