| Patent | Date |
|---|
Delivery device including reactive material for programmable discrete delivery of a substance
Grant 10,881,788 - Dang , et al. January 5, 2 | 2021-01-05 |
Thin film interconnects with large grains
Grant 10,727,121 - Bruce , et al. | 2020-07-28 |
Method of forming a homogeneous solid metallic anode for a thin film microbattery
Grant 10,622,590 - Andry , et al. | 2020-04-14 |
Method for manufacturing three-dimensional electronic circuit
Grant 10,396,469 - Fritz , et al. A | 2019-08-27 |
Activating reactions in integrated circuits through electrical discharge
Grant 10,388,615 - Cabral, Jr. , et al. A | 2019-08-20 |
Method and apparatus for a destroy on-demand electrical device
Grant 10,354,962 - Borenstein , et al. July 16, 2 | 2019-07-16 |
Reactively assisted ink for printed electronic circuits
Grant 10,308,828 - Fritz , et al. | 2019-06-04 |
Activating reactions in integrated circuits through electrical discharge
Grant 10,262,955 - Cabral, Jr. , et al. | 2019-04-16 |
Thin Film Interconnects With Large Grains
App 20190096757 - Bruce; Robert L. ; et al. | 2019-03-28 |
Reactively assisted ink for printed electronic circuits
Grant 10,240,058 - Fritz , et al. | 2019-03-26 |
Hybrid subtractive etch/metal fill process for fabricating interconnects
Grant 10,236,252 - Bruce , et al. | 2019-03-19 |
Energy release using tunable reactive materials
Grant 10,214,809 - Cabral, Jr. , et al. Feb | 2019-02-26 |
Energy Release Using Tunable Reactive Materials
App 20190023963 - Cabral, JR.; Cyril ; et al. | 2019-01-24 |
Homogeneous Solid Metallic Anode For Thin Film Microbattery
App 20190019997 - Andry; Paul S. ; et al. | 2019-01-17 |
Thin film interconnects with large grains
Grant 10,170,361 - Bruce , et al. J | 2019-01-01 |
Hybrid subtractive etch/metal fill process for fabricating interconnects
Grant 10,128,185 - Bruce , et al. November 13, 2 | 2018-11-13 |
Homogeneous solid metallic anode for thin film microbattery
Grant 10,096,802 - Andry , et al. October 9, 2 | 2018-10-09 |
Reactively Assisted Ink for Printed Electronic Circuits
App 20180251652 - Fritz; Gregory M. ; et al. | 2018-09-06 |
Reactively Assisted Ink for Printed Electronic Circuits
App 20180163071 - Fritz; Gregory M. ; et al. | 2018-06-14 |
Activating reactions in integrated circuits through electrical discharge
Grant 9,991,214 - Cabral, Jr. , et al. June 5, 2 | 2018-06-05 |
Energy release using tunable reactive materials
Grant 9,970,102 - Cabral, Jr. , et al. May 15, 2 | 2018-05-15 |
Activating Reactions In Integrated Circuits Through Electrical Discharge
App 20180061782 - Cabral, JR.; Cyril ; et al. | 2018-03-01 |
Low resistance metal contacts to interconnects
Grant 9,799,552 - Gates , et al. October 24, 2 | 2017-10-24 |
Low resistance metal contacts to interconnects
Grant 9,786,550 - Gates , et al. October 10, 2 | 2017-10-10 |
Controlling fragmentation of chemically strengthened glass
Grant 9,738,560 - Cabral, Jr. , et al. August 22, 2 | 2017-08-22 |
Energy Release Using Tunable Reactive Materials
App 20170226633 - Cabral, JR.; Cyril ; et al. | 2017-08-10 |
Hybrid Subtractive Etch/metal Fill Process For Fabricating Interconnects
App 20170179023 - Bruce; Robert L. ; et al. | 2017-06-22 |
Hybrid Subtractive Etch/metal Fill Process For Fabricating Interconnects
App 20170154815 - Bruce; Robert L. ; et al. | 2017-06-01 |
Hybrid subtractive etch/metal fill process for fabricating interconnects
Grant 9,653,395 - Bruce , et al. May 16, 2 | 2017-05-16 |
Hybrid subtractive etch/metal fill process for fabricating interconnects
Grant 9,646,881 - Bruce , et al. May 9, 2 | 2017-05-09 |
Delivery Device Including Reactive Material For Programmable Discrete Delivery Of A Substance
App 20170119960 - DANG; BING ; et al. | 2017-05-04 |
Method And Apparatus For A Destroy On-demand Electrical Device
App 20170117235 - Borenstein; Jeffrey ; et al. | 2017-04-27 |
Controlling fragmentation of chemically strengthened glass
Grant 9,586,857 - Cabral, Jr. , et al. March 7, 2 | 2017-03-07 |
Hybrid Subtractive Etch/metal Fill Process For Fabricating Interconnects
App 20170040213 - Bruce; Robert L. ; et al. | 2017-02-09 |
Hybrid Subtractive Etch/metal Fill Process For Fabricating Interconnects
App 20170040258 - Bruce; Robert L. ; et al. | 2017-02-09 |
Hybrid Subtractive Etch/metal Fill Process For Fabricating Interconnects
App 20170040257 - Bruce; Robert L. ; et al. | 2017-02-09 |
Low Resistance Metal Contacts To Interconnects
App 20160379880 - Gates; Stephen M. ; et al. | 2016-12-29 |
Low Resistance Metal Contacts To Interconnects
App 20160379869 - Gates; Stephen M. ; et al. | 2016-12-29 |
Activating Reactions In Integrated Circuits Through Electrical Discharge
App 20160300802 - Cabral, JR.; Cyril ; et al. | 2016-10-13 |
Controlling Fragmentation Of Chemically Strengthened Glass
App 20160264456 - Cabral, JR.; Cyril ; et al. | 2016-09-15 |
Activating reactions in integrated circuits through electrical discharge
Grant 9,431,354 - Cabral, Jr. , et al. August 30, 2 | 2016-08-30 |
Layered reactive particles with controlled geometries, energies, and reactivities, and methods for making the same
Grant 9,382,167 - Fritz , et al. July 5, 2 | 2016-07-05 |
Activating Reactions In Integrated Circuits Through Electrical Discharge
App 20160163658 - Cabral, JR.; Cyril ; et al. | 2016-06-09 |
Controlling Fragmentation Of Chemically Strengthened Glass
App 20160137548 - Cabral, JR.; Cyril ; et al. | 2016-05-19 |
Activating Reactions In Integrated Circuits Through Electrical Discharge
App 20160133581 - Cabral, Jr.; Cyril ; et al. | 2016-05-12 |
Thin Film Interconnects With Large Grains
App 20150348832 - Bruce; Robert L. ; et al. | 2015-12-03 |
Homogeneous Solid Metallic Anode For Thin Film Microbattery
App 20150288024 - Andry; Paul S. ; et al. | 2015-10-08 |
Reactive Bonding Of A Flip Chip Package
App 20150137366 - Fritz; Gregory M. ; et al. | 2015-05-21 |
Reactive bonding of a flip chip package
Grant 8,987,130 - Fritz , et al. March 24, 2 | 2015-03-24 |
Multi-doped silicon antifuse device for integrated circuit
Grant 8,860,176 - Fritz , et al. October 14, 2 | 2014-10-14 |
Integrated circuit tamper detection and response
Grant 8,861,728 - Chu , et al. October 14, 2 | 2014-10-14 |
Reactive material for integrated circuit tamper detection and response
Grant 8,816,717 - Fritz , et al. August 26, 2 | 2014-08-26 |
Annealing copper interconnects
Grant 8,772,161 - Cabral, Jr. , et al. July 8, 2 | 2014-07-08 |
Structure with sub-lithographic random conductors as a physical unclonable function
Grant 8,759,976 - Edelstein , et al. June 24, 2 | 2014-06-24 |
Layered Reactive Particles With Controlled Geometries, Energies, And Reactivities, And Methods For Making The Same
App 20140102605 - Fritz; Gregory M. ; et al. | 2014-04-17 |
Antifuse Device For Integrated Circuit
App 20140103485 - FRITZ; GREGORY M. ; et al. | 2014-04-17 |
Reactive Material For Integrated Circuit Tamper Detection And Response
App 20140103957 - Fritz; Gregory M. ; et al. | 2014-04-17 |
Integrated Circuit Tamper Detection And Response
App 20140103286 - Chu; Jack O. ; et al. | 2014-04-17 |
Structure With Sub-lithographic Random Conductors As A Physical Unclonable Function
App 20140042628 - Edelstein; Daniel C. ; et al. | 2014-02-13 |
Electronic Structure Containing A Via Array As A Physical Unclonable Function
App 20140042627 - Edelstein; Daniel C. ; et al. | 2014-02-13 |
Reactive Bonding Of A Flip Chip Package
App 20130320529 - Fritz; Gregory M. ; et al. | 2013-12-05 |
Layered reactive particles with controlled geometries, energies, and reactivities, and methods for making the same
Grant 8,431,197 - Fritz , et al. April 30, 2 | 2013-04-30 |
Layered Reactive Particles With Controlled Geometries, Energies, And Reactivities, And Methods For Making The Same
App 20130078466 - Fritz; Gregory M. ; et al. | 2013-03-28 |
Annealing Copper Interconnects
App 20130040454 - Cabral, JR.; Cyril ; et al. | 2013-02-14 |
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