Patent | Date |
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Methods And Apparatus For Processing A Substrate App 20220310364 - CHONG; Halbert ;   et al. | 2022-09-29 |
Methods And Apparatus For Processing A Substrate App 20220310363 - CHONG; Halbert ;   et al. | 2022-09-29 |
Film stack overlay improvement Grant 11,339,475 - Han , et al. May 24, 2 | 2022-05-24 |
Analyzing In-plane Distortion App 20220138396 - Wang; Wenjiao ;   et al. | 2022-05-05 |
Physical vapor deposition (PVD) chamber with in situ chamber cleaning capability Grant 11,289,312 - Allen , et al. March 29, 2 | 2022-03-29 |
On stack overlay improvement for 3D NAND Grant 11,276,569 - Lin , et al. March 15, 2 | 2022-03-15 |
Directional Selective Junction Clean With Field Polymer Protections App 20210366722 - Lei; Yu ;   et al. | 2021-11-25 |
Metal Oxide Preclean Chamber With Improved Selectivity And Flow Conductance App 20210343508 - NGUYEN; Andrew ;   et al. | 2021-11-04 |
Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutions Grant 11,152,248 - Liang , et al. October 19, 2 | 2021-10-19 |
Methods And Apparatus For Processing A Substrate App 20210319989 - CHONG; Halbert ;   et al. | 2021-10-14 |
Physical Vapor Deposition (pvd) Chamber With In Situ Chamber Cleaning Capability App 20200395198 - ALLEN; ADOLPH M. ;   et al. | 2020-12-17 |
High Pressure Rf-dc Sputtering And Methods To Improve Film Uniformity And Step-coverage Of This Process App 20200357616 - ALLEN; Adolph Miller ;   et al. | 2020-11-12 |
Electrostatic chuck with variable pixelated magnetic field Grant 10,790,180 - Hsu , et al. September 29, 2 | 2020-09-29 |
Cyclic Flowable Deposition And High-density Plasma Treatment Processes For High Quality Gap Fill Solutions App 20200286773 - LIANG; Jingmei ;   et al. | 2020-09-10 |
High pressure RF-DC sputtering and methods to improve film uniformity and step-coverage of this process Grant 10,763,090 - Allen , et al. Sep | 2020-09-01 |
Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutions Grant 10,707,116 - Liang , et al. | 2020-07-07 |
Film Stack Overlay Improvement For 3d Nand Application App 20200173022 - HAN; Xinhai ;   et al. | 2020-06-04 |
Magnetic Housing Systems App 20200144029 - GANDIKOTA; Srinivas ;   et al. | 2020-05-07 |
Oxide with higher utilization and lower cost Grant 10,595,477 - Guo , et al. | 2020-03-24 |
Single oxide metal deposition chamber Grant 10,597,785 - Subramani , et al. | 2020-03-24 |
Sputtering showerhead Grant 10,577,689 - Subramani , et al. | 2020-03-03 |
On Stack Overlay Improvement For 3d Nand App 20200043723 - LIN; Yongjing ;   et al. | 2020-02-06 |
Power deposition control in inductively coupled plasma (ICP) reactors Grant 10,553,398 - Banna , et al. Fe | 2020-02-04 |
Processing chamber with irradiance curing lens Grant 10,541,159 - Trejo , et al. Ja | 2020-01-21 |
Electrostatic Chuck With Variable Pixelated Magnetic Field App 20200013661 - Hsu; Chih-Hsun ;   et al. | 2020-01-09 |
Dry etch rate reduction of silicon nitride films Grant 10,515,796 - Tsiang , et al. Dec | 2019-12-24 |
Electrostatic chuck with variable pixelated magnetic field Grant 10,460,968 - Hsu , et al. Oc | 2019-10-29 |
Systems and methods for electrical and magnetic uniformity and skew tuning in plasma processing reactors Grant 10,410,889 - Sadjadi , et al. Sept | 2019-09-10 |
Treatment Methods For Silicon Nitride Thin Films App 20190233940 - GUO; Jinrui ;   et al. | 2019-08-01 |
Dry Etch Rate Reduction Of Silicon Nitride Films App 20190157077 - TSIANG; Michael Wenyoung ;   et al. | 2019-05-23 |
Magnet configurations for radial uniformity tuning of ICP plasmas Grant 10,249,479 - Aubuchon , et al. | 2019-04-02 |
Oxide With Higher Utilization And Lower Cost App 20190074176 - GUO; Lei ;   et al. | 2019-03-07 |
Cyclic Flowable Deposition And High-density Plasma Treatment Processes For High Quality Gap Fill Solutions App 20180330980 - LIANG; Jingmei ;   et al. | 2018-11-15 |
Method and apparatus for controlling a magnetic field in a plasma chamber Grant 10,115,566 - Lane , et al. October 30, 2 | 2018-10-30 |
Dual radio-frequency tuner for process control of a plasma process Grant 10,109,462 - Hammond, IV , et al. October 23, 2 | 2018-10-23 |
Dual Radio-frequency Tuner For Process Control Of A Plasma Process App 20180261431 - HAMMOND, IV; Edward P. ;   et al. | 2018-09-13 |
Sputtering target for PVD chamber Grant 10,060,024 - Liu , et al. August 28, 2 | 2018-08-28 |
Sputtering Showerhead App 20180087155 - SUBRAMANI; Anantha K. ;   et al. | 2018-03-29 |
Single Oxide Metal Deposition Chamber App 20180073150 - SUBRAMANI; Anantha K. ;   et al. | 2018-03-15 |
Sputtering Target for PVD Chamber App 20170350001 - Liu; Zhendong ;   et al. | 2017-12-07 |
Processing Chamber With Irradiance Curing Lens App 20170345649 - TREJO; Orlando ;   et al. | 2017-11-30 |
Electromagnetic dipole for plasma density tuning in a substrate processing chamber Grant 9,779,953 - Aubuchon , et al. October 3, 2 | 2017-10-03 |
Sputtering target for PVD chamber Grant 9,752,228 - Liu , et al. September 5, 2 | 2017-09-05 |
Sputter Source For Semiconductor Process Chambers App 20170211175 - SUBRAMANI; ANANTHA K. ;   et al. | 2017-07-27 |
Method And Apparatus For Controlling A Magnetic Field In A Plasma Chamber App 20170162365 - LANE; STEVEN ;   et al. | 2017-06-08 |
Tunable magnetic field to improve uniformity Grant 9,646,843 - Nguyen , et al. May 9, 2 | 2017-05-09 |
Sputter source for semiconductor process chambers Grant 9,620,339 - Subramani , et al. April 11, 2 | 2017-04-11 |
Method and apparatus for controlling a magnetic field in a plasma chamber Grant 9,613,783 - Lane , et al. April 4, 2 | 2017-04-04 |
High Pressure Rf-dc Sputtering And Methods To Improve Film Uniformity And Step-coverage Of This Process App 20170029941 - ALLEN; Adolph Miller ;   et al. | 2017-02-02 |
High density TiN RF/DC PVD deposition with stress tuning Grant 9,499,901 - Cao , et al. November 22, 2 | 2016-11-22 |
Magnet Configurations For Radial Uniformity Tuning Of Icp Plasmas App 20160225590 - Aubuchon; Joseph F. ;   et al. | 2016-08-04 |
Tunable Magnetic Field To Improve Uniformity App 20160163511 - NGUYEN; Andrew ;   et al. | 2016-06-09 |
Method And Apparatus For Controlling A Magnetic Field In A Plasma Chamber App 20160027613 - LANE; STEVEN ;   et al. | 2016-01-28 |
Systems And Methods For Electrical And Magnetic Uniformity And Skew Tuning In Plasma Processing Reactors App 20160027667 - SADJADI; S. M. REZA ;   et al. | 2016-01-28 |
Methods For Extending Chamber Component Life For Plasma Processing Semiconductor Applications App 20150294843 - CHEN; Feng ;   et al. | 2015-10-15 |
Electrostatic Chuck With Variable Pixelated Magnetic Field App 20150155193 - Hsu; Chih-Hsun ;   et al. | 2015-06-04 |
Magnetron design for extended target life in radio frequency (RF) plasmas Grant 9,028,659 - Ritchie , et al. May 12, 2 | 2015-05-12 |
Method for ultra-uniform sputter deposition using simultaneous RF and DC power on target Grant 8,992,741 - Wang , et al. March 31, 2 | 2015-03-31 |
Electromagnetic Dipole For Plasma Density Tuning In A Substrate Processing Chamber App 20150087157 - AUBUCHON; JOSEPH F. ;   et al. | 2015-03-26 |
Power Deposition Control In Inductively Coupled Plasma (icp) Reactors App 20150068682 - BANNA; SAMER ;   et al. | 2015-03-12 |
Electromagnet array in a sputter reactor Grant 8,871,064 - Gung , et al. October 28, 2 | 2014-10-28 |
Methods for forming interconnect structures Grant 8,841,211 - Lee , et al. September 23, 2 | 2014-09-23 |
Sputter Source For Semiconductor Process Chambers App 20140262767 - SUBRAMANI; Anantha K. ;   et al. | 2014-09-18 |
Skew Elimination And Control In A Plasma Enhanced Substrate Processing Chamber App 20140209244 - BANNA; SAMER ;   et al. | 2014-07-31 |
Mechanism for continuously varying radial position of a magnetron Grant 8,685,215 - Miller , et al. April 1, 2 | 2014-04-01 |
Magnetron Design For Extended Target Life In Radio Frequency (rf) Plasmas App 20140042023 - RITCHIE; ALAN ;   et al. | 2014-02-13 |
Magnetron design for RF/DC physical vapor deposition Grant 8,580,094 - Wang , et al. November 12, 2 | 2013-11-12 |
Sputtering chamber having auxiliary backside magnet to improve etch uniformity and magnetron producing sustained self sputtering of ruthenium and tantalum Grant 8,557,094 - Tang , et al. October 15, 2 | 2013-10-15 |
HIGH DENSITY TiN RF/DC PVD DEPOSITION WITH STRESS TUNING App 20130199925 - CAO; YONG ;   et al. | 2013-08-08 |
Methods of forming layers on substrates Grant 8,476,162 - Ha , et al. July 2, 2 | 2013-07-02 |
Pvd Process With Synchronized Process Parameters And Magnet Position App 20120181166 - LUO; QIAN ;   et al. | 2012-07-19 |
Methods Of Forming Layers On Substrates App 20120108058 - HA; TAE HONG ;   et al. | 2012-05-03 |
Magnetron Design For Rf/dc Physical Vapor Deposition App 20110311735 - WANG; RONGJUN ;   et al. | 2011-12-22 |
Methods For Forming Interconnect Structures App 20110306200 - LEE; JOUNG JOO ;   et al. | 2011-12-15 |
Method to modulate coverage of barrier and seed layer using titanium nitride Grant 7,829,456 - Lam , et al. November 9, 2 | 2010-11-09 |
High Pressure Rf-dc Sputtering And Methods To Improve Film Uniformity And Step-coverage Of This Process App 20100252417 - Allen; Adolph Miller ;   et al. | 2010-10-07 |
Sputtering Target for PVD Chamber App 20100252416 - Liu; Zhendong ;   et al. | 2010-10-07 |
Mechanism for continuously varying radial position of a magnetron App 20100243440 - Miller; Keith A. ;   et al. | 2010-09-30 |
Position controlled dual magnetron Grant 7,767,064 - Pavloff , et al. August 3, 2 | 2010-08-03 |
Electromagnet array in a sputter reactor App 20100155223 - GUNG; Tza-Jing ;   et al. | 2010-06-24 |
Magnetron having continuously variable radial position Grant 7,736,473 - Miller , et al. June 15, 2 | 2010-06-15 |
Method To Modulate Coverage Of Barrier And Seed Layer Using Titanium Nitride App 20100105204 - LAM; WINSOR ;   et al. | 2010-04-29 |
Pvd Cu Seed Overhang Re-sputtering With Enhanced Cu Ionization App 20100096253 - Cao; Yong ;   et al. | 2010-04-22 |
Multi-step process for forming a metal barrier in a sputter reactor Grant 7,686,926 - Gung , et al. March 30, 2 | 2010-03-30 |
Pressure switched dual magnetron Grant 7,686,928 - Gung March 30, 2 | 2010-03-30 |
Method For Ultra-uniform Sputter Deposition Using Simultaneous Rf And Dc Power On Target App 20100032289 - WANG; RONGJUN ;   et al. | 2010-02-11 |
Apparatus And Method For Uniform Deposition App 20090308732 - Cao; Yong ;   et al. | 2009-12-17 |
Shields usable with an inductively coupled plasma reactor Grant 7,569,125 - Gung , et al. August 4, 2 | 2009-08-04 |
Variable quadruple electromagnet array in plasma processing Grant 7,527,713 - Gung , et al. May 5, 2 | 2009-05-05 |
Resputtered Copper Seed Layer App 20080190760 - TANG; XIANMIN ;   et al. | 2008-08-14 |
Position Controlled Dual Magnetron App 20080099329 - Pavloff; Cristopher M. ;   et al. | 2008-05-01 |
Sputtering Chamber Having Auxiliary Backside Magnet to Improve Etch Uniformity and Magnetron Producing Sustained Self Sputtering of Ruthenium and Tantalum App 20080083610 - Tang; Xianmin ;   et al. | 2008-04-10 |
Multi-track magnetron exhibiting more uniform deposition and reduced rotational asymmetry Grant 7,186,319 - Yang , et al. March 6, 2 | 2007-03-06 |
Multi-track magnetron exhibiting more uniform deposition and reduced rotational asymmetry App 20060144703 - Yang; Hong S. ;   et al. | 2006-07-06 |
Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith Grant 7,041,201 - Gung , et al. May 9, 2 | 2006-05-09 |
Magnetron having continuously variable radial position App 20060076232 - Miller; Keith A. ;   et al. | 2006-04-13 |
Selectable dual position magnetron Grant 7,018,515 - Gung , et al. March 28, 2 | 2006-03-28 |
Pressure switched dual magnetron App 20060060470 - Gung; Tza-Jing | 2006-03-23 |
Multi-step process for forming a metal barrier in a sputter reactor App 20050263390 - Gung, Tza-Jing ;   et al. | 2005-12-01 |
Variable quadruple electromagnet array in plasma processing App 20050263389 - Gung, Tza-Jing ;   et al. | 2005-12-01 |
Selectable dual position magnetron App 20050211548 - Gung, Tza-Jing ;   et al. | 2005-09-29 |
Shields usable with an inductively coupled plasma reactor App 20050199491 - Gung, Tza-Jing ;   et al. | 2005-09-15 |
Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith App 20040055880 - Gung, Tza-Jing ;   et al. | 2004-03-25 |
Tubular magnet as center pole in unbalanced sputtering magnetron Grant 6,663,754 - Gung December 16, 2 | 2003-12-16 |
Auxiliary vertical magnet outside a nested unbalanced magnetron Grant 6,491,801 - Gung December 10, 2 | 2002-12-10 |
Tubular magnet as center pole in unbalanced sputtering magnetron App 20020175074 - Gung, Tza-Jing | 2002-11-28 |