Gill; Bharatjeet Singh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gill; Bharatjeet Singh.The latest application filed is for "auto-linearizing amplifier".

Company Profile

5.8.12

Gill; Bharatjeet Singh - Ottawa CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Auto-linearizing Amplifier App 20220190786 - Cook; Mackenzie Brian ; et al.	2022-06-16
Backside Metalization With Through-wafer-via Processing To Allow Use Of High Q Bondwire Inductances App 20210366868 - Gill; Bharatjeet Singh ; et al.	2021-11-25
Backside metalization with through-wafer-via processing to allow use of high q bondwire inductances Grant 11,171,110 - Gill , et al. November 9, 2	2021-11-09
Direct Substrate To Solder Bump Connection For Thermal Management In Flip Chip Amplifiers App 20210119584 - McPartlin; Michael Joseph ; et al.	2021-04-22
Direct substrate to solder bump connection for thermal management in flip chip amplifiers Grant 10,790,788 - McPartlin , et al. September 29, 2	2020-09-29
Flip chip amplifier for wireless device Grant 10,447,210 - McPartlin , et al. Oc	2019-10-15
Methods For Thermal Management In Amplifiers App 20190199294 - McPartlin; Michael Joseph ; et al.	2019-06-27
Flip Chip Amplifier For Wireless Device App 20190123693 - McPartlin; Michael Joseph ; et al.	2019-04-25
Solder bump placement for thermal management in flip chip amplifiers Grant 10,193,504 - McPartlin , et al. Ja	2019-01-29
Direct Substrate To Solder Bump Connection For Thermal Management In Flip Chip Amplifiers App 20190028067 - McPartlin; Michael Joseph ; et al.	2019-01-24
Solder bump placement for grounding in flip chip amplifiers Grant 10,181,824 - McPartlin , et al. Ja	2019-01-15
Solder bump placement for emitter-ballasting in flip chip amplifiers Grant 10,177,716 - McPartlin , et al. J	2019-01-08
Backside Metalization With Through-wafer-via Processing To Allow Use Of High Q Bondwire Inductances App 20180315730 - Gill; Bharatjeet Singh ; et al.	2018-11-01
Direct substrate to solder bump connection for thermal management in flip chip amplifiers Grant 10,069,466 - McPartlin , et al. September 4, 2	2018-09-04
Solder Bump Placement For Grounding In Flip Chip Amplifiers App 20170117857 - McPartlin; Michael Joseph ; et al.	2017-04-27
Solder Bump Placement For Emitter-ballasting In Flip Chip Amplifiers App 20170117270 - McPartlin; Michael Joseph ; et al.	2017-04-27
Solder Bump Placement For Thermal Management In Flip Chip Amplifiers App 20170117204 - McPartlin; Michael Joseph ; et al.	2017-04-27
Direct Substrate To Solder Bump Connection For Thermal Management In Flip Chip Amplifiers App 20170117853 - McPartlin; Michael Joseph ; et al.	2017-04-27
Circuits and methods related to low-noise amplifiers having improved linearity Grant 9,407,215 - Gill August 2, 2	2016-08-02
Circuits And Methods Related To Low-noise Amplifiers Having Improved Linearity App 20140333384 - GILL; Bharatjeet Singh	2014-11-13

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