Ganesan; Sanka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ganesan; Sanka.The latest application filed is for "coreless electronic substrates having embedded inductors".

Company Profile

36.45.73

Ganesan; Sanka - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Coreless Electronic Substrates Having Embedded Inductors App 20220293327 - Ganesan; Sanka ; et al.	2022-09-15
Ultra-thin, hyper-density semiconductor packages Grant 11,430,724 - Mallik , et al. August 30, 2	2022-08-30
Stacked silicon die architecture with mixed flipcip and wirebond interconnect Grant 11,410,919 - Sankman , et al. August 9, 2	2022-08-09
Interposer package-on-package (PoP) with solder array thermal contacts Grant 11,387,175 - Mallik , et al. July 12, 2	2022-07-12
Microelectronic Component Having Molded Regions With Through-mold Vias App 20220181262 - Ganesan; Sanka ; et al.	2022-06-09
Integrated Circuit Assemblies With Direct Chip Attach To Circuit Boards App 20220173046 - Gomes; Wilfred ; et al.	2022-06-02
Planar Integrated Circuit Package Interconnects App 20220157701 - Sankman; Robert L. ; et al.	2022-05-19
Microelectronic component having molded regions with through-mold vias Grant 11,302,643 - Ganesan , et al. April 12, 2	2022-04-12
Planar integrated circuit package interconnects Grant 11,276,630 - Sankman , et al. March 15, 2	2022-03-15
Electronic Package With Stud Bump Electrical Connections App 20210366862 - Li; Zhaozhi ; et al.	2021-11-25
Integrated Circuit Structures In Package Substrates App 20210351116 - Ganesan; Sanka ; et al.	2021-11-11
Microelectronic Component Having Molded Regions With Through-mold Vias App 20210305162 - Ganesan; Sanka ; et al.	2021-09-30
Electronic package with stud bump electrical connections Grant 11,127,706 - Li , et al. September 21, 2	2021-09-21
Integrated circuit structures in package substrates Grant 11,107,757 - Ganesan , et al. August 31, 2	2021-08-31
Embedded Die Architecture And Method Of Making App 20210193579 - Ganesan; Sanka ; et al.	2021-06-24
Semiconductor Package Having Wafer-level Active Die And External Die Mount App 20210082826 - MEHTA; Vipul Vijay ; et al.	2021-03-18
Ultrathin Bridge And Multi-die Ultrafine Pitch Patch Architecture And Method Of Making App 20210043570 - GANESAN; Sanka ; et al.	2021-02-11
Multi-die Ultrafine Pitch Patch Architecture And Method Of Making App 20210035911 - GANESAN; Sanka ; et al.	2021-02-04
Semiconductor package having wafer-level active die and external die mount Grant 10,910,317 - Mehta , et al. February 2, 2	2021-02-02
Scalable High Speed High Bandwidth Io Signaling Package Architecture And Method Of Making App 20210028116 - GANESAN; Sanka ; et al.	2021-01-28
Integrated circuit packages Grant 10,903,166 - Ganesan , et al. January 26, 2	2021-01-26
Package On Active Silicon Semiconductor Packages App 20210013188 - Gomes; Wilfred ; et al.	2021-01-14
Rlink--die to die channel interconnect configurations to improve signaling Grant 10,784,204 - Aygun , et al. Sept	2020-09-22
Crystalline Carbon Heat Spreading Materials For Ic Die Hot Spot Reduction App 20200273768 - Karhade; Omkar ; et al.	2020-08-27
Ic Die Package Thermal Spreader And Emi Shield Comprising Graphite App 20200273811 - Mallik; Debendra ; et al.	2020-08-27
Ultra-thin, Hyper-density Semiconductor Packages App 20200273784 - MALLIK; Debendra ; et al.	2020-08-27
Stacked Silicon Die Architecture With Mixed Flipcip And Wirebond Interconnect App 20200273783 - SANKMAN; Robert L. ; et al.	2020-08-27
Coupled Cooling Fins In Ultra-small Systems App 20200273772 - Uppal; Aastha ; et al.	2020-08-27
Integrated Circuit Structures In Package Substrates App 20200251411 - Kind Code	2020-08-06
Planar Integrated Circuit Package Interconnects App 20200235047 - Sankman; Robert L. ; et al.	2020-07-23
Thermal Management Solutions For Integrated Circuit Packages App 20200227332 - Singh; Kumar Abhishek ; et al.	2020-07-16
Integrated circuit structures in package substrates Grant 10,672,693 - Ganesan , et al.	2020-06-02
Edge-firing antenna walls built into substrate Grant 10,658,765 - Chavali , et al.	2020-05-19
High density package interconnects Grant 10,658,279 - Ganesan , et al.	2020-05-19
Planar integrated circuit package interconnects Grant 10,651,116 - Sankman , et al.	2020-05-12
Electronic Package With Stud Bump Electrical Connections App 20200105701 - Li; Zhaozhi ; et al.	2020-04-02
Stacked Wire-bond Dice Attached By Pillars Or Bumps Above A Flip-chip Die On A Semiconductor Package Substrate App 20200098727 - Mallik; Debendra ; et al.	2020-03-26
Scalable package architecture and associated techniques and configurations Grant 10,580,758 - Ganesan , et al.	2020-03-03
Rlink - Die To Die Channel Interconnect Configurations To Improve Signaling App 20200066641 - AYGUN; Kemal ; et al.	2020-02-27
Interposer Package-on-package (pop) With Solder Array Thermal Contacts App 20200051899 - MALLIK; Debendra ; et al.	2020-02-13
Edge-firing Antenna Walls Built Into Substrate App 20200006866 - Chavali; Sri Chaitra Jyotsna ; et al.	2020-01-02
Chip Scale Thin 3d Die Stacked Package App 20200006293 - SANKMAN; Robert ; et al.	2020-01-02
Integrated Circuit Packages App 20190363052 - Ganesan; Sanka ; et al.	2019-11-28
Integrated Circuit Structures In Package Substrates App 20190304887 - Ganesan; Sanka ; et al.	2019-10-03
Semiconductor Package Having Wafer-level Active Die And External Die Mount App 20190279938 - MEHTA; Vipul Vijay ; et al.	2019-09-12
Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contact Grant 10,396,036 - Zhang , et al. A	2019-08-27
High Density Package Interconnects App 20190172778 - GANESAN; Sanka ; et al.	2019-06-06
High density package interconnects Grant 10,204,851 - Ganesan , et al. Feb	2019-02-12
Package on package architecture and method for making Grant 10,170,409 - Ganesan , et al. J	2019-01-01
Rlink-ground Shielding Attachment Structures And Shadow Voiding For Data Signal Contacts Of Package Devices; Vertical Ground Shielding Structures And Shield Fencing Of Vertical Data Signal Interconnects Of Package Devices; And Ground Shielding For Electro Optical Module Connector Data Signal Contact App 20180331043 - ZHANG; Yu Amos ; et al.	2018-11-15
Scalable Package Architecture And Associated Techniques And Configurations App 20180331075 - Ganesan; Sanka ; et al.	2018-11-15
Scalable package architecture and associated techniques and configurations Grant 10,037,976 - Ganesan , et al. July 31, 2	2018-07-31
High Density Package Interconnects App 20180182696 - GANESAN; Sanka ; et al.	2018-06-28
High density package interconnects Grant 9,922,916 - Ganesan , et al. March 20, 2	2018-03-20
Planar Integrated Circuit Package Interconnects App 20180005928 - Sankman; Robert L. ; et al.	2018-01-04
Scalable Package Architecture And Associated Techniques And Configurations App 20180005997 - Ganesan; Sanka ; et al.	2018-01-04
Cpu Package Substrates With Removable Memory Mechanical Interfaces App 20180007791 - Prakash; Mani ; et al.	2018-01-04
CPU package substrates with removable memory mechanical interfaces Grant 9,832,876 - Prakash , et al. November 28, 2	2017-11-28
Scalable package architecture and associated techniques and configurations Grant 9,793,244 - Ganesan , et al. October 17, 2	2017-10-17
Integrated circuit package structures Grant 9,721,880 - Yao , et al. August 1, 2	2017-08-01
Integrated Circuit Package Structures App 20170170105 - Yao; Jimin ; et al.	2017-06-15
System interconnect for integrated circuits Grant 9,660,364 - Wig , et al. May 23, 2	2017-05-23
Low profile zero/low insertion force package top side flex cable connector architecture Grant 9,640,887 - Ganesan , et al. May 2, 2	2017-05-02
Shaped and oriented solder joints Grant 9,564,412 - Aleksov , et al. February 7, 2	2017-02-07
Package On Package Architecture And Method For Making App 20160284642 - GANESAN; Sanka ; et al.	2016-09-29
High Density Package Interconnects App 20160284635 - GANESAN; Sanka ; et al.	2016-09-29
Scalable Package Architecture And Associated Techniques And Configurations App 20160260690 - Ganesan; Sanka ; et al.	2016-09-08
Interconnect Architecture With Stacked Flex Cable App 20160248210 - GANESAN; Sanka ; et al.	2016-08-25
Low Profile Zero/low Insertion Force Package Top Side Flex Cable Connector Architecture App 20160240949 - Ganesan; Sanka ; et al.	2016-08-18
Cpu Package Substrates With Removable Memory Mechanical Interfaces App 20160183374 - Prakash; Mani ; et al.	2016-06-23
High density package interconnects Grant 9,368,437 - Ganesan , et al. June 14, 2	2016-06-14
Interconnect architecture with stacked flex cable Grant 9,332,643 - Ganesan , et al. May 3, 2	2016-05-03
Low profile zero/low insertion force package top side flex cable connector architecture Grant 9,324,678 - Ganesan , et al. April 26, 2	2016-04-26
Shaped And Oriented Solder Joints App 20160086905 - Aleksov; Aleksandar ; et al.	2016-03-24
Integrated circuit connectors Grant 9,265,170 - Swaminathan , et al. February 16, 2	2016-02-16
Shaped and oriented solder joints Grant 9,233,835 - Aleksov , et al. January 12, 2	2016-01-12
Die Package Architecture With Embedded Die And Simplified Redistribution Layer App 20150187608 - GANESAN; Sanka ; et al.	2015-07-02
Integrated Circuit Connectors App 20150118870 - Swaminathan; Rajasekaran ; et al.	2015-04-30
Interconnect Architecture With Stacked Flex Cable App 20140273552 - GANESAN; Sanka ; et al.	2014-09-18
Low Profile Zero/low Insertion Force Package Top Side Flex Cable Connector Architecture App 20140217571 - Ganesan; Sanka ; et al.	2014-08-07
High Density Package Interconnects App 20140217579 - Ganesan; Sanka ; et al.	2014-08-07
System Interconnect For Integrated Circuits App 20140106582 - Wig; Timothy ; et al.	2014-04-17
Shaped And Oriented Solder Joints App 20130335939 - Aleksov; Aleksandar ; et al.	2013-12-19
Package-on-package Interconnect Stiffener App 20130292838 - Ganesan; Sanka ; et al.	2013-11-07
Package-on-package interconnect stiffener Grant 8,513,792 - Ganesan , et al. August 20, 2	2013-08-20
Flex cable and method for making the same Grant 8,508,947 - Ganesan , et al. August 13, 2	2013-08-13
Method of making substrate package with through holes for high speed I/O flex cable Grant 8,353,101 - Gurumurthy , et al. January 15, 2	2013-01-15
Input/output package architectures Grant 8,188,594 - Ganesan , et al. May 29, 2	2012-05-29
Flex Cable And Method For Making The Same App 20120081858 - Ganesan; Sanka ; et al.	2012-04-05
First-level interconnects with slender columns, and processes of forming same App 20110122592 - Ganesan; Sanka ; et al.	2011-05-26
Substrate Package With Through Holes For High Speed I/o Flex Cable App 20110108427 - Gurumurthy; Charan ; et al.	2011-05-12
Substrate package with through holes for high speed I/O flex cable Grant 7,888,784 - Gurumurthy , et al. February 15, 2	2011-02-15
Package-on-package interconnect stiffener App 20100258927 - Ganesan; Sanka ; et al.	2010-10-14
Input/output package architectures, and methods of using same Grant 7,705,447 - Ganesan , et al. April 27, 2	2010-04-27
Input/output package architectures, and methods of using same App 20100096743 - Ganesan; Sanka ; et al.	2010-04-22
Input/output Package Architectures, And Methods Of Using Same App 20100078781 - Ganesan; Sanka ; et al.	2010-04-01
Substrate Package With Through Holes For High Speed I/o Flex Cable App 20100078826 - Gurumurthy; Charan ; et al.	2010-04-01
Packaged Integrated Circuit And Method Of Forming Thereof App 20090065931 - Rangaraj; Sudarshan V. ; et al.	2009-03-12

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