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Ic Having Trench-based Metal-insulator-metal Capacitor App 20210327802 - Eissa; Mona M. ;   et al. | 2021-10-21 |
IC having trench-based metal-insulator-metal capacitor Grant 11,075,157 - Eissa , et al. July 27, 2 | 2021-07-27 |
Ic Having Trench-based Metal-insulator-metal Capacitor App 20210074630 - Eissa; Mona M. ;   et al. | 2021-03-11 |
Electronic devices with bond pads formed on a molybdenum layer Grant 10,840,179 - Jackson , et al. November 17, 2 | 2020-11-17 |
Structures For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip App 20200354214 - Wachtler; Kurt Peter ;   et al. | 2020-11-12 |
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip Grant 10,723,616 - Wachtler , et al. | 2020-07-28 |
Infrared sensor design using an epoxy film as an infrared absorption layer Grant 10,570,006 - Jackson , et al. Feb | 2020-02-25 |
Infrared sensor design using an epoxy film as an infrared absorption layer Grant 10,526,198 - Jackson , et al. J | 2020-01-07 |
Electronic Devices With Bond Pads Formed On A Molybdenum Layer App 20190206785 - JACKSON; Ricky Alan ;   et al. | 2019-07-04 |
Structures For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip App 20190169019 - Wachtler; Kurt Peter ;   et al. | 2019-06-06 |
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip Grant 10,233,074 - Wachtler , et al. | 2019-03-19 |
Devices with specific termination angles in titanium tungsten layers and methods for fabricating the same Grant 10,009,001 - Jiang , et al. June 26, 2 | 2018-06-26 |
Structures For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip App 20180127266 - Wachtler; Kurt Peter ;   et al. | 2018-05-10 |
Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip Grant 9,896,330 - Wachtler , et al. February 20, 2 | 2018-02-20 |
Structure And Method For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip App 20170197823 - Wachtler; Kurt Peter ;   et al. | 2017-07-13 |
Infrared Sensor Design Using An Epoxy Film As An Infrared Absorption Layer App 20170174505 - JACKSON; Ricky Alan ;   et al. | 2017-06-22 |
Enhanced Lateral Cavity Etch App 20170178916 - Goodlin; Brian E. ;   et al. | 2017-06-22 |
Enhanced lateral cavity etch Grant 9,607,847 - Goodlin , et al. March 28, 2 | 2017-03-28 |
Devices With Specific Termination Angles In Titanium Tungsten Layers And Methods For Fabricating The Same App 20170063325 - Jiang; Neng ;   et al. | 2017-03-02 |
Process to enable ferroelectric layers on large area substrates Grant 9,583,336 - Srinivasan , et al. February 28, 2 | 2017-02-28 |
Method for fabricating specific termination angles in titanium tungsten layers Grant 9,524,881 - Jiang , et al. December 20, 2 | 2016-12-20 |
Method For Fabricating Specific Termination Angles In Titanium Tungsten Layers App 20160322235 - Jiang; Neng ;   et al. | 2016-11-03 |
Adhesion of ferroelectric material to underlying conductive capacitor plate Grant 9,305,998 - Srinivasan , et al. April 5, 2 | 2016-04-05 |
Etching cavity structures in silicon under dielectric membrane Grant 9,157,807 - Meinel , et al. October 13, 2 | 2015-10-13 |
Infrared Sensor Design Using An Epoxy Film As An Infrared Absorption Layer App 20150246810 - JACKSON; Ricky Alan ;   et al. | 2015-09-03 |
Multi-step deposition of ferroelectric dielectric material Grant 8,962,350 - Srinivasan , et al. February 24, 2 | 2015-02-24 |
Multi-Step Deposition of Ferroelectric Dielectric Material App 20140225226 - Srinivasan; Bhaskar ;   et al. | 2014-08-14 |
Adhesion of Ferroelectric Material to Underlying Conductive Capacitor Plate App 20140227805 - Srinivasan; Bhaskar ;   et al. | 2014-08-14 |
Silicon microphone transducer Grant 8,617,960 - Denison , et al. December 31, 2 | 2013-12-31 |
Showerhead for CVD depositions Grant 8,551,890 - Goodlin , et al. October 8, 2 | 2013-10-08 |
Showerhead for CVD depositions Grant 8,551,248 - Goodlin , et al. October 8, 2 | 2013-10-08 |
Through Silicon Via Filling App 20130249096 - Eissa; Mona ;   et al. | 2013-09-26 |
Showerhead For Cvd Depositions App 20130240637 - Goodlin; Brian E. ;   et al. | 2013-09-19 |
Infrared Sensor Design Using An Epoxy Film As An Infrared Absorption Layer App 20120223400 - JACKSON; Ricky Alan ;   et al. | 2012-09-06 |
Showerhead For Cvd Depositions App 20120108076 - Goodlin; Brian E. ;   et al. | 2012-05-03 |
Silicon dioxide cantilever support and method for silicon etched structures Grant 8,115,272 - Meinel , et al. February 14, 2 | 2012-02-14 |
Silicon dioxide cantilever support and method for silicon etched structures Grant 8,114,779 - Meinel , et al. February 14, 2 | 2012-02-14 |
Silicon Dioxide Cantilever Support And Method For Silicon Etched Structures App 20110294246 - Meinel; Walter B. ;   et al. | 2011-12-01 |
Silicon Dioxide Cantilever Support And Method For Silicon Etched Structures App 20110291222 - Meinel; Walter B. ;   et al. | 2011-12-01 |
Showerhead for CVD Depositions App 20110256729 - Goodlin; Brian E. ;   et al. | 2011-10-20 |
Silicon dioxide cantilever support and method for silicon etched structures Grant 8,026,177 - Meinel , et al. September 27, 2 | 2011-09-27 |
Silicon Microphone Transducer App 20110158439 - Denison; Marie ;   et al. | 2011-06-30 |
TSVS Having Chemically Exposed TSV Tips for Integrated Circuit Devices App 20110018107 - Bonifield; Thomas D. ;   et al. | 2011-01-27 |
Method and structures for etching cavity in silicon under dielectric membrane App 20100327393 - Meinel; Walter B. ;   et al. | 2010-12-30 |
Silicon dioxide cantilever support and method for silicon etched structures App 20100289108 - Meinel; Walter B. ;   et al. | 2010-11-18 |
TSVS having chemically exposed TSV tips for integrated circuit devices Grant 7,833,895 - Bonifield , et al. November 16, 2 | 2010-11-16 |
Mask Overhang Reduction Or Elimination After Substrate Etch App 20090289324 - GOODLIN; BRIAN E. ;   et al. | 2009-11-26 |
Tsvs Having Chemically Exposed Tsv Tips For Integrated Circuit Devices App 20090278238 - BONIFIELD; THOMAS D. ;   et al. | 2009-11-12 |
Method for manufacturing a semiconductor device using a sidewall spacer etchback Grant 7,229,869 - Yoon , et al. June 12, 2 | 2007-06-12 |
Method for manufacturing a semiconductor device using a sidewall spacer etchback App 20060205169 - Yoon; Jong Shik ;   et al. | 2006-09-14 |
Method for manufacturing improved sidewall structures for use in semiconductor devices Grant 7,018,888 - Goodlin , et al. March 28, 2 | 2006-03-28 |
Method for manufacturing improved sidewall structures for use in semiconductor devices App 20060024872 - Goodlin; Brian E. ;   et al. | 2006-02-02 |