loadpatents
name:-0.027935981750488
name:-0.023493051528931
name:-0.00045204162597656
Fujisawa; Tetsuya Patent Filings

Fujisawa; Tetsuya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fujisawa; Tetsuya.The latest application filed is for "semiconductor device".

Company Profile
0.20.17
  • Fujisawa; Tetsuya - Kawasaki JP
  • Fujisawa; Tetsuya - Hitachinaka N/A JP
  • Fujisawa; Tetsuya - Kawasaki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device having a high frequency external connection electrode positioned within a via hole
Grant 9,076,789 - Aiba , et al. July 7, 2
2015-07-07
Automatic analyzer and operating method for same
Grant 8,758,685 - Komatsu , et al. June 24, 2
2014-06-24
Semiconductor Device
App 20140117562 - Aiba; Yoshitaka ;   et al.
2014-05-01
Semiconductor Device
App 20130082402 - Aiba; Yoshitaka ;   et al.
2013-04-04
Semiconductor device having a high frequency electrode positioned with a via hole
Grant 8,344,490 - Aiba , et al. January 1, 2
2013-01-01
Semiconductor device and method for fabricating the same
Grant 7,692,294 - Katoh , et al. April 6, 2
2010-04-06
Automatic Analyzer And Operating Method For Same
App 20090068748 - KOMATSU; Hidenobu ;   et al.
2009-03-12
Semiconductor device
App 20080174001 - Aiba; Yoshitaka ;   et al.
2008-07-24
Semiconductor Device And Method For Fabricating The Same
App 20080067672 - KATOH; Yoshitsugu ;   et al.
2008-03-20
Method of designing circuit board
Grant 7,251,801 - Ozawa , et al. July 31, 2
2007-07-31
Semiconductor device and method of manufacturing the same
Grant 7,247,950 - Fujisawa , et al. July 24, 2
2007-07-24
Semiconductor device and manufacturing method of the same
App 20070138616 - Fujisawa; Tetsuya ;   et al.
2007-06-21
Semiconductor device
App 20060186524 - Aiba; Yoshitaka ;   et al.
2006-08-24
Electronic commerce method, recording medium storing electronic commerce program therein, and server
Grant 7,092,900 - Yamane , et al. August 15, 2
2006-08-15
Method of designing circuit board
App 20060040532 - Ozawa; Kaname ;   et al.
2006-02-23
Semiconductor device and method of manufacturing the same
App 20060012017 - Fujisawa; Tetsuya ;   et al.
2006-01-19
Semiconductor device configured to be surface mountable
Grant 6,836,025 - Fujisawa , et al. December 28, 2
2004-12-28
External connection terminal and semiconductor device
Grant 6,784,543 - Matsuki , et al. August 31, 2
2004-08-31
Contactor, method for manufacturing such contactor, and testing method using such contactor
Grant 6,767,219 - Maruyama , et al. July 27, 2
2004-07-27
Semiconductor module including a plurality of semiconductor devices detachably
Grant 6,696,754 - Sato , et al. February 24, 2
2004-02-24
Semiconductor device and manufacturing method thereof
App 20030227095 - Fujisawa, Tetsuya ;   et al.
2003-12-11
Contactor, method for manufacturing such contactor, and testing method using such contactor
App 20030186566 - Maruyama, Shigeyuki ;   et al.
2003-10-02
Semiconductor module including a plurality of semiconductor devices detachably
App 20030164544 - Sato, Mitsutaka ;   et al.
2003-09-04
External connection terminal and semiconductor device
App 20030151141 - Matsuki, Hirohisa ;   et al.
2003-08-14
Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless plating
Grant 6,566,239 - Makino , et al. May 20, 2
2003-05-20
Semiconductor device having columnar electrode and method of manufacturing same
Grant 6,476,503 - Imamura , et al. November 5, 2
2002-11-05
External connection terminal and semiconductor device
App 20020121709 - Matsuki, Hirohisa ;   et al.
2002-09-05
Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism
Grant 6,433,418 - Fujisawa , et al. August 13, 2
2002-08-13
Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless plating
App 20020076908 - Makino, Yutaka ;   et al.
2002-06-20
Electronic commerce method, recording medium storing electronic commerce program therein, and server
App 20020065733 - Yamane, Takashi ;   et al.
2002-05-30
Semiconductor Module Including A Plurality Of Semiconductor Devices Detachably
App 20020000645 - SATO, MITSUTAKA ;   et al.
2002-01-03
Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes
Grant 6,333,564 - Katoh , et al. December 25, 2
2001-12-25
Semiconductor device and semiconductor device mounting structure
Grant 6,084,309 - Kawashima , et al. July 4, 2
2000-07-04
Semiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frame
Grant 6,060,768 - Hayashida , et al. May 9, 2
2000-05-09
Semiconductor device and semiconductor device unit for a stack arrangement
Grant 5,801,439 - Fujisawa , et al. September 1, 1
1998-09-01
Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package
Grant 5,760,471 - Fujisawa , et al. June 2, 1
1998-06-02

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