loadpatents
Patent applications and USPTO patent grants for Ghiam; Farid F..The latest application filed is for "blister package and method of manufacture".
Patent | Date |
---|---|
Barrier films Grant 11,220,616 - Pham , et al. January 11, 2 | 2022-01-11 |
Blister package and method of manufacture Grant 10,501,248 - Ghiam Dec | 2019-12-10 |
Flexible barrier films containing cyclic olefins Grant 10,335,308 - Pham , et al. | 2019-07-02 |
Thermoform labeling Grant 10,195,839 - Ghiam , et al. Fe | 2019-02-05 |
Blister Package And Method Of Manufacture App 20180118437 - Ghiam; Farid F. | 2018-05-03 |
Low noise flexible barrier films Grant 9,283,735 - Pham , et al. March 15, 2 | 2016-03-15 |
Flexible Barrier Films Containing Cyclic Olefins App 20150018788 - Pham; Hoang T. ;   et al. | 2015-01-15 |
Blends of ethylene copolymers and propylene based plastomers in multilayer films for low noise and RF welding Grant 8,900,719 - Pham , et al. December 2, 2 | 2014-12-02 |
Barrier Films App 20140194024 - Pham; Hoang T. ;   et al. | 2014-07-10 |
Thermoform Labeling App 20130180656 - GHIAM; Farid F. ;   et al. | 2013-07-18 |
Thermoform Labeling App 20130164502 - Ghiam; Farid F. ;   et al. | 2013-06-27 |
Low Noise Flexible Barrier Films App 20130156983 - PHAM; Hoang T. ;   et al. | 2013-06-20 |
Blends of Ethylene Copolymers and Propylene Based Plastomers in Multilayer Films for Low Noise and RF Welding App 20120258326 - PHAM; Hoang T. ;   et al. | 2012-10-11 |
Heat shrinkable film with (meth)acrylate resin curable adhesive Grant 7,700,189 - Amon , et al. April 20, 2 | 2010-04-20 |
Heat Shrinkable Film With (meth)acrylate Resin Curable Adhesive App 20070172669 - Amon; Moris ;   et al. | 2007-07-26 |
Absorbent composition and method of assembling App 20030148694 - Ghiam, Farid F. | 2003-08-07 |
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