Goodlin; Brian E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Goodlin; Brian E..The latest application filed is for "ic having trench-based metal-insulator-metal capacitor".

Company Profile

6.28.30

Goodlin; Brian E. - Plano TX
Goodlin; Brian E. - Dallas TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ic Having Trench-based Metal-insulator-metal Capacitor App 20210327802 - Eissa; Mona M. ; et al.	2021-10-21
IC having trench-based metal-insulator-metal capacitor Grant 11,075,157 - Eissa , et al. July 27, 2	2021-07-27
Ic Having Trench-based Metal-insulator-metal Capacitor App 20210074630 - Eissa; Mona M. ; et al.	2021-03-11
Electronic devices with bond pads formed on a molybdenum layer Grant 10,840,179 - Jackson , et al. November 17, 2	2020-11-17
Structures For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip App 20200354214 - Wachtler; Kurt Peter ; et al.	2020-11-12
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip Grant 10,723,616 - Wachtler , et al.	2020-07-28
Infrared sensor design using an epoxy film as an infrared absorption layer Grant 10,570,006 - Jackson , et al. Feb	2020-02-25
Infrared sensor design using an epoxy film as an infrared absorption layer Grant 10,526,198 - Jackson , et al. J	2020-01-07
Electronic Devices With Bond Pads Formed On A Molybdenum Layer App 20190206785 - JACKSON; Ricky Alan ; et al.	2019-07-04
Structures For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip App 20190169019 - Wachtler; Kurt Peter ; et al.	2019-06-06
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip Grant 10,233,074 - Wachtler , et al.	2019-03-19
Devices with specific termination angles in titanium tungsten layers and methods for fabricating the same Grant 10,009,001 - Jiang , et al. June 26, 2	2018-06-26
Structures For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip App 20180127266 - Wachtler; Kurt Peter ; et al.	2018-05-10
Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip Grant 9,896,330 - Wachtler , et al. February 20, 2	2018-02-20
Structure And Method For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip App 20170197823 - Wachtler; Kurt Peter ; et al.	2017-07-13
Infrared Sensor Design Using An Epoxy Film As An Infrared Absorption Layer App 20170174505 - JACKSON; Ricky Alan ; et al.	2017-06-22
Enhanced Lateral Cavity Etch App 20170178916 - Goodlin; Brian E. ; et al.	2017-06-22
Enhanced lateral cavity etch Grant 9,607,847 - Goodlin , et al. March 28, 2	2017-03-28
Devices With Specific Termination Angles In Titanium Tungsten Layers And Methods For Fabricating The Same App 20170063325 - Jiang; Neng ; et al.	2017-03-02
Process to enable ferroelectric layers on large area substrates Grant 9,583,336 - Srinivasan , et al. February 28, 2	2017-02-28
Method for fabricating specific termination angles in titanium tungsten layers Grant 9,524,881 - Jiang , et al. December 20, 2	2016-12-20
Method For Fabricating Specific Termination Angles In Titanium Tungsten Layers App 20160322235 - Jiang; Neng ; et al.	2016-11-03
Adhesion of ferroelectric material to underlying conductive capacitor plate Grant 9,305,998 - Srinivasan , et al. April 5, 2	2016-04-05
Etching cavity structures in silicon under dielectric membrane Grant 9,157,807 - Meinel , et al. October 13, 2	2015-10-13
Infrared Sensor Design Using An Epoxy Film As An Infrared Absorption Layer App 20150246810 - JACKSON; Ricky Alan ; et al.	2015-09-03
Multi-step deposition of ferroelectric dielectric material Grant 8,962,350 - Srinivasan , et al. February 24, 2	2015-02-24
Multi-Step Deposition of Ferroelectric Dielectric Material App 20140225226 - Srinivasan; Bhaskar ; et al.	2014-08-14
Adhesion of Ferroelectric Material to Underlying Conductive Capacitor Plate App 20140227805 - Srinivasan; Bhaskar ; et al.	2014-08-14
Silicon microphone transducer Grant 8,617,960 - Denison , et al. December 31, 2	2013-12-31
Showerhead for CVD depositions Grant 8,551,890 - Goodlin , et al. October 8, 2	2013-10-08
Showerhead for CVD depositions Grant 8,551,248 - Goodlin , et al. October 8, 2	2013-10-08
Through Silicon Via Filling App 20130249096 - Eissa; Mona ; et al.	2013-09-26
Showerhead For Cvd Depositions App 20130240637 - Goodlin; Brian E. ; et al.	2013-09-19
Infrared Sensor Design Using An Epoxy Film As An Infrared Absorption Layer App 20120223400 - JACKSON; Ricky Alan ; et al.	2012-09-06
Showerhead For Cvd Depositions App 20120108076 - Goodlin; Brian E. ; et al.	2012-05-03
Silicon dioxide cantilever support and method for silicon etched structures Grant 8,115,272 - Meinel , et al. February 14, 2	2012-02-14
Silicon dioxide cantilever support and method for silicon etched structures Grant 8,114,779 - Meinel , et al. February 14, 2	2012-02-14
Silicon Dioxide Cantilever Support And Method For Silicon Etched Structures App 20110294246 - Meinel; Walter B. ; et al.	2011-12-01
Silicon Dioxide Cantilever Support And Method For Silicon Etched Structures App 20110291222 - Meinel; Walter B. ; et al.	2011-12-01
Showerhead for CVD Depositions App 20110256729 - Goodlin; Brian E. ; et al.	2011-10-20
Silicon dioxide cantilever support and method for silicon etched structures Grant 8,026,177 - Meinel , et al. September 27, 2	2011-09-27
Silicon Microphone Transducer App 20110158439 - Denison; Marie ; et al.	2011-06-30
TSVS Having Chemically Exposed TSV Tips for Integrated Circuit Devices App 20110018107 - Bonifield; Thomas D. ; et al.	2011-01-27
Method and structures for etching cavity in silicon under dielectric membrane App 20100327393 - Meinel; Walter B. ; et al.	2010-12-30
Silicon dioxide cantilever support and method for silicon etched structures App 20100289108 - Meinel; Walter B. ; et al.	2010-11-18
TSVS having chemically exposed TSV tips for integrated circuit devices Grant 7,833,895 - Bonifield , et al. November 16, 2	2010-11-16
Mask Overhang Reduction Or Elimination After Substrate Etch App 20090289324 - GOODLIN; BRIAN E. ; et al.	2009-11-26
Tsvs Having Chemically Exposed Tsv Tips For Integrated Circuit Devices App 20090278238 - BONIFIELD; THOMAS D. ; et al.	2009-11-12
Method for manufacturing a semiconductor device using a sidewall spacer etchback Grant 7,229,869 - Yoon , et al. June 12, 2	2007-06-12
Method for manufacturing a semiconductor device using a sidewall spacer etchback App 20060205169 - Yoon; Jong Shik ; et al.	2006-09-14
Method for manufacturing improved sidewall structures for use in semiconductor devices Grant 7,018,888 - Goodlin , et al. March 28, 2	2006-03-28
Method for manufacturing improved sidewall structures for use in semiconductor devices App 20060024872 - Goodlin; Brian E. ; et al.	2006-02-02

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