Fukunaga; Akira

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fukunaga; Akira.The latest application filed is for "information processing apparatus and storage medium".

Company Profile

1.29.57

Fukunaga; Akira - Tokyo JP
Fukunaga; Akira - Kanagawa JP
Fukunaga, Akira - Kanagawa-ken JP
Fukunaga, Akira - Chigasaki-shi JP
Fukunaga; Akira - Chigasaki JP
Fukunaga; Akira - Fujisawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Information Processing Apparatus And Storage Medium App 20220292889 - Tanizawa; Yoshimori ; et al.	2022-09-15
Substrate Polishing Apparatus And Substrate Polishing Method App 20210166967 - FUKUNAGA; Akira ; et al.	2021-06-03
Substrate Cleaning Apparatus And Substrate Cleaning Method App 20210039142 - TAKATOH; Chikako ; et al.	2021-02-11
Method For Forming Conductive Structure, And Plating Apparatus And Plating Method App 20140287580 - NAGAI; Mizuki ; et al.	2014-09-25
Plating apparatus and plating method Grant 8,784,636 - Nagai , et al. July 22, 2	2014-07-22
Substrate Processing Method App 20130220382 - FUKUDA; Akira ; et al.	2013-08-29
Substrate processing method, substrate processing apparatus, and control program Grant 8,211,242 - Inoue , et al. July 3, 2	2012-07-03
Method And Apparatus For Processing Substrate App 20100105154 - WANG; XINMING ; et al.	2010-04-29
Semiconductor Device And Method For Manufacturing The Same, And Processing Liquid App 20100075498 - TAKAGI; Daisuke ; et al.	2010-03-25
Polishing method and apparatus App 20090197510 - Shima; Shohei ; et al.	2009-08-06
Plating apparatus and plating method App 20090139870 - Nagai; Mizuki ; et al.	2009-06-04
Method and apparatus for forming metal film Grant 7,498,261 - Wang , et al. March 3, 2	2009-03-03
Substrate processing method and apparatus App 20090000549 - Wang; Xinming ; et al.	2009-01-01
Substrate Processing Method, Substrate Processing Apparatus, and Control Program App 20080314870 - Inoue; Yuki ; et al.	2008-12-25
Substrate processing method Grant 7,407,821 - Wang , et al. August 5, 2	2008-08-05
Substrate Processing Method and Substrate Processing Apparatus App 20080138508 - Takagi; Daisuke ; et al.	2008-06-12
Interconnects forming method and interconnects forming apparatus Grant 7,374,584 - Wang , et al. May 20, 2	2008-05-20
Semiconductor Device and Method for Manufacturing the Same, and Processing Liquid App 20080067679 - Takagi; Daisuke ; et al.	2008-03-20
Substrate Processing Method and Apparatus App 20080047583 - Fukunaga; Akira ; et al.	2008-02-28
Method and apparatus for processing substrate App 20080000776 - Wang; Xinming ; et al.	2008-01-03
Substrate Processing Apparatus App 20070289604 - Fukunaga; Yukio ; et al.	2007-12-20
Polishing Apparatus and Polishing Method App 20070254558 - Kodera; Masako ; et al.	2007-11-01
Method for processing substrate Grant 7,285,492 - Wang , et al. October 23, 2	2007-10-23
Polishing method and polishing apparatus App 20070243797 - Fukunaga; Akira ; et al.	2007-10-18
Interconnects forming method and interconnects forming apparatus App 20070228569 - Wang; Xinming ; et al.	2007-10-04
Polishing apparatus and polishing method App 20070205112 - Kodera; Masako ; et al.	2007-09-06
Method of polishing thin film formed on substrate Grant 7,262,849 - Shima , et al. August 28, 2	2007-08-28
Method of forming thin metal films on substrates App 20070141251 - Fukunaga; Akira ; et al.	2007-06-21
Interconnects forming method and interconnects forming apparatus Grant 7,217,653 - Wang , et al. May 15, 2	2007-05-15
Polishing method, polishing apparatus, and electrolytic polishing apparatus App 20070099426 - Tsujimura; Manabu ; et al.	2007-05-03
Method of forming thin metal films on substrates Grant 7,179,503 - Fukunaga , et al. February 20, 2	2007-02-20
Holding unit, processing apparatus and holding method of substrates Grant 7,055,535 - Kunisawa , et al. June 6, 2	2006-06-06
Method and apparatus for forming interconnects App 20060086618 - Fukunaga; Akira ; et al.	2006-04-27
Method and apparatus for forming metal film App 20060057839 - Wang; Xinming ; et al.	2006-03-16
Method of and apparatus for manufacturing semiconductor device App 20060003521 - Fukunaga; Akira ; et al.	2006-01-05
Interconnects forming method and interconnects forming apparatus App 20050282378 - Fukunaga, Akira ; et al.	2005-12-22
Method for forming protective film and electroless plating bath App 20050282384 - Nawafune, Hidemi ; et al.	2005-12-22
Method and apparatus for forming thin film of metal Grant 6,972,256 - Fukunaga , et al. December 6, 2	2005-12-06
Method of polishing thin film formed on substrate App 20050254051 - Shima, Shohei ; et al.	2005-11-17
Method and apparatus for processing substrate App 20050245080 - Wang, Xinming ; et al.	2005-11-03
Wet processing method and processing apparatus of substrate App 20050208774 - Fukunaga, Akira ; et al.	2005-09-22
Substrate processing method and apparatus App 20050191858 - Fukunaga, Akira ; et al.	2005-09-01
Reactive probe chip, composite substrate and method for fabrication of the same App 20050191699 - Nagasawa, Hiroshi ; et al.	2005-09-01
Reactive probe chip, composite substrate and method for fabrication of the same Grant 6,897,021 - Nagasawa , et al. May 24, 2	2005-05-24
Electrolytic machining method and apparatus Grant 6,875,335 - Mori , et al. April 5, 2	2005-04-05
Composite metallic ultrafine particles and process for producing the same Grant 6,871,773 - Fukunaga , et al. March 29, 2	2005-03-29
Interconnects forming method and interconnects forming apparatus App 20050064702 - Wang, Xinming ; et al.	2005-03-24
Substrate processing method and substrate processing apparatus App 20050022909 - Wang, Xinming ; et al.	2005-02-03
Substrate processing method and apparatus App 20050009213 - Wang, Xinming ; et al.	2005-01-13
Probe Beads for affirnity reaction and detection system App 20050003556 - Nagasawa, Hiroshi ; et al.	2005-01-06
Method and apparatus for processing a substrate App 20040258848 - Fukunaga, Akira ; et al.	2004-12-23
Method of and apparatus for manufacturing semiconductor device App 20040248405 - Fukunaga, Akira ; et al.	2004-12-09
Substrate processing method and substrate processing apparatus App 20040219298 - Fukunaga, Akira ; et al.	2004-11-04
Composite metallic ultrafine particles and process for producing the same App 20040173666 - Fukunaga, Akira ; et al.	2004-09-09
Plating apparatus and method of managing plating liquid composition App 20040163948 - Fukunaga, Akira ; et al.	2004-08-26
Method and apparatus of producing thin film of metal or metal compound Grant 6,780,245 - Horie , et al. August 24, 2	2004-08-24
Method and apparatus for etching ruthenium films Grant 6,776,919 - Fukunaga , et al. August 17, 2	2004-08-17
Method of and apparatus for cleaning substrate Grant 6,745,784 - Katakabe , et al. June 8, 2	2004-06-08
Composite metallic ultrafine particles and process for producing the same Grant 6,743,395 - Fukunaga , et al. June 1, 2	2004-06-01
Plating apparatus and method of managing plating liquid composition Grant 6,740,242 - Fukunaga , et al. May 25, 2	2004-05-25
Method of and apparatus for forming interconnection Grant 6,730,596 - Fukunaga , et al. May 4, 2	2004-05-04
Plating method, interconnection forming method, and apparatus for carrying out those methods Grant 6,709,555 - Ogure , et al. March 23, 2	2004-03-23
Holding unit, processing apparatus and holding method of substrates App 20040016452 - Kunisawa, Junji ; et al.	2004-01-29
Electrolytic machining method and apparatus App 20030230493 - Mori, Yuzo ; et al.	2003-12-18
Solution containing metal component, method of and apparatus for forming thin metal film App 20030224104 - Fukunaga, Akira ; et al.	2003-12-04
Method and apparatus for forming fine circuit interconnects App 20030186540 - Ito, Nobukazu ; et al.	2003-10-02
Method of and apparatus for cleaning substrate App 20030168089 - Katakabe, Ichiro ; et al.	2003-09-11
Electrolytic machining method and apparatus Grant 6,602,396 - Mori , et al. August 5, 2	2003-08-05
Method and apparatus of producing thin film of metal or metal compound App 20030098531 - Horie, Kuniaki ; et al.	2003-05-29
Method of and apparatus for cleaning substrate Grant 6,558,478 - Katakabe , et al. May 6, 2	2003-05-06
Method for mounting a semiconductor device App 20030079680 - Fukunaga, Akira ; et al.	2003-05-01
Method and apparatus for forming thin film of metal App 20020160103 - Fukunaga, Akira ; et al.	2002-10-31
Apparatus and nozzle device for gaseous polishing Grant 6,447,632 - Shinozuka , et al. September 10, 2	2002-09-10
Plating apparatus and method of managing plating liquid composition App 20020063097 - Fukunaga, Akira ; et al.	2002-05-30
Method and apparatus for etching ruthenium films App 20020060202 - Fukunaga, Akira ; et al.	2002-05-23
Electrolytic machining method and apparatus App 20020033343 - Mori, Yuzo ; et al.	2002-03-21
Composite metallic ultrafine particles and process for producing the same App 20020018896 - Fukunaga, Akira ; et al.	2002-02-14
Gas polishing apparatus and method Grant 6,315,858 - Shinozuka , et al. November 13, 2	2001-11-13
Reactive probe chip, composite substrate and method for fabrication of the same App 20010039072 - Nagasawa, Hiroshi ; et al.	2001-11-08
Method and apparatus of producing thin film of metal or metal compound App 20010010837 - Horie, Kuniaki ; et al.	2001-08-02
Method for mounting semiconductor device and structure thereof App 20010006455 - Fukunaga, Akira ; et al.	2001-07-05
Solution containing metal component, method of and apparatus for forming thin metal film App 20010004477 - Fukunaga, Akira ; et al.	2001-06-21
Gas adsorber for exhaust gas Grant 5,169,419 - Mori , et al. December 8, 1	1992-12-08
Method of treating waste gas Grant 4,861,578 - Fukunaga , et al. August 29, 1	1989-08-29
Gas absorber Grant 4,826,805 - Fukunaga , et al. May 2, 1	1989-05-02