FUNAYA; Takuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for FUNAYA; Takuo.The latest application filed is for "method for predicting reliability of semiconductor device".

Company Profile

0.37.42

FUNAYA; Takuo - Tokyo JP
Funaya; Takuo - Kawasaki JP
Funaya; Takuo - Kanagawa JP
Funaya; Takuo - Kawasaki-shi JP
Funaya; Takuo - Minato-ku JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Predicting Reliability Of Semiconductor Device App 20220260504 - FUNAYA; Takuo	2022-08-18
Semiconductor device Grant 11,063,009 - Sakata , et al. July 13, 2	2021-07-13
Semiconductor device with coils in different wiring layers Grant 10,483,199 - Igarashi , et al. Nov	2019-11-19
Semiconductor device and method of manufacturing the same Grant 10,157,974 - Funaya , et al. Dec	2018-12-18
Semiconductor Device App 20180337124 - IGARASHI; Takayuki ; et al.	2018-11-22
Semiconductor device and method of manufacturing the same Grant 10,128,125 - Funaya , et al. November 13, 2	2018-11-13
Electronic Apparatus And Manufacturing Method Therefor App 20180310529 - Funaya; Takuo ; et al.	2018-11-01
Semiconductor Device App 20180294239 - SAKATA; Kenji ; et al.	2018-10-11
Electronic apparatus and manufacturing method therefor Grant 10,085,425 - Funaya , et al. October 2, 2	2018-10-02
Semiconductor device with inductively coupled coils Grant 10,062,642 - Igarashi , et al. August 28, 2	2018-08-28
Semiconductor Device And Method Of Manufacturing The Same App 20180069073 - Funaya; Takuo ; et al.	2018-03-08
Semiconductor Device And Method Of Manufacturing The Same App 20180061662 - FUNAYA; Takuo ; et al.	2018-03-01
Semiconductor device and method of manufacturing the same Grant 9,818,815 - Funaya , et al. November 14, 2	2017-11-14
Semiconductor Device App 20170317024 - IGARASHI; Takayuki ; et al.	2017-11-02
Semiconductor device and method of manufacturing the same Grant 9,805,950 - Funaya , et al. October 31, 2	2017-10-31
Semiconductor device with coils in different wiring layers Grant 9,711,451 - Igarashi , et al. July 18, 2	2017-07-18
Semiconductor Device And Method Of Manufacturing The Same App 20170194164 - FUNAYA; Takuo ; et al.	2017-07-06
Semiconductor device and method of manufacturing the same Grant 9,653,396 - Funaya , et al. May 16, 2	2017-05-16
Semiconductor device Grant 9,536,828 - Uchida , et al. January 3, 2	2017-01-03
Method of manufacturing semiconductor device Grant 9,502,489 - Funaya , et al. November 22, 2	2016-11-22
Semiconductor Device And Method Of Manufacturing The Same App 20160087025 - Funaya; Takuo ; et al.	2016-03-24
Semiconductor Device And Method Of Manufacturing The Same App 20160035672 - FUNAYA; Takuo ; et al.	2016-02-04
Semiconductor Device App 20160027732 - Igarashi; Takayuki ; et al.	2016-01-28
Electronic Apparatus And Manufacturing Method Therefor App 20160000045 - Funaya; Takuo ; et al.	2016-01-07
Semiconductor device and method of manufacturing the same Grant 9,219,108 - Funaya , et al. December 22, 2	2015-12-22
Semiconductor Device App 20150318245 - UCHIDA; Shinichi ; et al.	2015-11-05
Method Of Manufacturing Semiconductor Device App 20150206934 - Funaya; Takuo ; et al.	2015-07-23
Semiconductor Device And Method Of Manufacturing The Same App 20150162395 - Funaya; Takuo ; et al.	2015-06-11
Semiconductor device and method of manufacturing the same Grant 8,987,861 - Funaya , et al. March 24, 2	2015-03-24
Semiconductor device manufacturing method Grant 8,975,150 - Mori , et al. March 10, 2	2015-03-10
Semiconductor Device And Method Of Manufacturing The Same App 20140175602 - Funaya; Takuo ; et al.	2014-06-26
Wiring board capable of containing functional element and method for manufacturing same Grant 8,692,135 - Funaya , et al. April 8, 2	2014-04-08
Semiconductor device and method for manufacturing the same Grant 8,536,691 - Kikuchi , et al. September 17, 2	2013-09-17
Method Of Redistributing Functional Element App 20130237055 - Funaya; Takuo ; et al.	2013-09-12
Semiconductor device and method for designing the same Grant 8,450,843 - Sasaki , et al. May 28, 2	2013-05-28
Method of manufacturing a wiring board Grant 8,389,414 - Kikuchi , et al. March 5, 2	2013-03-05
Crack Reduction At Metal/organic Dielectric Interface App 20120156453 - GONZALEZ; Mario ; et al.	2012-06-21
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package Grant 8,198,140 - Murai , et al. June 12, 2	2012-06-12
Semiconductor Device Manufacturing Method App 20110281401 - MORI; Kentaro ; et al.	2011-11-17
Semiconductor device including an LSI chip and a method for manufacturing the same Grant 8,043,953 - Murai , et al. October 25, 2	2011-10-25
Semiconductor device and method for manufacturing same Grant 8,035,217 - Mori , et al. October 11, 2	2011-10-11
Wiring Board Capable Of Containing Functional Element And Method For Manufacturing Same App 20110155433 - Funaya; Takuo ; et al.	2011-06-30
Method Of Manufacturing A Wiring Board App 20110136298 - KIKUCHI; Katsumi ; et al.	2011-06-09
Wiring board, semiconductor device using wiring board and their manufacturing methods Grant 7,911,038 - Kikuchi , et al. March 22, 2	2011-03-22
Wiring Substrate For Mounting Semiconductors, Method Of Manufacturing The Same, And Semiconductor Package App 20110003472 - MURAI; Hideya ; et al.	2011-01-06
Wiring board, method for manufacturing same, and semiconductor package Grant 7,838,779 - Yamamichi , et al. November 23, 2	2010-11-23
Solder, and mounted components using the same Grant 7,829,199 - Funaya , et al. November 9, 2	2010-11-09
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package Grant 7,816,782 - Murai , et al. October 19, 2	2010-10-19
Semiconductor Device And Method For Designing The Same App 20100237492 - Sasaki; Hideki ; et al.	2010-09-23
Wiring Board Composite Body, Semiconductor Device, And Method For Manufacturing The Wiring Board Composite Body And The Semiconductor Device App 20100232127 - Mori; Kentaro ; et al.	2010-09-16
Functional-device-embedded Circuit Board, Method For Manufacturing The Same, And Electronic Equipment App 20100103634 - Funaya; Takuo ; et al.	2010-04-29
Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device Grant 7,692,297 - Miyazaki , et al. April 6, 2	2010-04-06
Wiring board and method for manufacturing the same Grant 7,674,989 - Kikuchi , et al. March 9, 2	2010-03-09
Circuit Substrate, An Electronic Device Arrangement And A Manufacturing Process For The Circuit Substrate App 20100044845 - Funaya; Takuo ; et al.	2010-02-25
Wiring Board, Semiconductor Device Using Wiring Board And Their Manufacturing Methods App 20090315190 - Kikuchi; Katsumi ; et al.	2009-12-24
Semiconductor Device And Method For Manufacturing The Same App 20090294951 - Murai; Hideya ; et al.	2009-12-03
Semiconductor Device And Method For Manufacturing The Same App 20090283895 - Kikuchi; Katsumi ; et al.	2009-11-19
Wiring Board For Mounting Semiconductor Device, Manufacturing Method Of The Same, And Wiring Board Assembly App 20090046441 - Funaya; Takuo ; et al.	2009-02-19
Semiconductor Device And Method For Manufacturing Same App 20080303136 - Mori; Kentaro ; et al.	2008-12-11
Solder, and Mounted Components Using the Same App 20080026240 - Funaya; Takuo ; et al.	2008-01-31
Wiring board, method for manufacturing same, and semiconductor package App 20060283625 - Yamamichi; Shintaro ; et al.	2006-12-21
Wiring board and method for manufacturing the same App 20060283629 - Kikuchi; Katsumi ; et al.	2006-12-21
Solder and packaging therefrom App 20060011702 - Funaya; Takuo ; et al.	2006-01-19
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package App 20060012048 - Murai; Hideya ; et al.	2006-01-19
Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device App 20060012038 - Miyazaki; Takashi ; et al.	2006-01-19
Electronic device assembly and a method of connecting electronic devices constituting the same Grant 6,798,070 - Funaya , et al. September 28, 2	2004-09-28
Supporting Substrate To Be Bonded With Semiconductor Bare Chip And Method Of Thermocompression-bonding The Same App 20020092610 - FUNAYA, TAKUO ; et al.	2002-07-18
Semiconductor device, production method thereof, and coil spring cutting jig and coil spring guiding jig applied thereto App 20020056922 - Funaya, Takuo ; et al.	2002-05-16
Electronic device assembly and a method of connecting electronic devices constituting the same App 20020042164 - Funaya, Takuo ; et al.	2002-04-11
Function element, substrate for mounting function element thereon, and method of connecting them to each other Grant 6,313,533 - Funaya , et al. November 6, 2	2001-11-06
Electronic device assembly and a method of connecting electronic devices constituting the same App 20010003656 - Funaya, Takuo ; et al.	2001-06-14
Structure and method for mounting a saw device Grant 6,078,123 - Tanaka , et al. June 20, 2	2000-06-20
Method of thermocompression bonding a supporting substrate to a semiconductor bare chip Grant 6,042,682 - Funaya , et al. March 28, 2	2000-03-28

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