Fujii; Akiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fujii; Akiko.The latest application filed is for "semiconductor die pick-up apparatus and method of picking up semiconductor die using the same".

Company Profile

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Fujii; Akiko - Tokyo JP
Fujii; Akiko - Kanagawa JP
Fujii, Akiko - Kanagwa JP
Fujii, Akiko - Tokyo-to JP
Fujii, Akiko - Kawasaki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor die pick-up apparatus and method of picking up semiconductor die using the same Grant 9,028,649 - Nakazawa , et al. May 12, 2	2015-05-12
Semiconductor Die Pick-up Apparatus And Method Of Picking Up Semiconductor Die Using The Same App 20130272837 - Nakazawa; Motoki ; et al.	2013-10-17
Sample milling/observing apparatus and method of observing sample Grant 8,309,920 - Fujii November 13, 2	2012-11-13
Copper interconnection and the method for fabricating the same Grant 7,315,084 - Fujii January 1, 2	2008-01-01
Sample milling/observing apparatus and method of observing sample App 20060226376 - Fujii; Akiko	2006-10-12
Copper interconnection and the method for fabricating the same App 20050250328 - Fujii, Akiko	2005-11-10
Copper interconnection Grant 6,670,639 - Okabayashi , et al. December 30, 2	2003-12-30
Method for manufacturing resist pattern App 20030194619 - Sasaki, Shiho ; et al.	2003-10-16
Manufacturing method of photomask App 20030143472 - Koizumi, Yasuhiro ; et al.	2003-07-31
Copper interconnection and the method for fabricating the same App 20030118798 - Fujii, Akiko	2003-06-26
Crystals of piperidine derivatives, intermediates for production of the same, and process for producing the same App 20010056102 - Fujii, Akiko ; et al.	2001-12-27

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