Goodner; Michael D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Goodner; Michael D..The latest application filed is for "buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer".

Company Profile

0.52.61

Goodner; Michael D. - Hillsboro OR
Goodner; Michael D. - Lafayette CO

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Antireflective coatings for via fill and photolithography applications and methods of preparation thereof Grant 8,992,806 - Li , et al. March 31, 2	2015-03-31
Forming semiconductor structures Grant 8,513,111 - Meagley , et al. August 20, 2	2013-08-20
Method buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer Grant 8,104,172 - Goodner , et al. January 31, 2	2012-01-31
Antireflective coatings for via fill and photolithography applications and methods of preparation thereof Grant 8,053,159 - Li , et al. November 8, 2	2011-11-08
Pixelated photoresists Grant 8,003,293 - Meagley , et al. August 23, 2	2011-08-23
Silicon-doped carbon dielectrics Grant 7,790,630 - Goodner , et al. September 7, 2	2010-09-07
Buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer App 20100210072 - Goodner; Michael D. ; et al.	2010-08-19
Buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer Grant 7,732,936 - Goodner , et al. June 8, 2	2010-06-08
Sealing porous dielectric materials Grant 7,658,975 - Kloster , et al. February 9, 2	2010-02-09
Photoactive resist capping layer Grant 7,615,337 - Meagley , et al. November 10, 2	2009-11-10
Method of forming air gaps in a dielectric material using a sacrificial film and resulting structures Grant 7,595,555 - Clarke , et al. September 29, 2	2009-09-29
Composite photoresist for modifying die-side bumps Grant 7,585,615 - Schultz , et al. September 8, 2	2009-09-08
Method to modulate etch rate in SLAM Grant 7,572,732 - Goodner , et al. August 11, 2	2009-08-11
Low-k dielectric layer formed from aluminosilicate precursors Grant 7,563,727 - Goodner July 21, 2	2009-07-21
Sealing porous dielectric materials Grant 7,560,165 - Kloster , et al. July 14, 2	2009-07-14
Interconnect Structure For A Microelectronic Device, Method Of Manfacturing Same, And Microelectronic Structure Containing Same App 20090133908 - Goodner; Michael D. ; et al.	2009-05-28
Forming a silicon nitride film Grant 7,470,450 - McSwiney , et al. December 30, 2	2008-12-30
Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide Grant 7,466,025 - Goodner , et al. December 16, 2	2008-12-16
Metal ion separation from aqueous solutions using photoswitchable ionophores Grant 7,452,728 - Leet , et al. November 18, 2	2008-11-18
Healing detrimental bonds in deposited materials Grant 7,439,179 - Goodner October 21, 2	2008-10-21
Organic-framework zeolite interlayer dielectrics Grant 7,365,375 - Goodner , et al. April 29, 2	2008-04-29
UV-activated dielectric layer Grant 7,358,597 - Goodner April 15, 2	2008-04-15
Photosensitive dielectric layer Grant 7,344,972 - Goodner , et al. March 18, 2	2008-03-18
Photodefinable buffer coating materials App 20080054416 - Goodner; Michael D. ; et al.	2008-03-06
Composite photoresist for modifying die-side bumps App 20080026318 - Schultz; Kurt ; et al.	2008-01-31
Using zeolites to improve the mechanical strength of low-k interlayer dielectrics Grant 7,303,989 - Boyanov , et al. December 4, 2	2007-12-04
Formation of air gaps in an interconnect structure using a thin permeable hard mask and resulting structures Grant 7,294,568 - Goodner , et al. November 13, 2	2007-11-13
Layered films formed by controlled phase segregation Grant 7,241,707 - Meagley , et al. July 10, 2	2007-07-10
Energy harvesting molecules and photoresist technology Grant 7,235,344 - Meagley , et al. June 26, 2	2007-06-26
Methods of internal stress reduction in dielectric films with chemical incorporation and structures formed thereby App 20070123059 - Haverty; Michael G. ; et al.	2007-05-31
Stacked device underfill and a method of fabrication Grant 7,180,180 - Kloster , et al. February 20, 2	2007-02-20
Forming a dielectric layer using a hydrocarbon-containing precursor App 20070032675 - Meagley; Robert P. ; et al.	2007-02-08
Forming a dielectric layer using porogens Grant 7,169,715 - Ott , et al. January 30, 2	2007-01-30
Polymer sacrificial light absorbing structure and method Grant 7,157,755 - Goodner January 2, 2	2007-01-02
Healing detrimental bonds in deposited materials App 20060292707 - Goodner; Michael D.	2006-12-28
Forming a dielectric layer using a hydrocarbon-containing precursor Grant 7,138,158 - Meagley , et al. November 21, 2	2006-11-21
Forming semiconductor structures App 20060255432 - Meagley; Robert P. ; et al.	2006-11-16
Low-temperature silicon nitride deposition Grant 7,125,582 - McSwiney , et al. October 24, 2	2006-10-24
Silicon-doped carbon dielectrics App 20060226516 - Goodner; Michael D. ; et al.	2006-10-12
Method of forming boron-doped and fluorine-doped organosilicate glass films App 20060222864 - Antonelli; George A. ; et al.	2006-10-05
Organic-framework zeolite interlayer dielectrics App 20060214303 - Goodner; Michael D. ; et al.	2006-09-28
Method to modulate etch rate in SLAM App 20060205221 - Goodner; Michael D. ; et al.	2006-09-14
Method to modulate etch rate in SLAM Grant 7,101,798 - Goodner , et al. September 5, 2	2006-09-05
Layered films formed by controlled phase segregation App 20060183348 - Meagley; Robert P. ; et al.	2006-08-17
Precursors for film formation Grant 7,071,125 - McSwiney , et al. July 4, 2	2006-07-04
Method of forming air gaps in a dielectric material using a sacrificial film Grant 7,071,091 - Clarke , et al. July 4, 2	2006-07-04
Method of forming air gaps in a dielectric material using a sacrificial film and resulting structures App 20060138663 - Clarke; James S. ; et al.	2006-06-29
Selectively growing a polymeric material on a semiconductor substrate App 20060118922 - Goodner; Michael D. ; et al.	2006-06-08
Using zeolites to improve the mechanical strength of low-k interlayer dielectrics App 20060108687 - Boyanov; Boyan ; et al.	2006-05-25
Low-k dielectric layer formed from aluminosilicate precursors App 20060097359 - Goodner; Michael D.	2006-05-11
Forming a porous dielectric layer Grant 7,034,399 - Kloster , et al. April 25, 2	2006-04-25
Selectively growing a polymeric material on a semiconductor substrate Grant 7,030,040 - Goodner , et al. April 18, 2	2006-04-18
Forming chemical vapor depositable low dielectric constant layers Grant 7,029,723 - Chen , et al. April 18, 2	2006-04-18
Electronic devices with molecular sieve layers App 20060068190 - Goodner; Michael D. ; et al.	2006-03-30
Pixelated photoresists App 20060068318 - Meagley; Robert P. ; et al.	2006-03-30
Method of forming a selectively converted inter-layer dielectric using a porogen material Grant 7,018,918 - Kloster , et al. March 28, 2	2006-03-28
Composite sacrificial material Grant 7,018,920 - Meagley , et al. March 28, 2	2006-03-28
Precursors for film formation App 20060063394 - McSwiney; Michael L. ; et al.	2006-03-23
Controlling resist profiles through substrate modification App 20060057506 - Goodner; Michael D. ; et al.	2006-03-16
Photoactive resist capping layer App 20060046206 - Meagley; Robert P. ; et al.	2006-03-02
Formation of air gaps in an interconnect structure using a thin permeable hard mask and resulting structures App 20060040492 - Goodner; Michael D. ; et al.	2006-02-23
Controlling resist profiles through substrate modification Grant 6,991,893 - Goodner , et al. January 31, 2	2006-01-31
Energy harvesting molecules and photoresist technology App 20060003253 - Meagley; Robert P. ; et al.	2006-01-05
Porous ceramic materials as low-k films in semiconductor devices App 20050287787 - Kloster, Grant M. ; et al.	2005-12-29
Metal ion separation from aqueous solutions using photoswitchable ionophores App 20050258107 - Leet, Bob E. ; et al.	2005-11-24
Substrate imprinting techniques App 20050260790 - Goodner, Michael D. ; et al.	2005-11-24
Photosensitive dielectric layer App 20050239281 - Goodner, Michael D. ; et al.	2005-10-27
Method of forming air gaps in a dielectric material using a sacrificial film and resulting structures App 20050230836 - Clarke, James S. ; et al.	2005-10-20
Sealing porous dielectric materials App 20050227094 - Kloster, Grant ; et al.	2005-10-13
Stacked device underfill and a method of fabrication Grant 6,946,384 - Kloster , et al. September 20, 2	2005-09-20
Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide App 20050179140 - Goodner, Michael D. ; et al.	2005-08-18
Antireflective coatings for via fill and photolithography applications and methods of preparation thereof App 20050171277 - Li, Bo ; et al.	2005-08-04
Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide Grant 6,924,222 - Goodner , et al. August 2, 2	2005-08-02
Forming a silicon nitride film App 20050163927 - McSwiney, Michael L. ; et al.	2005-07-28
UV-activated dielectric layer App 20050156288 - Goodner, Michael D.	2005-07-21
Polymer sacrificial light absorbing structure and method App 20050145890 - Goodner, Michael D.	2005-07-07
Positive photosensitive resin composition, process for its preparation, and semiconductor devices Grant 6,908,717 - Hirano , et al. June 21, 2	2005-06-21
Sealing porous dielectric materials App 20050129926 - Kloster, Grant ; et al.	2005-06-16
Composite sacrificial material App 20050124152 - Meagley, Robert P. ; et al.	2005-06-09
Method to modulate etch rate in SLAM App 20050106886 - Goodner, Michael D. ; et al.	2005-05-19
UV-activated dielectric layer Grant 6,893,985 - Goodner May 17, 2	2005-05-17
Reducing photoresist line edge roughness using chemically-assisted reflow App 20050084807 - Meagley, Robert P. ; et al.	2005-04-21
Increasing the etch resistance of photoresists App 20050074981 - Meagley, Robert P. ; et al.	2005-04-07
Polymer sacrificial light absorbing structure and method Grant 6,876,017 - Goodner April 5, 2	2005-04-05
Plating a conductive material on a dielectric material Grant 6,867,473 - Goodner , et al. March 15, 2	2005-03-15
Composite sacrificial material Grant 6,858,528 - Meagley , et al. February 22, 2	2005-02-22
Low-temperature silicon nitride deposition App 20050025885 - McSwiney, Michael L. ; et al.	2005-02-03
Substrate patterning integration App 20050014378 - Goodner, Michael D. ; et al.	2005-01-20
Photodefinable polymers for semiconductor applications App 20050008966 - Meagley, Robert P. ; et al.	2005-01-13
Photoresist performance through control of polymer characteristics App 20040265734 - Yueh, Wang ; et al.	2004-12-30
Stacked device underfill and a method of fabrication App 20040245634 - Kloster, Grant M. ; et al.	2004-12-09
Stacked device underfill and a method of fabrication App 20040245616 - Kloster, Grant M. ; et al.	2004-12-09
Forming a porous dielectric layer App 20040195693 - Kloster, Grant M. ; et al.	2004-10-07
UV-activated dielectric layer App 20040191696 - Goodner, Michael D.	2004-09-30
Forming a dielectric layer using porogens App 20040185679 - Ott, Andrew W. ; et al.	2004-09-23
Composite sacrificial material App 20040183203 - Meagley, Robert P. ; et al.	2004-09-23
Forming a dielectric layer using a hydrocarbon-containing precursor App 20040170760 - Meagley, Robert P. ; et al.	2004-09-02
Polymer sacrificial light absorbing structure and method App 20040157415 - Goodner, Michael D.	2004-08-12
Forming semiconductor structures App 20040145030 - Meagley, Robert P. ; et al.	2004-07-29
Photodefinable polymers for semiconductor applications App 20040131970 - Meagley, Robert P. ; et al.	2004-07-08
Forming chemical vapor depositable low dielectric constant layers App 20040130031 - Chen, Tian-An ; et al.	2004-07-08
Plating a conductive material on a dielectric material App 20040104483 - Goodner, Michael D. ; et al.	2004-06-03
Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide App 20040099952 - Goodner, Michael D. ; et al.	2004-05-27
Selectively converted inter-layer dielectric App 20040102032 - Kloster, Grant M. ; et al.	2004-05-27
Stripping cross-linked photoresists App 20040094507 - Goodner, Michael D. ; et al.	2004-05-20
Forming a porous dielectric layer Grant 6,737,365 - Kloster , et al. May 18, 2	2004-05-18
Controlling resist profiles through substrate modification App 20040086809 - Goodner, Michael D. ; et al.	2004-05-06
Selectively growing a polymeric material on a semiconductor substrate App 20040087183 - Goodner, Michael D. ; et al.	2004-05-06
Plating a conductive material on a dielectric material Grant 6,682,989 - Goodner , et al. January 27, 2	2004-01-27
Forming polymer features on a substrate Grant 6,566,280 - Meagley , et al. May 20, 2	2003-05-20
Method and material for use with dental composites for improving conversion of monomers to polymers and reducing volume shrinkage Grant 5,730,601 - Bowman , et al. March 24, 1	1998-03-24