loadpatents
name:-0.031091928482056
name:-0.020519971847534
name:-0.00054812431335449
Fukasawa; Masato Patent Filings

Fukasawa; Masato

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fukasawa; Masato.The latest application filed is for "polishing liquid, polishing liquid set, and substrate polishing method".

Company Profile
0.25.27
  • Fukasawa; Masato - Tokyo JP
  • FUKASAWA; Masato - Chiyoda-ku Tokyo
  • Fukasawa; Masato - Izunokuni Shizuoka JP
  • Fukasawa; Masato - Hitachi JP
  • Fukasawa; Masato - Hitachi-shi JP
  • Fukasawa; Masato - Ibaraki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Polishing liquid, polishing liquid set, and substrate polishing method
Grant 11,046,869 - Akutsu , et al. June 29, 2
2021-06-29
Polishing Liquid, Polishing Liquid Set, And Substrate Polishing Method
App 20180258319 - AKUTSU; Toshiaki ;   et al.
2018-09-13
Ink Jet Head
App 20180072051 - Fukasawa; Masato
2018-03-15
Ink Jet Head
App 20180072052 - FUKASAWA; Masato
2018-03-15
Polishing method
Grant 9,299,573 - Mishima , et al. March 29, 2
2016-03-29
Polishing solution for CMP and polishing method using the polishing solution
Grant 9,022,834 - Satou , et al. May 5, 2
2015-05-05
Polishing Method
App 20150031205 - Mishima; Kouji ;   et al.
2015-01-29
Polishing slurry for metal films and polishing method
Grant 8,901,002 - Tanaka , et al. December 2, 2
2014-12-02
CMP polishing slurry and method of polishing substrate
Grant 8,900,335 - Fukasawa , et al. December 2, 2
2014-12-02
Polishing solution for metal films and polishing method using the same
Grant 8,734,204 - Haga , et al. May 27, 2
2014-05-27
Polishing Slurry For Metal Films And Polishing Method
App 20140065826 - Tanaka; Takaaki ;   et al.
2014-03-06
Polishing slurry for metal films and polishing method
Grant 8,609,541 - Tanaka , et al. December 17, 2
2013-12-17
CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method
Grant 8,524,111 - Fukasawa , et al. September 3, 2
2013-09-03
Polishing Liquid For Metal Film And Polishing Method
App 20130217229 - Haga; Kouji ;   et al.
2013-08-22
Polishing liquid for metal film and polishing method
Grant 8,501,625 - Haga , et al. August 6, 2
2013-08-06
Polishing slurry and polishing method
Grant 8,481,428 - Amanokura , et al. July 9, 2
2013-07-09
Polishing liquid for metal and method of polishing
Grant 8,288,282 - Nomura , et al. October 16, 2
2012-10-16
CMP polishing slurry and polishing method
Grant 8,168,541 - Fukasawa , et al. May 1, 2
2012-05-01
Polishing Slurry And Polishing Method
App 20120064721 - Amanokura; Jin ;   et al.
2012-03-15
Polishing slurry and polishing method
Grant 8,084,363 - Amanokura , et al. December 27, 2
2011-12-27
Polishing slurry and polishing method
Grant 8,084,362 - Amanokura , et al. December 27, 2
2011-12-27
Polishing slurry and polishing method
Grant 8,075,800 - Koyama , et al. December 13, 2
2011-12-13
Polishing Solution For Cmp And Polishing Method Using The Polishing Solution
App 20110275285 - Satou; Eiichi ;   et al.
2011-11-10
Polishing Solution For Metal Films And Polishing Method Using The Same
App 20110104992 - Haga; Kouji ;   et al.
2011-05-05
Cmp Polishing Slurry And Polishing Method
App 20110028073 - Fukasawa; Masato ;   et al.
2011-02-03
Polishing Slurry For Metal Films And Polishing Method
App 20110009033 - Tanaka; Takaaki ;   et al.
2011-01-13
Polishing Liquid For Metal Film And Polishing Method
App 20100323584 - Haga; Kouji ;   et al.
2010-12-23
CMP polishing compound and polishing method
Grant 7,838,482 - Fukasawa , et al. November 23, 2
2010-11-23
CMP polishing slurry and polishing method
Grant 7,837,800 - Fukasawa , et al. November 23, 2
2010-11-23
Cmp Polishing Slurry And Method Of Polishing Substrate
App 20100210109 - Fukasawa; Masato ;   et al.
2010-08-19
Polishing Liquid For Metal And Method Of Polishing
App 20100197201 - Nomura; Yutaka ;   et al.
2010-08-05
Cmp Polishing Slurry, Additive Liquid For Cmp Polishing Slurry, And Substrate-polishing Processes Using The Same
App 20100015806 - Fukasawa; Masato ;   et al.
2010-01-21
Polishing Slurry For Cmp
App 20090283715 - Nobe; Shigeru ;   et al.
2009-11-19
Polishing slurry and polishing method
App 20090156007 - Amanokura; Jin ;   et al.
2009-06-18
CMP Abrasive Slurry for Polishing Insulation Film, Polishing Method, and Semiconductor Electronic Part Polished by the Polishing Method
App 20090047786 - Fukasawa; Masato ;   et al.
2009-02-19
Cmp Polishing Slurry and Method of Polishing Substrate
App 20080254717 - Fukasawa; Masato ;   et al.
2008-10-16
CMP polishing slurry and polishing method
App 20080214093 - Fukasawa; Masato ;   et al.
2008-09-04
Cmp Polishing Slurry and Method of Polishing Substrate
App 20080003925 - Fukasawa; Masato ;   et al.
2008-01-03
Polishing slurry and polishing method
App 20070232197 - Amanokura; Jin ;   et al.
2007-10-04
Cmp Polishing Slurry And Method Of Polishing Substrate
App 20070218811 - Kurata; Yasushi ;   et al.
2007-09-20
Polishing slurry for silicon oxide, additive liquid and polishing method
App 20070175104 - Nishiyama; Masaya ;   et al.
2007-08-02
Hazardous substance decomposer and process for producing the same
App 20060289826 - Koyama; Naoyuki ;   et al.
2006-12-28
Cmp polishing compound and polishing method
App 20060148667 - Fukasawa; Masato ;   et al.
2006-07-06
Polishing fluid and polishing method
App 20050050803 - Amanokura, Jin ;   et al.
2005-03-10
Dry toner, dry developer and process for forming electrophotographic images
Grant 4,985,328 - Kumagai , et al. January 15, 1
1991-01-15

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