Fountain, Jr.; Gaius Gillman
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fountain, Jr.; Gaius Gillman.The latest application filed is for "metal pads over tsv".
Company Profile
32.48.62
- Fountain, Jr.; Gaius Gillman - Youngsville NC
Patent Activity
| Patent | Date |
|---|---|
| Metal Pads Over Tsv App 20220302058 - Gao; Guilian ; et al. | 2022-09-22 |
| Direct Bonded Stack Structures For Increased Reliability And Improved Yield In Microelectronics App 20220293567 - Uzoh; Cyprian Emeka ; et al. | 2022-09-15 |
| Mitigating Surface Damage Of Probe Pads In Preparation For Direct Bonding Of A Substrate App 20220285236 - Gao; Guilian ; et al. | 2022-09-08 |
| Bond Enhancement Structure In Microelectronics For Trapping Contaminants During Direct-bonding Processes App 20220246564 - Gao; Guilian ; et al. | 2022-08-04 |
| Structures With Through-substrate Vias And Methods For Forming The Same App 20220246497 - Fountain, JR.; Gaius Gillman ; et al. | 2022-08-04 |
| Large metal pads over TSV Grant 11,393,779 - Gao , et al. July 19, 2 | 2022-07-19 |
| Structures With Through-substrate Vias And Methods For Forming The Same App 20220208650 - Gao; Guilian ; et al. | 2022-06-30 |
| Directly Bonded Structures App 20220208723 - Katkar; Rajesh ; et al. | 2022-06-30 |
| Mitigating surface damage of probe pads in preparation for direct bonding of a substrate Grant 11,355,404 - Gao , et al. June 7, 2 | 2022-06-07 |
| Direct Bonding Methods And Structures App 20220139869 - Gao; Guilian ; et al. | 2022-05-05 |
| Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes Grant 11,296,044 - Gao , et al. April 5, 2 | 2022-04-05 |
| Direct bonded stack structures for increased reliability and improved yield in microelectronics Grant 11,296,053 - Uzoh , et al. April 5, 2 | 2022-04-05 |
| 3D IC method and device Grant 11,289,372 - Enquist , et al. March 29, 2 | 2022-03-29 |
| Interconnect Structures App 20220013456 - Uzoh; Cyprian Emeka ; et al. | 2022-01-13 |
| Layer Structures For Making Direct Metal-to-metal Bonds At Low Temperatures In Microelectronics App 20220005784 - Gao; Guilian ; et al. | 2022-01-06 |
| Techniques For Processing Devices App 20210375850 - Uzoh; Cyprian Emeka ; et al. | 2021-12-02 |
| Interconnect structures Grant 11,158,573 - Uzoh , et al. October 26, 2 | 2021-10-26 |
| 3d Ic Method And Device App 20210313225 - Enquist; Paul M. ; et al. | 2021-10-07 |
| Dimension Compensation Control For Directly Bonded Structures App 20210296282 - Gao; Guilian ; et al. | 2021-09-23 |
| 3d Ic Method And Device App 20210280461 - Enquist; Paul M. ; et al. | 2021-09-09 |
| Structures For Bonding Elements App 20210265227 - Katkar; Rajesh ; et al. | 2021-08-26 |
| Selective Alteration Of Interconnect Pads For Direct Bonding App 20210242152 - FOUNTAIN, JR.; Gaius Gillman ; et al. | 2021-08-05 |
| Dbi To Si Bonding For Simplified Handle Wafer App 20210233889 - MANDALAPU; Chandrasekhar ; et al. | 2021-07-29 |
| Techniques for processing devices Grant 11,037,919 - Uzoh , et al. June 15, 2 | 2021-06-15 |
| Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics Grant 11,011,494 - Gao , et al. May 18, 2 | 2021-05-18 |
| 3D IC method and device Grant 11,011,418 - Enquist , et al. May 18, 2 | 2021-05-18 |
| Bonded structures Grant 11,004,757 - Katkar , et al. May 11, 2 | 2021-05-11 |
| Processed Stacked Dies App 20210104487 - UZOH; Cyprian EMEKA ; et al. | 2021-04-08 |
| DBI to Si bonding for simplified handle wafer Grant 10,964,664 - Mandalapu , et al. March 30, 2 | 2021-03-30 |
| Chemical Mechanical Polishing For Hybrid Bonding App 20210066233 - Fountain, JR.; Gaius Gillman ; et al. | 2021-03-04 |
| Systems and methods for efficient transfer of semiconductor elements Grant 10,896,902 - Uzoh , et al. January 19, 2 | 2021-01-19 |
| Direct Bonded Stack Structures For Increased Reliability And Improved Yield In Microelectronics App 20200411483 - Uzoh; Cyprian Emeka ; et al. | 2020-12-31 |
| Processed stacked dies Grant 10,879,212 - Uzoh , et al. December 29, 2 | 2020-12-29 |
| Techniques For Processing Devices App 20200365575 - UZOH; Cyprian Emeka ; et al. | 2020-11-19 |
| Chemical mechanical polishing for hybrid bonding Grant 10,840,205 - Fountain, Jr. , et al. November 17, 2 | 2020-11-17 |
| Probe methodology for ultrafine pitch interconnects Grant 10,748,824 - Delacruz , et al. A | 2020-08-18 |
| Techniques for processing devices Grant 10,727,219 - Uzoh , et al. | 2020-07-28 |
| Selective recess Grant 10,658,313 - Delacruz , et al. | 2020-05-19 |
| Interconnect Structures App 20200126906 - UZOH; Cyprian Emeka ; et al. | 2020-04-23 |
| Probe Methodology For Ultrafine Pitch Interconnects App 20200105630 - DELACRUZ; Javier A. ; et al. | 2020-04-02 |
| Increased contact alignment tolerance for direct bonding Grant 10,607,937 - Enquist , et al. | 2020-03-31 |
| Layer Structures For Making Direct Metal-to-metal Bonds At Low Temperatures In Microelectronics App 20200075534 - GAO; Guilian ; et al. | 2020-03-05 |
| Bond Enhancement In Microelectronics By Trapping Contaminants And Arresting Cracks During Direct-bonding Processes App 20200075533 - GAO; Guilian ; et al. | 2020-03-05 |
| Bond Enhancement In Microelectronics By Trapping Contaminants And Arresting Cracks During Direct-bonding Processes App 20200075520 - GAO; Guilian ; et al. | 2020-03-05 |
| Systems And Methods For Efficient Transfer Of Semiconductor Elements App 20200043910 - Uzoh; Cyprian Emeka ; et al. | 2020-02-06 |
| Post Cmp Processing For Hybrid Bonding App 20200035641 - FOUNTAIN, JR.; Gaius Gillman ; et al. | 2020-01-30 |
| Techniques For Joining Dissimilar Materials In Microelectronics App 20200013765 - FOUNTAIN, Jr.; Gaius Gillman ; et al. | 2020-01-09 |
| Probe methodology for ultrafine pitch interconnects Grant 10,529,634 - Delacruz , et al. J | 2020-01-07 |
| Tsv As Pad App 20190385935 - GAO; Guilian ; et al. | 2019-12-19 |
| Large Metal Pads Over Tsv App 20190385966 - GAO; Guilian ; et al. | 2019-12-19 |
| Structures For Bonding Elements App 20190348336 - Katkar; Rajesh ; et al. | 2019-11-14 |
| Dbi To Si Bonding For Simplified Handle Wafer App 20190326252 - MANDALAPU; Chandrasekhar ; et al. | 2019-10-24 |
| Systems and methods for efficient transfer of semiconductor elements Grant 10,446,532 - Uzoh , et al. Oc | 2019-10-15 |
| Techniques For Processing Devices App 20190252364 - UZOH; Cyprian Emeka ; et al. | 2019-08-15 |
| Increased Contact Alignment Tolerance For Direct Bonding App 20190244899 - Enquist; Paul M. ; et al. | 2019-08-08 |
| Three dimensional device integration method and integrated device Grant 10,366,962 - Enquist , et al. July 30, 2 | 2019-07-30 |
| Selective Recess App 20190181107 - DELACRUZ; Javier A. ; et al. | 2019-06-13 |
| Method for low temperature bonding and bonded structure Grant 10,312,217 - Tong , et al. | 2019-06-04 |
| 3d Ic Method And Device App 20190148222 - Enquist; Paul M. ; et al. | 2019-05-16 |
| Increased contact alignment tolerance for direct bonding Grant 10,269,708 - Enquist , et al. | 2019-04-23 |
| Chemical Mechanical Polishing For Hybrid Bonding App 20190096842 - FOUNTAIN, JR.; Gaius Gillman ; et al. | 2019-03-28 |
| 3D IC method and device Grant 10,147,641 - Enquist , et al. De | 2018-12-04 |
| Processed stacked dies App 20180331066 - UZOH; Cyprian Emeka ; et al. | 2018-11-15 |
| Probe methodology for ultrafine pitch Interconnects App 20180331000 - DELACRUZ; Javier A. ; et al. | 2018-11-15 |
| Increased Contact Alignment Tolerance For Direct Bonding App 20180204798 - Enquist; Paul M. ; et al. | 2018-07-19 |
| Increased contact alignment tolerance for direct bonding Grant 9,852,988 - Enquist , et al. December 26, 2 | 2017-12-26 |
| 3d Ic Method And Device App 20170316971 - Enquist; Paul M. ; et al. | 2017-11-02 |
| 3D IC method and device Grant 9,716,033 - Enquist , et al. July 25, 2 | 2017-07-25 |
| Systems And Methods For Efficient Transfer Of Semiconductor Elements App 20170200711 - Uzoh; Cyprian Emeka ; et al. | 2017-07-13 |
| Increased Contact Alignment Tolerance For Direct Bonding App 20170179029 - Enquist; Paul M. ; et al. | 2017-06-22 |
| Three Dimensional Device Integration Method And Integrated Device App 20170170132 - Enquist; Paul M. ; et al. | 2017-06-15 |
| Three dimensional device integration method and integrated device Grant 9,564,414 - Enquist , et al. February 7, 2 | 2017-02-07 |
| Method For Low Temperature Bonding And Bonded Structure App 20160322328 - Tong; Qin-Yi ; et al. | 2016-11-03 |
| Three dimensional device integration method and integrated device Grant 9,431,368 - Enquist , et al. August 30, 2 | 2016-08-30 |
| Method for low temperature bonding and bonded structure Grant 9,391,143 - Tong , et al. July 12, 2 | 2016-07-12 |
| Three Dimensional Device Integration Method And Integrated Device App 20160190093 - Enquist; Paul M. ; et al. | 2016-06-30 |
| Method for low temperature bonding and bonded structure Grant 9,331,149 - Tong , et al. May 3, 2 | 2016-05-03 |
| Method For Low Temperature Bonding And Bonded Structure App 20160086913 - Tong; Qin-Yi ; et al. | 2016-03-24 |
| 3d Ic Method And Device App 20150340285 - ENQUIST; Paul M. ; et al. | 2015-11-26 |
| 3D IC method and device Grant 9,171,756 - Enquist , et al. October 27, 2 | 2015-10-27 |
| Method For Low Temperature Bonding And Bonded Structure App 20150303263 - Tong; Qin-Yi ; et al. | 2015-10-22 |
| Three Dimensional Device Integration Method And Integrated Device App 20150287692 - ENQUIST; Paul M. ; et al. | 2015-10-08 |
| Method for low temperature bonding and bonded structure Grant 9,082,627 - Tong , et al. July 14, 2 | 2015-07-14 |
| Method For Low Temperature Bonding And Bonded Structure App 20140203407 - TONG; Qin-Yi ; et al. | 2014-07-24 |
| Method For Low Temperature Bonding And Bonded Structure App 20140206176 - TONG; Qin-Yi ; et al. | 2014-07-24 |
| 3d Ic Method And Device App 20140187040 - ENQUIST; Paul M. ; et al. | 2014-07-03 |
| 3D IC method and device Grant 8,709,938 - Enquist , et al. April 29, 2 | 2014-04-29 |
| Heterogeneous Annealing Method And Device App 20140061949 - Enquist; Paul M. ; et al. | 2014-03-06 |
| 3d Ic Method And Device App 20130178062 - Enquist; Paul M. ; et al. | 2013-07-11 |
| 3D IC method and device Grant 8,389,378 - Enquist , et al. March 5, 2 | 2013-03-05 |
| Method For Low Temperature Bonding And Bonded Structure App 20120097638 - TONG; Qin-Yi ; et al. | 2012-04-26 |
| Method for low temperature bonding and bonded structure Grant 8,153,505 - Tong , et al. April 10, 2 | 2012-04-10 |
| Method for low temperature bonding and bonded structure Grant 8,053,329 - Tong , et al. November 8, 2 | 2011-11-08 |
| Method For Low Temperature Bonding And And Bonded Structure App 20110067803 - Tong; Qin-Yi ; et al. | 2011-03-24 |
| Method for low temperature bonding and bonded structure Grant 7,871,898 - Tong , et al. January 18, 2 | 2011-01-18 |
| Method for low temperature bonding and bonded structure Grant 7,807,549 - Tong , et al. October 5, 2 | 2010-10-05 |
| Method For Low Temperature Bonding And Bonded Structure App 20100163169 - TONG; Qin-Yi ; et al. | 2010-07-01 |
| Wafer bonding hermetic encapsulation Grant 7,622,324 - Enquist , et al. November 24, 2 | 2009-11-24 |
| Method For Low Temperature Bonding And Bonded Structure App 20090263953 - Tong; Qin-Yi ; et al. | 2009-10-22 |
| Method for low temperature bonding and bonded structure Grant 7,553,744 - Tong , et al. June 30, 2 | 2009-06-30 |
| 3d Ic Method And Device App 20090068831 - Enquist; Paul M. ; et al. | 2009-03-12 |
| 3D IC method and device Grant 7,485,968 - Enquist , et al. February 3, 2 | 2009-02-03 |
| Method of detachable direct bonding at low temperatures Grant 7,462,552 - Tong , et al. December 9, 2 | 2008-12-09 |
| Method for low temperature bonding and bonded structure Grant 7,387,944 - Tong , et al. June 17, 2 | 2008-06-17 |
| Method for low temperature bonding and bonded structure Grant 7,335,572 - Tong , et al. February 26, 2 | 2008-02-26 |
| Method for low temperature bonding and bonded structure Grant 7,041,178 - Tong , et al. May 9, 2 | 2006-05-09 |
| Method for low temperature bonding and bonded structure Grant 6,902,987 - Tong , et al. June 7, 2 | 2005-06-07 |
| Wafer bonding hermetic encapsulation Grant 6,822,326 - Enquist , et al. November 23, 2 | 2004-11-23 |
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