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Gung; Tza-Jing Patent Filings

Gung; Tza-Jing

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gung; Tza-Jing.The latest application filed is for "methods and apparatus for processing a substrate".

Company Profile
19.53.62
  • Gung; Tza-Jing - San Jose CA
  • Gung; Tza-Jing - Sunnyvale CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Methods And Apparatus For Processing A Substrate
App 20220310364 - CHONG; Halbert ;   et al.
2022-09-29
Methods And Apparatus For Processing A Substrate
App 20220310363 - CHONG; Halbert ;   et al.
2022-09-29
Film stack overlay improvement
Grant 11,339,475 - Han , et al. May 24, 2
2022-05-24
Analyzing In-plane Distortion
App 20220138396 - Wang; Wenjiao ;   et al.
2022-05-05
Physical vapor deposition (PVD) chamber with in situ chamber cleaning capability
Grant 11,289,312 - Allen , et al. March 29, 2
2022-03-29
On stack overlay improvement for 3D NAND
Grant 11,276,569 - Lin , et al. March 15, 2
2022-03-15
Directional Selective Junction Clean With Field Polymer Protections
App 20210366722 - Lei; Yu ;   et al.
2021-11-25
Metal Oxide Preclean Chamber With Improved Selectivity And Flow Conductance
App 20210343508 - NGUYEN; Andrew ;   et al.
2021-11-04
Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutions
Grant 11,152,248 - Liang , et al. October 19, 2
2021-10-19
Methods And Apparatus For Processing A Substrate
App 20210319989 - CHONG; Halbert ;   et al.
2021-10-14
Physical Vapor Deposition (pvd) Chamber With In Situ Chamber Cleaning Capability
App 20200395198 - ALLEN; ADOLPH M. ;   et al.
2020-12-17
High Pressure Rf-dc Sputtering And Methods To Improve Film Uniformity And Step-coverage Of This Process
App 20200357616 - ALLEN; Adolph Miller ;   et al.
2020-11-12
Electrostatic chuck with variable pixelated magnetic field
Grant 10,790,180 - Hsu , et al. September 29, 2
2020-09-29
Cyclic Flowable Deposition And High-density Plasma Treatment Processes For High Quality Gap Fill Solutions
App 20200286773 - LIANG; Jingmei ;   et al.
2020-09-10
High pressure RF-DC sputtering and methods to improve film uniformity and step-coverage of this process
Grant 10,763,090 - Allen , et al. Sep
2020-09-01
Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutions
Grant 10,707,116 - Liang , et al.
2020-07-07
Film Stack Overlay Improvement For 3d Nand Application
App 20200173022 - HAN; Xinhai ;   et al.
2020-06-04
Magnetic Housing Systems
App 20200144029 - GANDIKOTA; Srinivas ;   et al.
2020-05-07
Oxide with higher utilization and lower cost
Grant 10,595,477 - Guo , et al.
2020-03-24
Single oxide metal deposition chamber
Grant 10,597,785 - Subramani , et al.
2020-03-24
Sputtering showerhead
Grant 10,577,689 - Subramani , et al.
2020-03-03
On Stack Overlay Improvement For 3d Nand
App 20200043723 - LIN; Yongjing ;   et al.
2020-02-06
Power deposition control in inductively coupled plasma (ICP) reactors
Grant 10,553,398 - Banna , et al. Fe
2020-02-04
Processing chamber with irradiance curing lens
Grant 10,541,159 - Trejo , et al. Ja
2020-01-21
Electrostatic Chuck With Variable Pixelated Magnetic Field
App 20200013661 - Hsu; Chih-Hsun ;   et al.
2020-01-09
Dry etch rate reduction of silicon nitride films
Grant 10,515,796 - Tsiang , et al. Dec
2019-12-24
Electrostatic chuck with variable pixelated magnetic field
Grant 10,460,968 - Hsu , et al. Oc
2019-10-29
Systems and methods for electrical and magnetic uniformity and skew tuning in plasma processing reactors
Grant 10,410,889 - Sadjadi , et al. Sept
2019-09-10
Treatment Methods For Silicon Nitride Thin Films
App 20190233940 - GUO; Jinrui ;   et al.
2019-08-01
Dry Etch Rate Reduction Of Silicon Nitride Films
App 20190157077 - TSIANG; Michael Wenyoung ;   et al.
2019-05-23
Magnet configurations for radial uniformity tuning of ICP plasmas
Grant 10,249,479 - Aubuchon , et al.
2019-04-02
Oxide With Higher Utilization And Lower Cost
App 20190074176 - GUO; Lei ;   et al.
2019-03-07
Cyclic Flowable Deposition And High-density Plasma Treatment Processes For High Quality Gap Fill Solutions
App 20180330980 - LIANG; Jingmei ;   et al.
2018-11-15
Method and apparatus for controlling a magnetic field in a plasma chamber
Grant 10,115,566 - Lane , et al. October 30, 2
2018-10-30
Dual radio-frequency tuner for process control of a plasma process
Grant 10,109,462 - Hammond, IV , et al. October 23, 2
2018-10-23
Dual Radio-frequency Tuner For Process Control Of A Plasma Process
App 20180261431 - HAMMOND, IV; Edward P. ;   et al.
2018-09-13
Sputtering target for PVD chamber
Grant 10,060,024 - Liu , et al. August 28, 2
2018-08-28
Sputtering Showerhead
App 20180087155 - SUBRAMANI; Anantha K. ;   et al.
2018-03-29
Single Oxide Metal Deposition Chamber
App 20180073150 - SUBRAMANI; Anantha K. ;   et al.
2018-03-15
Sputtering Target for PVD Chamber
App 20170350001 - Liu; Zhendong ;   et al.
2017-12-07
Processing Chamber With Irradiance Curing Lens
App 20170345649 - TREJO; Orlando ;   et al.
2017-11-30
Electromagnetic dipole for plasma density tuning in a substrate processing chamber
Grant 9,779,953 - Aubuchon , et al. October 3, 2
2017-10-03
Sputtering target for PVD chamber
Grant 9,752,228 - Liu , et al. September 5, 2
2017-09-05
Sputter Source For Semiconductor Process Chambers
App 20170211175 - SUBRAMANI; ANANTHA K. ;   et al.
2017-07-27
Method And Apparatus For Controlling A Magnetic Field In A Plasma Chamber
App 20170162365 - LANE; STEVEN ;   et al.
2017-06-08
Tunable magnetic field to improve uniformity
Grant 9,646,843 - Nguyen , et al. May 9, 2
2017-05-09
Sputter source for semiconductor process chambers
Grant 9,620,339 - Subramani , et al. April 11, 2
2017-04-11
Method and apparatus for controlling a magnetic field in a plasma chamber
Grant 9,613,783 - Lane , et al. April 4, 2
2017-04-04
High Pressure Rf-dc Sputtering And Methods To Improve Film Uniformity And Step-coverage Of This Process
App 20170029941 - ALLEN; Adolph Miller ;   et al.
2017-02-02
High density TiN RF/DC PVD deposition with stress tuning
Grant 9,499,901 - Cao , et al. November 22, 2
2016-11-22
Magnet Configurations For Radial Uniformity Tuning Of Icp Plasmas
App 20160225590 - Aubuchon; Joseph F. ;   et al.
2016-08-04
Tunable Magnetic Field To Improve Uniformity
App 20160163511 - NGUYEN; Andrew ;   et al.
2016-06-09
Method And Apparatus For Controlling A Magnetic Field In A Plasma Chamber
App 20160027613 - LANE; STEVEN ;   et al.
2016-01-28
Systems And Methods For Electrical And Magnetic Uniformity And Skew Tuning In Plasma Processing Reactors
App 20160027667 - SADJADI; S. M. REZA ;   et al.
2016-01-28
Methods For Extending Chamber Component Life For Plasma Processing Semiconductor Applications
App 20150294843 - CHEN; Feng ;   et al.
2015-10-15
Electrostatic Chuck With Variable Pixelated Magnetic Field
App 20150155193 - Hsu; Chih-Hsun ;   et al.
2015-06-04
Magnetron design for extended target life in radio frequency (RF) plasmas
Grant 9,028,659 - Ritchie , et al. May 12, 2
2015-05-12
Method for ultra-uniform sputter deposition using simultaneous RF and DC power on target
Grant 8,992,741 - Wang , et al. March 31, 2
2015-03-31
Electromagnetic Dipole For Plasma Density Tuning In A Substrate Processing Chamber
App 20150087157 - AUBUCHON; JOSEPH F. ;   et al.
2015-03-26
Power Deposition Control In Inductively Coupled Plasma (icp) Reactors
App 20150068682 - BANNA; SAMER ;   et al.
2015-03-12
Electromagnet array in a sputter reactor
Grant 8,871,064 - Gung , et al. October 28, 2
2014-10-28
Methods for forming interconnect structures
Grant 8,841,211 - Lee , et al. September 23, 2
2014-09-23
Sputter Source For Semiconductor Process Chambers
App 20140262767 - SUBRAMANI; Anantha K. ;   et al.
2014-09-18
Skew Elimination And Control In A Plasma Enhanced Substrate Processing Chamber
App 20140209244 - BANNA; SAMER ;   et al.
2014-07-31
Mechanism for continuously varying radial position of a magnetron
Grant 8,685,215 - Miller , et al. April 1, 2
2014-04-01
Magnetron Design For Extended Target Life In Radio Frequency (rf) Plasmas
App 20140042023 - RITCHIE; ALAN ;   et al.
2014-02-13
Magnetron design for RF/DC physical vapor deposition
Grant 8,580,094 - Wang , et al. November 12, 2
2013-11-12
Sputtering chamber having auxiliary backside magnet to improve etch uniformity and magnetron producing sustained self sputtering of ruthenium and tantalum
Grant 8,557,094 - Tang , et al. October 15, 2
2013-10-15
HIGH DENSITY TiN RF/DC PVD DEPOSITION WITH STRESS TUNING
App 20130199925 - CAO; YONG ;   et al.
2013-08-08
Methods of forming layers on substrates
Grant 8,476,162 - Ha , et al. July 2, 2
2013-07-02
Pvd Process With Synchronized Process Parameters And Magnet Position
App 20120181166 - LUO; QIAN ;   et al.
2012-07-19
Methods Of Forming Layers On Substrates
App 20120108058 - HA; TAE HONG ;   et al.
2012-05-03
Magnetron Design For Rf/dc Physical Vapor Deposition
App 20110311735 - WANG; RONGJUN ;   et al.
2011-12-22
Methods For Forming Interconnect Structures
App 20110306200 - LEE; JOUNG JOO ;   et al.
2011-12-15
Method to modulate coverage of barrier and seed layer using titanium nitride
Grant 7,829,456 - Lam , et al. November 9, 2
2010-11-09
High Pressure Rf-dc Sputtering And Methods To Improve Film Uniformity And Step-coverage Of This Process
App 20100252417 - Allen; Adolph Miller ;   et al.
2010-10-07
Sputtering Target for PVD Chamber
App 20100252416 - Liu; Zhendong ;   et al.
2010-10-07
Mechanism for continuously varying radial position of a magnetron
App 20100243440 - Miller; Keith A. ;   et al.
2010-09-30
Position controlled dual magnetron
Grant 7,767,064 - Pavloff , et al. August 3, 2
2010-08-03
Electromagnet array in a sputter reactor
App 20100155223 - GUNG; Tza-Jing ;   et al.
2010-06-24
Magnetron having continuously variable radial position
Grant 7,736,473 - Miller , et al. June 15, 2
2010-06-15
Method To Modulate Coverage Of Barrier And Seed Layer Using Titanium Nitride
App 20100105204 - LAM; WINSOR ;   et al.
2010-04-29
Pvd Cu Seed Overhang Re-sputtering With Enhanced Cu Ionization
App 20100096253 - Cao; Yong ;   et al.
2010-04-22
Multi-step process for forming a metal barrier in a sputter reactor
Grant 7,686,926 - Gung , et al. March 30, 2
2010-03-30
Pressure switched dual magnetron
Grant 7,686,928 - Gung March 30, 2
2010-03-30
Method For Ultra-uniform Sputter Deposition Using Simultaneous Rf And Dc Power On Target
App 20100032289 - WANG; RONGJUN ;   et al.
2010-02-11
Apparatus And Method For Uniform Deposition
App 20090308732 - Cao; Yong ;   et al.
2009-12-17
Shields usable with an inductively coupled plasma reactor
Grant 7,569,125 - Gung , et al. August 4, 2
2009-08-04
Variable quadruple electromagnet array in plasma processing
Grant 7,527,713 - Gung , et al. May 5, 2
2009-05-05
Resputtered Copper Seed Layer
App 20080190760 - TANG; XIANMIN ;   et al.
2008-08-14
Position Controlled Dual Magnetron
App 20080099329 - Pavloff; Cristopher M. ;   et al.
2008-05-01
Sputtering Chamber Having Auxiliary Backside Magnet to Improve Etch Uniformity and Magnetron Producing Sustained Self Sputtering of Ruthenium and Tantalum
App 20080083610 - Tang; Xianmin ;   et al.
2008-04-10
Multi-track magnetron exhibiting more uniform deposition and reduced rotational asymmetry
Grant 7,186,319 - Yang , et al. March 6, 2
2007-03-06
Multi-track magnetron exhibiting more uniform deposition and reduced rotational asymmetry
App 20060144703 - Yang; Hong S. ;   et al.
2006-07-06
Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith
Grant 7,041,201 - Gung , et al. May 9, 2
2006-05-09
Magnetron having continuously variable radial position
App 20060076232 - Miller; Keith A. ;   et al.
2006-04-13
Selectable dual position magnetron
Grant 7,018,515 - Gung , et al. March 28, 2
2006-03-28
Pressure switched dual magnetron
App 20060060470 - Gung; Tza-Jing
2006-03-23
Multi-step process for forming a metal barrier in a sputter reactor
App 20050263390 - Gung, Tza-Jing ;   et al.
2005-12-01
Variable quadruple electromagnet array in plasma processing
App 20050263389 - Gung, Tza-Jing ;   et al.
2005-12-01
Selectable dual position magnetron
App 20050211548 - Gung, Tza-Jing ;   et al.
2005-09-29
Shields usable with an inductively coupled plasma reactor
App 20050199491 - Gung, Tza-Jing ;   et al.
2005-09-15
Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith
App 20040055880 - Gung, Tza-Jing ;   et al.
2004-03-25
Tubular magnet as center pole in unbalanced sputtering magnetron
Grant 6,663,754 - Gung December 16, 2
2003-12-16
Auxiliary vertical magnet outside a nested unbalanced magnetron
Grant 6,491,801 - Gung December 10, 2
2002-12-10
Tubular magnet as center pole in unbalanced sputtering magnetron
App 20020175074 - Gung, Tza-Jing
2002-11-28

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