Gao; Guilian

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gao; Guilian.The latest application filed is for "metal pads over tsv".

Company Profile

37.71.93

Gao; Guilian - San Jose CA
Gao; Guilian - Novi MI

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal Pads Over Tsv App 20220302058 - Gao; Guilian ; et al.	2022-09-22
Direct Bonded Stack Structures For Increased Reliability And Improved Yield In Microelectronics App 20220293567 - Uzoh; Cyprian Emeka ; et al.	2022-09-15
Mitigating Surface Damage Of Probe Pads In Preparation For Direct Bonding Of A Substrate App 20220285236 - Gao; Guilian ; et al.	2022-09-08
Seal for microelectronic assembly Grant 11,417,576 - Katkar , et al. August 16, 2	2022-08-16
Bond Enhancement Structure In Microelectronics For Trapping Contaminants During Direct-bonding Processes App 20220246564 - Gao; Guilian ; et al.	2022-08-04
Large metal pads over TSV Grant 11,393,779 - Gao , et al. July 19, 2	2022-07-19
Directly Bonded Structures App 20220208723 - Katkar; Rajesh ; et al.	2022-06-30
Structures With Through-substrate Vias And Methods For Forming The Same App 20220208650 - Gao; Guilian ; et al.	2022-06-30
Mitigating surface damage of probe pads in preparation for direct bonding of a substrate Grant 11,355,404 - Gao , et al. June 7, 2	2022-06-07
Processing stacked substrates Grant 11,348,801 - Uzoh , et al. May 31, 2	2022-05-31
Low Temperature Bonded Structures App 20220165692 - UZOH; Cyprian Emeka ; et al.	2022-05-26
Direct Bonding Methods And Structures App 20220139869 - Gao; Guilian ; et al.	2022-05-05
Integrated interposer solutions for 2D and 3D IC packaging Grant 11,302,616 - Shen , et al. April 12, 2	2022-04-12
Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes Grant 11,296,044 - Gao , et al. April 5, 2	2022-04-05
Direct bonded stack structures for increased reliability and improved yield in microelectronics Grant 11,296,053 - Uzoh , et al. April 5, 2	2022-04-05
Seal for microelectronic assembly Grant 11,257,727 - Katkar , et al. February 22, 2	2022-02-22
Integrated Optical Waveguides, Direct-bonded Waveguide Interface Joints, Optical Routing And Interconnects App 20220043209 - HUANG; Shaowu ; et al.	2022-02-10
Low temperature bonded structures Grant 11,244,916 - Uzoh , et al. February 8, 2	2022-02-08
Interlayer Connection Of Stacked Microelectronic Components App 20220028835 - GAO; Guilian ; et al.	2022-01-27
Molded Direct Bonded And Interconnected Stack App 20220020729 - GAO; Guilian ; et al.	2022-01-20
Layer Structures For Making Direct Metal-to-metal Bonds At Low Temperatures In Microelectronics App 20220005784 - Gao; Guilian ; et al.	2022-01-06
Techniques For Processing Devices App 20210375850 - Uzoh; Cyprian Emeka ; et al.	2021-12-02
Interlayer connection of stacked microelectronic components Grant 11,171,117 - Gao , et al. November 9, 2	2021-11-09
Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects Grant 11,169,326 - Huang , et al. November 9, 2	2021-11-09
Molded direct bonded and interconnected stack Grant 11,158,606 - Gao , et al. October 26, 2	2021-10-26
Dimension Compensation Control For Directly Bonded Structures App 20210296282 - Gao; Guilian ; et al.	2021-09-23
System and method for providing 3D wafer assembly with known-good-dies Grant 11,114,408 - Shen , et al. September 7, 2	2021-09-07
Offset Pads Over Tsv App 20210257341 - LEE; Bongsub ; et al.	2021-08-19
Dbi To Si Bonding For Simplified Handle Wafer App 20210233889 - MANDALAPU; Chandrasekhar ; et al.	2021-07-29
Structures and methods for reliable packages Grant 11,056,390 - Uzoh , et al. July 6, 2	2021-07-06
Techniques for processing devices Grant 11,037,919 - Uzoh , et al. June 15, 2	2021-06-15
Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics Grant 11,011,494 - Gao , et al. May 18, 2	2021-05-18
Offset pads over TSV Grant 10,998,292 - Lee , et al. May 4, 2	2021-05-04
Processed Stacked Dies App 20210104487 - UZOH; Cyprian EMEKA ; et al.	2021-04-08
Direct Gang Bonding Methods And Structures App 20210098412 - Haba; Belgacem ; et al.	2021-04-01
DBI to Si bonding for simplified handle wafer Grant 10,964,664 - Mandalapu , et al. March 30, 2	2021-03-30
Direct Bonded Stack Structures For Increased Reliability And Improved Yield In Microelectronics App 20200411483 - Uzoh; Cyprian Emeka ; et al.	2020-12-31
Processed stacked dies Grant 10,879,212 - Uzoh , et al. December 29, 2	2020-12-29
Processing Stacked Substrates App 20200388503 - UZOH; Cyprian Emeka ; et al.	2020-12-10
Low Temperature Bonded Structures App 20200381389 - UZOH; Cyprian Emeka ; et al.	2020-12-03
Techniques For Processing Devices App 20200365575 - UZOH; Cyprian Emeka ; et al.	2020-11-19
Mitigating Surface Damage Of Probe Pads In Preparation For Direct Bonding Of A Substrate App 20200335408 - Gao; Guilian ; et al.	2020-10-22
Low temperature bonded structures Grant 10,790,262 - Uzoh , et al. September 29, 2	2020-09-29
Techniques for processing devices Grant 10,727,219 - Uzoh , et al.	2020-07-28
Processing stacked substrates Grant 10,707,087 - Uzoh , et al.	2020-07-07
Seal For Microelectronic Assembly App 20200140267 - Katkar; Rajesh ; et al.	2020-05-07
Seal For Microelectronic Assembly App 20200140268 - Katkar; Rajesh ; et al.	2020-05-07
Structures And Methods For Reliable Packages App 20200126861 - Uzoh; Cyprian Emeka ; et al.	2020-04-23
HD color imaging using monochromatic CMOS image sensors integrated in 3D package Grant 10,623,710 - Shen , et al.	2020-04-14
System And Method For Providing 3d Wafer Assembly With Known-good-dies App 20200091110 - Shen; Hong ; et al.	2020-03-19
Embedded graphite heat spreader for 3DIC Grant 10,586,785 - Gao , et al.	2020-03-10
Bond Enhancement In Microelectronics By Trapping Contaminants And Arresting Cracks During Direct-bonding Processes App 20200075533 - GAO; Guilian ; et al.	2020-03-05
Bond Enhancement In Microelectronics By Trapping Contaminants And Arresting Cracks During Direct-bonding Processes App 20200075520 - GAO; Guilian ; et al.	2020-03-05
Layer Structures For Making Direct Metal-to-metal Bonds At Low Temperatures In Microelectronics App 20200075534 - GAO; Guilian ; et al.	2020-03-05
Low Temperature Bonded Structures App 20200051937 - UZOH; Cyprian Emeka ; et al.	2020-02-13
Post Cmp Processing For Hybrid Bonding App 20200035641 - FOUNTAIN, JR.; Gaius Gillman ; et al.	2020-01-30
Structures and methods for reliable packages Grant 10,535,564 - Uzoh , et al. Ja	2020-01-14
Molded Direct Bonded And Interconnected Stack App 20200013754 - GAO; Guilian ; et al.	2020-01-09
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates Grant 10,522,457 - Uzoh , et al. Dec	2019-12-31
System and method for providing 3D wafer assembly with known-good-dies Grant 10,515,926 - Shen , et al. Dec	2019-12-24
Tsv As Pad App 20190385935 - GAO; Guilian ; et al.	2019-12-19
Offset Pads Over Tsv App 20190385982 - LEE; Bongsub ; et al.	2019-12-19
Large Metal Pads Over Tsv App 20190385966 - GAO; Guilian ; et al.	2019-12-19
Seal for microelectronic assembly Grant 10,508,030 - Katkar , et al. Dec	2019-12-17
Interlayer Connection Of Stacked Microelectronic Components App 20190378820 - Gao; Guilian ; et al.	2019-12-12
Dbi To Si Bonding For Simplified Handle Wafer App 20190326252 - MANDALAPU; Chandrasekhar ; et al.	2019-10-24
Low Temperature Bonded Structures App 20190319007 - UZOH; Cyprian Emeka ; et al.	2019-10-17
Integrated Optical Waveguides, Direct-bonded Waveguide Interface Joints, Optical Routing And Interconnects App 20190265411 - HUANG; Shaowu ; et al.	2019-08-29
Techniques For Processing Devices App 20190252364 - UZOH; Cyprian Emeka ; et al.	2019-08-15
Integrated Interposer Solutions For 2d And 3d Ic Packaging App 20190198435 - Shen; Hong ; et al.	2019-06-27
Anchoring structure of fine pitch bva Grant 10,332,854 - Katkar , et al.	2019-06-25
Hybrid 3D/2.5D interposer Grant 10,325,880 - Woychik , et al.	2019-06-18
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Th App 20190157199 - UZOH; Cyprian Emeka ; et al.	2019-05-23
Integrated interposer solutions for 2D and 3D IC packaging Grant 10,256,177 - Shen , et al.	2019-04-09
Hybrid 3d/2.5d Interposer App 20190096849 - Woychik; Charles G. ; et al.	2019-03-28
Hd Color Imaging Using Monochromatic Cmos Image Sensors Integrated In 3d Package App 20190098271 - Shen; Hong ; et al.	2019-03-28
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates Grant 10,177,086 - Uzoh , et al. J	2019-01-08
HD color imaging using monochromatic CMOS image sensors integrated in 3D package Grant 10,178,363 - Shen , et al. J	2019-01-08
Hybrid 3D/2.5D interposer Grant 10,177,114 - Woychik , et al. J	2019-01-08
Processed stacked dies App 20180331066 - UZOH; Cyprian Emeka ; et al.	2018-11-15
Seal for microelectronic assembly App 20180273377 - KATKAR; Rajesh ; et al.	2018-09-27
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Through Substrates App 20180233447 - UZOH; Cyprian Emeka ; et al.	2018-08-16
Embedded Graphite Heat Spreader For 3dic App 20180219001 - Gao; Guilian ; et al.	2018-08-02
Processing Stacked Substrates App 20180182639 - UZOH; Cyprian Emeka ; et al.	2018-06-28
Stacked die integrated circuit Grant 9,991,231 - Woychik , et al. June 5, 2	2018-06-05
Embedded graphite heat spreader for 3DIC Grant 9,953,957 - Gao , et al. April 24, 2	2018-04-24
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates Grant 9,947,618 - Uzoh , et al. April 17, 2	2018-04-17
System and Method for Providing 3D Wafer Assembly With Known-Good-Dies App 20180096973 - Shen; Hong ; et al.	2018-04-05
Polymer member based interconnect Grant 9,865,548 - Uzoh , et al. January 9, 2	2018-01-09
Methods and structures to repair device warpage Grant 9,859,234 - Uzoh , et al. January 2, 2	2018-01-02
Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies Grant 9,824,974 - Gao , et al. November 21, 2	2017-11-21
Thermal vias disposed in a substrate without a liner layer Grant 9,818,668 - Gao November 14, 2	2017-11-14
Microelectronic assemblies with cavities, and methods of fabrication Grant 9,812,406 - Shen , et al. November 7, 2	2017-11-07
Integrated Interposer Solutions For 2d And 3d Ic Packaging App 20170317019 - Shen; Hong ; et al.	2017-11-02
Structures and Methods for Reliable Packages App 20170309518 - Uzoh; Cyprian Emeka ; et al.	2017-10-26
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Through Substrates App 20170278787 - UZOH; Cyprian Emeka ; et al.	2017-09-28
Structures and methods for reliable packages Grant 9,741,620 - Uzoh , et al. August 22, 2	2017-08-22
Integrated interposer solutions for 2D and 3D IC packaging Grant 9,741,649 - Shen , et al. August 22, 2	2017-08-22
Bond via array for thermal conductivity Grant 9,735,084 - Katkar , et al. August 15, 2	2017-08-15
System And Method For Providing 3d Wafer Assembly With Known-good-dies App 20170186730 - Shen; Hong ; et al.	2017-06-29
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates Grant 9,691,702 - Uzoh , et al. June 27, 2	2017-06-27
Multi-chip microelectronic assembly with built-up fine-patterned circuit structure Grant 9,666,560 - Wang , et al. May 30, 2	2017-05-30
Hybrid 3d/2.5d Interposer App 20170148763 - Woychik; Charles G. ; et al.	2017-05-25
Multi-chip Microelectronic Assembly With Built-up Fine-patterned Circuit Structure App 20170148764 - Wang; Liang ; et al.	2017-05-25
Anchoring Structure Of Fine Pitch Bva App 20170117243 - Katkar; Rajesh ; et al.	2017-04-27
HD Color Imaging Using Monochromatic CMOS Image Sensors Integrated In 3D Package App 20170099474 - Shen; Hong ; et al.	2017-04-06
Integrated Circuit Assemblies With Rigid Layers Used For Protection Against Mechanical Thinning And For Other Purposes, And Methods Of Fabricating Such Assemblies App 20170084539 - GAO; Guilian ; et al.	2017-03-23
Methods And Structures To Repair Device Warpage App 20170040270 - Uzoh; Cyprian Emeka ; et al.	2017-02-09
Stacked Die Integrated Circuit App 20170033088 - Woychik; Charles G. ; et al.	2017-02-02
Microelectronic Assemblies With Cavities, And Methods Of Fabrication App 20170018510 - SHEN; Hong ; et al.	2017-01-19
Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies Grant 9,548,273 - Gao , et al. January 17, 2	2017-01-17
Structures And Methods For Reliable Packages App 20160379885 - UZOH; Cyprian Emeka ; et al.	2016-12-29
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Through Substrates App 20160315047 - Uzoh; Cyprian Emeka ; et al.	2016-10-27
Microelectronic assemblies with cavities, and methods of fabrication Grant 9,478,504 - Shen , et al. October 25, 2	2016-10-25
Polymer Member Based Interconnect App 20160268205 - Uzoh; Cyprian Emeka ; et al.	2016-09-15
Embedded Graphite Heat Spreader For 3dic App 20160260687 - Gao; Guilian ; et al.	2016-09-08
Stacked die integrated circuit Grant 9,418,924 - Woychik , et al. August 16, 2	2016-08-16
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates Grant 9,397,038 - Uzoh , et al. July 19, 2	2016-07-19
Thermal vias disposed in a substrate without a liner layer App 20160197026 - Gao; Guilian	2016-07-07
Polymer member based interconnect Grant 9,373,585 - Uzoh , et al. June 21, 2	2016-06-21
Bond Via Array for Thermal Conductivity App 20160172268 - KATKAR; Rajesh ; et al.	2016-06-16
Integrated Circuit Assemblies With Rigid Layers Used For Protection Against Mechanical Thinning And For Other Purposes, And Methods Of Fabricating Such Assemblies App 20160163650 - GAO; Guilian ; et al.	2016-06-09
Thermal vias disposed in a substrate without a liner layer Grant 9,299,572 - Gao March 29, 2	2016-03-29
Polymer Member Based Interconnect App 20160079169 - Uzoh; Cyprian Emeka ; et al.	2016-03-17
Device And Method For An Integrated Ultra-high-density Device App 20160049383 - Woychik; Charles G. ; et al.	2016-02-18
Integrated Interposer Solutions For 2d And 3d Ic Packaging App 20150357272 - Shen; Hong ; et al.	2015-12-10
Stacked Die Integrated Circuit App 20150270209 - WOYCHIK; Charles G. ; et al.	2015-09-24
Thermal Vias Disposed in a Substrate Without a Liner Layer App 20150255364 - GAO; Guilian	2015-09-10
System and method for in-situ conditioning of emitter electrode with silver Grant 8,804,296 - Honer , et al. August 12, 2	2014-08-12
Microelectronic assemblies having compliancy and methods therefor Grant 8,759,973 - Oganesian , et al. June 24, 2	2014-06-24
Electrohydrodynamic (ehd) Fluid Mover With Field Blunting Structures In Flow Channel For Spatially Selective Suppression Of Ion Generation App 20140003964 - Jewell-Larsen; Nels ; et al.	2014-01-02
Electrode conditioning in an electrohydrodynamic fluid accelerator device Grant 8,482,898 - Honer , et al. July 9, 2	2013-07-09
Emitter Wire With Layered Cross-section App 20130056241 - Gao; Guilian ; et al.	2013-03-07
Wafer level chip package and a method of fabricating thereof Grant 8,378,487 - Kang , et al. February 19, 2	2013-02-19
System And Method For In-situ Conditioning Of Emitter Electrode With Silver App 20130021715 - Jewell-Larsen; Nels ; et al.	2013-01-24
Collective and synergistic MRAM shields Grant 8,269,319 - Honer , et al. September 18, 2	2012-09-18
Wafer Level Chip Package And A Method Of Fabricating Thereof App 20120126407 - Kang; Teck-Gyu ; et al.	2012-05-24
Electronic System With Ehd Air Mover Ventilation Path Isolated From Internal Air Plenum App 20120113590 - Schwiebert; Matthew ; et al.	2012-05-10
Layered Emitter Coating Structure for Crack Resistance with PDAG Coatings App 20120103568 - Jewell-Larsen; Nels ; et al.	2012-05-03
Microelectronic Assemblies Having Compliancy And Methods Therefor App 20120091582 - Oganesian; Vage ; et al.	2012-04-19
Wafer level chip package and a method of fabricating thereof Grant 8,133,808 - Kang , et al. March 13, 2	2012-03-13
Microelectronic assemblies having compliancy and methods therefor Grant 8,115,308 - Oganesian , et al. February 14, 2	2012-02-14
Emitter Wire Cleaning Device With Wear-tolerant Profile App 20120000486 - Braunstein; Daniel ; et al.	2012-01-05
Granular Abrasive Cleaning Of An Emitter Wire App 20110308773 - Gao; Guilian ; et al.	2011-12-22
Method of forming a wafer level package Grant 8,053,281 - Honer , et al. November 8, 2	2011-11-08
Electrode Conditioning In An Electrohydrodynamic Fluid Accelerator Device App 20110265832 - Honer; Ken ; et al.	2011-11-03
Microelectronic Assemblies Having Compliancy and Methods Therefor App 20100230812 - Oganesian; Vage ; et al.	2010-09-16
Microelectronic assemblies having compliancy and methods therefor Grant 7,749,886 - Oganesian , et al. July 6, 2	2010-07-06
Microelectronic packages and methods therefor Grant 7,719,121 - Humpston , et al. May 18, 2	2010-05-18
Method of forming a wafer level package App 20090162975 - Honer; Kenneth Allen ; et al.	2009-06-25
Microelectronic assemblies having compliancy and methods therefor App 20080150121 - Oganesian; Vage ; et al.	2008-06-26
Collective and synergistic MRAM shields App 20080122047 - Honer; Kenneth Allen ; et al.	2008-05-29
Microelectronic packages and methods therefor App 20080088033 - Humpston; Giles ; et al.	2008-04-17
Wafer level chip package and a method of fabricating thereof App 20080067663 - Kang; Teck-Gyu ; et al.	2008-03-20
Solder pad structure for low temperature co-fired ceramic package and method for making the same Grant 6,686,665 - Gao , et al. February 3, 2	2004-02-03
Fluxing media for non-VOC, no-clean soldering Grant 5,958,151 - Gao , et al. September 28, 1	1999-09-28
Solvent-less vapor deposition apparatus and process for application of soldering fluxes Grant 5,514,414 - Gao , et al. May 7, 1	1996-05-07
Water-based no-clean flux formulation Grant 5,443,660 - Gao , et al. August 22, 1	1995-08-22

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