Fukase; Katsuya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fukase; Katsuya.The latest application filed is for "multi-layer substrate and method for manufacturing multi-layer substrate".
Company Profile
6.38.35
- Fukase; Katsuya - Nagano JP
- Fukase; Katsuya - Nagano-shi Nagano
Patent Activity
| Patent | Date |
|---|---|
| Multi-layer substrate and method for manufacturing multi-layer substrate Grant 11,289,403 - Komatsu , et al. March 29, 2 | 2022-03-29 |
| Wiring board having two insulating films and hole penetrating therethrough Grant 11,152,293 - Oshima , et al. October 19, 2 | 2021-10-19 |
| Wiring substrate and semiconductor device Grant 10,892,217 - Arai , et al. January 12, 2 | 2021-01-12 |
| Multi-layer Substrate And Method For Manufacturing Multi-layer Substrate App 20200219794 - Komatsu; Misaki ; et al. | 2020-07-09 |
| Wiring substrate Grant 10,707,178 - Sato , et al. | 2020-07-07 |
| Wiring Board App 20200105651 - OSHIMA; Kazuhiro ; et al. | 2020-04-02 |
| Wiring Substrate And Semiconductor Device App 20200043841 - ARAI; Takashi ; et al. | 2020-02-06 |
| Electronic component-embedded board Grant 10,510,638 - Mizuno , et al. Dec | 2019-12-17 |
| Wiring Substrate App 20190378804 - SATO; Junji ; et al. | 2019-12-12 |
| Wiring board Grant 10,398,027 - Oshima , et al. A | 2019-08-27 |
| Carrier base material-added wiring substrate Grant 10,340,214 - Sato , et al. | 2019-07-02 |
| Wiring Board App 20190181084 - Oshima; Kazuhiro ; et al. | 2019-06-13 |
| Electronic component-embedded substrate and electronic component device Grant 10,321,574 - Sato , et al. | 2019-06-11 |
| Electronic Component-embedded Board App 20190103335 - Mizuno; Shigeru ; et al. | 2019-04-04 |
| Wiring board and semiconductor device Grant 10,109,580 - Matsumoto , et al. October 23, 2 | 2018-10-23 |
| Wiring board Grant 10,080,292 - Sato , et al. September 18, 2 | 2018-09-18 |
| Electronic component-embedded board and electronic component device Grant 10,080,293 - Sato , et al. September 18, 2 | 2018-09-18 |
| Wiring substrate and semiconductor device Grant 9,966,331 - Ota , et al. May 8, 2 | 2018-05-08 |
| Circuit board and method of manufacturing circuit board Grant 9,961,767 - Oshima , et al. May 1, 2 | 2018-05-01 |
| Wiring substrate and semiconductor device Grant 9,961,785 - Sato , et al. May 1, 2 | 2018-05-01 |
| Electronic Component-embedded Substrate And Electronic Component Device App 20180098430 - Sato; Junji ; et al. | 2018-04-05 |
| Carrier Base Material-added Wiring Substrate App 20180090426 - SATO; JUNJI ; et al. | 2018-03-29 |
| Carrier base material-added wiring substrate Grant 9,905,504 - Sato , et al. February 27, 2 | 2018-02-27 |
| Wiring Board App 20180047661 - OSHIMA; Kazuhiro ; et al. | 2018-02-15 |
| Electronic Component-embedded Board And Electronic Component Device App 20180042115 - Sato; Junji ; et al. | 2018-02-08 |
| Wiring Board App 20180014407 - SATO; Junji ; et al. | 2018-01-11 |
| Careless wiring substrate having an insulation layer with a bulged covering portion and semiconductor device thereof Grant 9,799,595 - Tomizawa , et al. October 24, 2 | 2017-10-24 |
| Wiring Board And Semiconductor Device App 20170179022 - MATSUMOTO; Shunichiro ; et al. | 2017-06-22 |
| Wiring Substrate And Semiconductor Device App 20170125333 - TOMIZAWA; HIROSHI ; et al. | 2017-05-04 |
| Wiring Substrate And Semiconductor Device App 20160276255 - Ota; Takayuki ; et al. | 2016-09-22 |
| Wiring substrate and semiconductor package Grant 9,433,109 - Kaneko , et al. August 30, 2 | 2016-08-30 |
| Method of manufacturing wiring substrate Grant 9,420,696 - Kiwanami , et al. August 16, 2 | 2016-08-16 |
| Circuit Board And Method Of Manufacturing Circuit Board App 20160234932 - OSHIMA; Kazuhiro ; et al. | 2016-08-11 |
| Wiring board and method of manufacturing wiring board Grant 9,313,904 - Kaneko , et al. April 12, 2 | 2016-04-12 |
| Wiring substrate and manufacturing method of wiring substrate Grant 9,313,894 - Kiwanami , et al. April 12, 2 | 2016-04-12 |
| Wiring Substrate and Semiconductor Device App 20160081194 - Sato; Junji ; et al. | 2016-03-17 |
| Wiring substrate and method for manufacturing the same Grant 9,253,897 - Kaneko , et al. February 2, 2 | 2016-02-02 |
| Wiring substrate and manufacturing method of wiring substrate Grant 9,232,657 - Kiwanami , et al. January 5, 2 | 2016-01-05 |
| Method of Manufacturing Wiring Substrate App 20150041053 - Kiwanami; Takayuki ; et al. | 2015-02-12 |
| Wiring Substrate And Method For Manufacturing The Same App 20150014020 - Kaneko; Kentaro ; et al. | 2015-01-15 |
| Wiring Board and Method of Manufacturing Wiring Board App 20150008020 - KANEKO; Kentaro ; et al. | 2015-01-08 |
| Wiring Substrate And Semiconductor Package App 20150009645 - KANEKO; Kentaro ; et al. | 2015-01-08 |
| Wiring Substrate And Manufacturing Method Of Wiring Substrate App 20140360760 - KIWANAMI; Takayuki ; et al. | 2014-12-11 |
| Wiring Substrate And Manufacturing Method Of Wiring Substrate App 20140360765 - KIWANAMI; Takayuki ; et al. | 2014-12-11 |
| Circuit board and method of manufacturing the same Grant 8,186,053 - Yokouchi , et al. May 29, 2 | 2012-05-29 |
| Method of manufacturing a wiring substrate Grant 8,166,648 - Fukase May 1, 2 | 2012-05-01 |
| Circuit board and method of manufacturing the same Grant 8,161,636 - Yokouchi , et al. April 24, 2 | 2012-04-24 |
| Method for forming resist pattern, method for producing circuit board, and circuit board Grant 8,143,533 - Kaneda , et al. March 27, 2 | 2012-03-27 |
| Manufacturing method of wiring board Grant 8,066,862 - Yamasaki , et al. November 29, 2 | 2011-11-29 |
| Wiring substrate and method of manufacturing the same Grant 7,999,193 - Fukase , et al. August 16, 2 | 2011-08-16 |
| Circuit Board And Method Of Manufacturing The Same App 20100122843 - YOKOUCHI; Kishio ; et al. | 2010-05-20 |
| Circuit board manufacturing method and circuit board Grant 7,679,004 - Fukase , et al. March 16, 2 | 2010-03-16 |
| Method for Forming Resist Pattern, Method for Producing Circuit Board, and Circuit Board App 20090236137 - Kaneda; Yasuo ; et al. | 2009-09-24 |
| Wiring Substrate And Method Of Manufacturing The Same App 20090218122 - Fukase; Katsuya | 2009-09-03 |
| Manufacturing Method of Wiring Board App 20090188806 - Yamasaki; Tomoo ; et al. | 2009-07-30 |
| Circuit Board And Method Of Manufacturing The Same App 20090095521 - YOKOUCHI; Kishio ; et al. | 2009-04-16 |
| Wiring Substrate And Method Of Manufacturing The Same App 20090095520 - Fukase; Katsuya ; et al. | 2009-04-16 |
| Method of forming metal plate pattern and circuit board Grant 7,454,832 - Sakai , et al. November 25, 2 | 2008-11-25 |
| Interposer, method of fabricating the same, and semiconductor device using the same Grant 7,415,762 - Fukase , et al. August 26, 2 | 2008-08-26 |
| Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions Grant 7,388,293 - Fukase , et al. June 17, 2 | 2008-06-17 |
| Circuit board manufacturing method and circuit board App 20070181994 - Fukase; Katsuya ; et al. | 2007-08-09 |
| Method of forming metal plate pattern and circuit board App 20070042585 - Sakai; Toyoaki ; et al. | 2007-02-22 |
| Method of forming metal plate pattern and circuit board App 20070017090 - Sakai; Toyoaki ; et al. | 2007-01-25 |
| Interposer, method of fabricating the same, and semiconductor device using the same App 20060263937 - Fukase; Katsuya ; et al. | 2006-11-23 |
| Process for making circuit board or lead frame Grant 7,005,241 - Fukase , et al. February 28, 2 | 2006-02-28 |
| Interposer, method of fabricating the same, and semiconductor device using the same App 20060001179 - Fukase; Katsuya ; et al. | 2006-01-05 |
| Process for making circuit board or lead frame App 20050124091 - Fukase, Katsuya ; et al. | 2005-06-09 |
| Process for making circuit board or lead frame App 20040245213 - Fukase, Katsuya ; et al. | 2004-12-09 |
| Lead frame and method for manufacturing same Grant 5,909,053 - Fukase , et al. June 1, 1 | 1999-06-01 |
| Lead frame and method for manufacturing same Grant 5,656,855 - Fukase , et al. August 12, 1 | 1997-08-12 |
| Lead frame and method for manufacturing same Grant 5,643,433 - Fukase , et al. July 1, 1 | 1997-07-01 |
| Transfer sheet and process for making a circuit substrate Grant 4,969,257 - Sato , et al. November 13, 1 | 1990-11-13 |
| Process for forming a circuit substrate Grant 4,867,839 - Sato , et al. September 19, 1 | 1989-09-19 |
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