Gelorme; Jeffrey D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gelorme; Jeffrey D..The latest application filed is for "wearable stacked strain gauge sensor for monitoring".

Company Profile

19.60.46

Gelorme; Jeffrey D. - Burlington CT
Gelorme, Jeffrey D. - Plainville CT
Gelorme; Jeffrey D. - Binghamton NY
Gelorme; Jeffrey D. - Plainvill CT
Gelorme; Jeffrey D. - Hartford CT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
IR assisted fan-out wafer level packaging using silicon handler Grant 11,348,833 - Dang , et al. May 31, 2	2022-05-31
Forming wearable stacked strain gauge sensor for monitoring Grant 11,172,837 - Sakuma , et al. November 16, 2	2021-11-16
Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding Grant 10,998,217 - Dang , et al. May 4, 2	2021-05-04
Method and apparatus for strain relieving surface mount attached connectors Grant 10,750,615 - Gaynes , et al. A	2020-08-18
Chip handling and electronic component integration Grant 10,658,182 - Budd , et al.	2020-05-19
Chip handling and electronic component integration Grant 10,651,036 - Budd , et al.	2020-05-12
Wearable Stacked Strain Gauge Sensor for Monitoring App 20200121204 - Sakuma; Katsuyuki ; et al.	2020-04-23
Ir Assisted Fan-out Wafer Level Packaging Using Silicon Handler App 20200098638 - Dang; Bing ; et al.	2020-03-26
Thermoplastic Temporary Adhesive For Silicon Handler With Infra-red Laser Wafer De-bonding App 20200083082 - Dang; Bing ; et al.	2020-03-12
Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding Grant 10,522,383 - Dang , et al. Dec	2019-12-31
IR assisted fan-out wafer level packaging using silicon handler Grant 10,522,406 - Dang , et al. Dec	2019-12-31
Chip Handling And Electronic Component Integration App 20190378720 - Budd; Russell A. ; et al.	2019-12-12
Chip Handling And Electronic Component Integration App 20190378719 - Budd; Russell A. ; et al.	2019-12-12
Method And Apparatus For Strain Relieving Surface Mount Attached Connectors App 20190281702 - Gaynes; Michael A. ; et al.	2019-09-12
Chip handling and electronic component integration Grant 10,395,929 - Budd , et al. A	2019-08-27
Method and apparatus for strain relieving surface mount attached connectors Grant 10,368,441 - Gaynes , et al. July 30, 2	2019-07-30
Low Temperature Adhesive Bond Material App 20190194506 - Gelorme; Jeffrey D. ; et al.	2019-06-27
Chip Handling And Electronic Component Integration App 20190088481 - Budd; Russell A. ; et al.	2019-03-21
Chip Handling And Electronic Component Integration App 20190088480 - Budd; Russell A. ; et al.	2019-03-21
Chip handling and electronic component integration Grant 10,217,637 - Budd , et al. Feb	2019-02-26
Water soluble low alpha particle emission electrically-conductive coating Grant 10,168,436 - Gaynes , et al. J	2019-01-01
Method And Apparatus For Strain Relieving Surface Mount Attached Connectors App 20180213645 - Gaynes; Michael A. ; et al.	2018-07-26
Ir Assisted Fan-out Wafer Level Packaging Using Silicon Handler App 20180182672 - Dang; Bing ; et al.	2018-06-28
Thermoplastic Temporary Adhesive For Silicon Handler With Infra-red Laser Wafer De-bonding App 20180174882 - Dang; Bing ; et al.	2018-06-21
Method and apparatus for strain relieving surface mount attached connectors Grant 9,974,179 - Gaynes , et al. May 15, 2	2018-05-15
Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding Grant 9,947,567 - Dang , et al. April 17, 2	2018-04-17
IR assisted fan-out wafer level packaging using silicon handler Grant 9,935,009 - Dang , et al. April 3, 2	2018-04-03
Water Soluble Low Alpha Particle Emission Electrically-Conductive Coating App 20170329020 - Gaynes; Michael A. ; et al.	2017-11-16
Ir Assisted Fan-out Wafer Level Packaging Using Silicon Handler App 20170287782 - Dang; Bing ; et al.	2017-10-05
Low temperature adhesive resins for wafer bonding Grant 9,748,131 - Allen , et al. August 29, 2	2017-08-29
Method And Apparatus For Strain Relieving Surface Mount Attached Connectors App 20170196089 - Gaynes; Michael A. ; et al.	2017-07-06
Method and apparatus for strain relieving surface mount attached connectors Grant 9,627,784 - Gaynes , et al. April 18, 2	2017-04-18
Low temperature adhesive resins for wafer bonding Grant 9,601,364 - Allen , et al. March 21, 2	2017-03-21
Thermoplastic Temporary Adhesive For Silicon Handler With Infra-red Laser Wafer De-bonding App 20160284582 - Dang; Bing ; et al.	2016-09-29
Thermoplastic Temporary Adhesive For Silicon Handler With Infra-red Laser Wafer De-bonding App 20160284583 - Dang; Bing ; et al.	2016-09-29
Low Temperature Adhesive Resins For Wafer Bonding App 20160204015 - Allen; Robert D. ; et al.	2016-07-14
Multi-layer Laser Debonding Structure With Tunable Absorption App 20160133495 - Andry; Paul S. ; et al.	2016-05-12
Low Temperature Adhesive Resins For Wafer Bonding App 20160133498 - Allen; Robert D. ; et al.	2016-05-12
Low Temperature Adhesive Resins For Wafer Bonding App 20160133501 - Allen; Robert D. ; et al.	2016-05-12
Multi-layer Laser Debonding Structure With Tunable Absorption App 20160133497 - Andry; Paul S. ; et al.	2016-05-12
Low temperature adhesive resins for wafer bonding Grant 9,324,601 - Allen , et al. April 26, 2	2016-04-26
Multi-chip module with rework capability Grant 9,275,879 - Gaynes , et al. March 1, 2	2016-03-01
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Grant 9,263,363 - Hougham , et al. February 16, 2	2016-02-16
Multi-chip Module With Rework Capability App 20160042979 - Gaynes; Michael A. ; et al.	2016-02-11
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive App 20140038362 - Hougham; Gareth ; et al.	2014-02-06
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Grant 8,604,623 - Hougham , et al. December 10, 2	2013-12-10
Self Orienting Micro Plates Of Thermally Conducting Material As Component In Thermal Paste Or Adhesive App 20130016479 - Hougham; Gareth ; et al.	2013-01-17
Electronic device comprising electrically stable copper filled electrically conductive adhesive Grant 8,293,141 - Gaynes , et al. October 23, 2	2012-10-23
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Grant 8,268,282 - Hougham , et al. September 18, 2	2012-09-18
Self Orienting Micro Plates Of Thermally Conducting Material As Component In Thermal Paste Or Adhesive App 20120211159 - Hougham; Gareth ; et al.	2012-08-23
Reversible thermal thickening grease Grant 7,981,849 - Feger , et al. July 19, 2	2011-07-19
Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly Grant 7,964,542 - Sachdev , et al. June 21, 2	2011-06-21
Self Orienting Micro Plates Of Thermally Conducting Material As Component In Thermal Paste Or Adhesive Adhesive App 20100207056 - Hougham; Gareth ; et al.	2010-08-19
Apparatus and methods for cooling semiconductor integrated circuit package structures Grant 7,768,121 - Colgan , et al. August 3, 2	2010-08-03
Electrically stable copper filled electrically conductive adhesive Grant 7,763,188 - Gaynes , et al. July 27, 2	2010-07-27
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Grant 7,708,909 - Hougham , et al. May 4, 2	2010-05-04
Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application Grant 7,567,090 - Cote , et al. July 28, 2	2009-07-28
Centrifugal Method For Filing High Aspect Ratio Blind Micro Vias With Powdered Materials For Circuit Formation App 20090032962 - Hougham; Gareth ; et al.	2009-02-05
Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation Grant 7,452,568 - Hougham , et al. November 18, 2	2008-11-18
Electrically Stable Copper Filled Electrically Conductive Adhesive App 20080230262 - Gaynes; Michael ; et al.	2008-09-25
Process For Preparing An Electrically Stable Copper Filled Electrically Conductive Adhesive App 20080223604 - Gaynes; Michael ; et al.	2008-09-18
Reversible Thermal Thickening Grease App 20080220998 - Feger; Claudius ; et al.	2008-09-11
Self Orienting Micro Plates Of Thermally Conducting Material As Component In Thermal Paste Or Adhesive App 20080202386 - Hougham; Gareth ; et al.	2008-08-28
Liquid Recovery, Collection Method And Apparatus In A Non-Recirculating Test And Burn-In Application App 20080116921 - Cote; Normand ; et al.	2008-05-22
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Grant 7,351,360 - Hougham , et al. April 1, 2	2008-04-01
Apparatus and Methods for Cooling Semiconductor Integrated Circuit Package Structures App 20080042264 - Colgan; Evan George ; et al.	2008-02-21
Apparatus and methods for cooling semiconductor integrated circuit package structures Grant 7,288,839 - Colgan , et al. October 30, 2	2007-10-30
Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly App 20070161521 - Sachdev; Krishna G. ; et al.	2007-07-12
Heterogeneous thermal interface for cooling Grant 7,219,713 - Gelorme , et al. May 22, 2	2007-05-22
Electrically stable copper filled electrically conductive adhesive App 20060197065 - Gaynes; Michael ; et al.	2006-09-07
Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation App 20060177568 - Hougham; Gareth ; et al.	2006-08-10
Heterogeneous thermal interface for cooling App 20060157223 - Gelorme; Jeffrey D. ; et al.	2006-07-20
Method and apparatus for chip cooling using a liquid metal thermal interface App 20060131738 - Furman; Bruce K. ; et al.	2006-06-22
Method and apparatus for chip-cooling Grant 7,063,127 - Gelorme , et al. June 20, 2	2006-06-20
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive App 20060112857 - Hougham; Gareth ; et al.	2006-06-01
Method and apparatus for detecting leaks in a fluid cooling system Grant 7,021,124 - Von Gutfeld , et al. April 4, 2	2006-04-04
Method And Apparatus For Detecting Leaks In A Fluid Cooling System App 20060042358 - Von Gutfeld; Robert J. ; et al.	2006-03-02
Apparatus and methods for cooling semiconductor integrated circuit package structures App 20050189568 - Colgan, Evan George ; et al.	2005-09-01
Method and apparatus for chip-cooling App 20050061474 - Gelorme, Jeffrey D. ; et al.	2005-03-24
Electrically conductive filled through holes App 20030162047 - Appelt, Bernd K. ; et al.	2003-08-28
An Electronic Package Having A Substrate With Electrically Conductive Filled Through Holes App 20030006066 - APPELT, BERND K. ; et al.	2003-01-09
Methods of fabrication of cross-linked electrically conductive polymers and precursors thereof Grant 6,383,415 - Angelopoulos , et al. May 7, 2	2002-05-07
Cross-linked electrically conductive polymers, precursors thereof Grant 6,193,909 - Angelopoulos , et al. February 27, 2	2001-02-27
Toughened photosensitive polycyanurate resist, and structure made therefrom and process of making Grant 5,919,596 - Hedrick , et al. July 6, 1	1999-07-06
Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof Grant 5,721,299 - Angelopoulos , et al. February 24, 1	1998-02-24
Photosensitive composition with cyanate esters and use thereof Grant 5,605,781 - Gelorme , et al. February 25, 1	1997-02-25
Cleavable diepoxide for removable epoxy compositions Grant 5,560,934 - Afzali-Ardakani , et al. October 1, 1	1996-10-01
Cleavable diepoxide for removable epoxy compositions Grant 5,512,613 - Afzali-Ardakani , et al. April 30, 1	1996-04-30
Polyamic acid and polyimide from fluorinated reactant Grant 5,464,927 - Angelopoulos , et al. November 7, 1	1995-11-07
Solid state chain extension polymerization between Lewis acid oligomers and deblocked Lewis bases Grant 5,382,637 - Angelopoulos , et al. January 17, 1	1995-01-17
Water-soluble electrically conducting polymers, their synthesis and use Grant 5,370,825 - Angelopoulos , et al. December 6, 1	1994-12-06
Composition for photo imaging Grant 5,304,457 - Day , et al. * April 19, 1	1994-04-19
Base developable negative photoresist composition and use thereof Grant 5,286,599 - Babich , et al. February 15, 1	1994-02-15
Composition for photo imaging Grant 5,278,010 - Day , et al. January 11, 1	1994-01-11
Microwave processing Grant 5,241,040 - Cuomo , et al. August 31, 1	1993-08-31
Dry developable photoresist containing an epoxide, organosilicon and onium salt Grant 5,229,251 - Babich , et al. July 20, 1	1993-07-20
Tuneable apparatus for microwave processing Grant 5,191,182 - Gelorme , et al. March 2, 1	1993-03-02
Photocurable epoxy composition with sulfonium salt photoinitiator Grant 5,102,772 - Angelo , et al. April 7, 1	1992-04-07
Ultraviolet light sensitive photoinitiator compositions, use thereof and radiation sensitive compositions Grant 5,059,512 - Babich , et al. October 22, 1	1991-10-22
Polymeric optical waveguides and methods of forming the same Grant 5,054,872 - Fan , et al. October 8, 1	1991-10-08
Composition for photo imaging Grant 5,026,624 - Day , et al. June 25, 1	1991-06-25
Method for patterning cationic curable photoresist Grant 4,940,651 - Brown , et al. July 10, 1	1990-07-10
Photoresist composition and printed circuit boards and packages made therewith Grant 4,882,245 - Gelorme , et al. November 21, 1	1989-11-21
Roughening surface of a substrate Grant 4,615,763 - Gelorme , et al. October 7, 1	1986-10-07

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