Goldmann; Lewis S

Patent Applications and Registrations

Patent applications and USPTO patent grants for Goldmann; Lewis S.The latest application filed is for "solder mold plates used in packaging process and method of manufacturing solder mold plates".

Company Profile

0.25.14

Goldmann; Lewis S - Bedford NY
GOLDMANN; Lewis S. - Bedford NY
Goldmann; Lewis S. - Ossining NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solder mold plates used in packaging process and method of manufacturing solder mold plates Grant 8,337,735 - Goldmann December 25, 2	2012-12-25
Solder Mold Plates Used In Packaging Process And Method Of Manufacturing Solder Mold Plates App 20120125556 - GOLDMANN; Lewis S.	2012-05-24
Solder mold plates used in packaging process and method of manufacturing solder mold plates Grant 8,132,775 - Goldmann March 13, 2	2012-03-13
Method and structure to control thermal gradients in semiconductor wafers during rapid thermal processing Grant 8,107,800 - Bezama , et al. January 31, 2	2012-01-31
Solder Mold Plates Used In Packaging Process And Method Of Manufacturing Solder Mold Plates App 20090266972 - GOLDMANN; LEWIS S.	2009-10-29
Compressible films surrounding solder connectors Grant 7,566,649 - Bernier , et al. July 28, 2	2009-07-28
Method And Structure To Control Thermal Gradients In Semiconductor Wafers During Rapid Thermal Processing App 20090175606 - Bezama; Raschid J. ; et al.	2009-07-09
Method and structure to provide balanced mechanical loading of devices in compressively loaded environments Grant 7,518,235 - Coico , et al. April 14, 2	2009-04-14
IC chip package having force-adjustable member between stiffener and printed circuit board Grant 7,443,026 - Goldmann , et al. October 28, 2	2008-10-28
Ic Chip Package Having Force-adjustable Member Between Stiffener And Printed Circuit Board App 20080123311 - Goldmann; Lewis S. ; et al.	2008-05-29
Compressible films surrounding solder connectors Grant 7,332,821 - Bernier , et al. February 19, 2	2008-02-19
Compressible Films Surrounding Solder Connectors App 20080009101 - Bernier; William E. ; et al.	2008-01-10
Method And Structure To Provide Balanced Mechanical Loading Of Devices In Compressively Loaded Environments App 20060202325 - Coico; Patrick A. ; et al.	2006-09-14
Electronic module assembly Grant 7,095,614 - Goldmann August 22, 2	2006-08-22
Compressible Films Surrounding Solder Connectors App 20060040567 - Bernier; William E. ; et al.	2006-02-23
Electronic Module Assembly App 20050231918 - Goldmann, Lewis S.	2005-10-20
Method and apparatus to form a reworkable seal on an electronic module Grant 6,955,543 - Messina , et al. October 18, 2	2005-10-18
Conductive polymer interconnection configurations Grant 6,858,111 - Perry , et al. February 22, 2	2005-02-22
Method And Apparatus To Form A Reworkable Seal On An Electronic Module App 20050037640 - Messina, Gaetano P. ; et al.	2005-02-17
Stress resistant land grid array (LGA) module and method of forming the same App 20040141296 - Coico, Patrick Anthony ; et al.	2004-07-22
Full wafer test configuration using memory metals Grant 6,724,203 - Goldmann , et al. April 20, 2	2004-04-20
Process for forming a multi-level thin-film electronic packaging structure Grant 6,678,949 - Prasad , et al. January 20, 2	2004-01-20
Conductive adhesive interconnection with insulating polymer carrier Grant 6,458,623 - Goldmann , et al. October 1, 2	2002-10-01
Conductive adhesive interconnection with insulating polymer carrier App 20020093104 - Goldmann, Lewis S. ; et al.	2002-07-18
Capping structure for electronics package undergoing compressive socket actuation App 20020079117 - Coffin, Jeffrey T. ; et al.	2002-06-27
Stress resistant land grid array (LGA) module and method of forming the same App 20020050398 - Coico, Patrick Anthony ; et al.	2002-05-02
Electrical interconnection package and method thereof Grant 6,333,563 - Jackson , et al. December 25, 2	2001-12-25
Process for forming a multi-level thin-film electronic packaging structure App 20010037565 - Prasad, Chandrika ; et al.	2001-11-08
Mechanical attachment means used as electrical connection Grant 6,287,126 - Berger , et al. September 11, 2	2001-09-11
Multi-level thin-film electronic packaging structure and related method Grant 6,281,452 - Prasad , et al. August 28, 2	2001-08-28
Solder disc connection Grant 6,278,184 - Brofman , et al. August 21, 2	2001-08-21
Hermetic CBGA/CCGA structure with thermal paste cooling Grant 5,990,418 - Bivona , et al. November 23, 1	1999-11-23
Cast metal seal for semiconductor substrates Grant 5,982,038 - Toy , et al. November 9, 1	1999-11-09
Ceramic ball grid array using in-situ solder stretch Grant 5,975,409 - Brofman , et al. November 2, 1	1999-11-02
Enhanced ceramic ball grid array using in-situ solder stretch with spring Grant 5,968,670 - Brofman , et al. October 19, 1	1999-10-19
Enhanced ceramic ball grid array using in-situ solder stretch with clip Grant 5,964,396 - Brofman , et al. October 12, 1	1999-10-12
Multi-layer solder seal band for semiconductor substrates and process Grant 5,881,945 - Edwards , et al. March 16, 1	1999-03-16
Cast metal seal for semiconductor substrates and process thereof Grant 5,821,161 - Covell, II , et al. October 13, 1	1998-10-13
Zero-insertion Force Connector Grant 3,727,173 - Goldmann , et al. April 10, 1	1973-04-10

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