Fluegel; James E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fluegel; James E..The latest application filed is for "ic waper carrier sealed from ambient atmosphere during transportation from one process to the next".

Company Profile

0.8.8

Fluegel; James E. - Rhinbeck NY
Fluegel; James E. - Rhinebeck NY
Fluegel; James E. - Tivoli NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reducing introduction of foreign material to wafers Grant 7,901,490 - Clark , et al. March 8, 2	2011-03-08
Void-free damascene copper deposition process and means of monitoring thereof Grant 7,678,258 - Andricacos , et al. March 16, 2	2010-03-16
Ic Waper Carrier Sealed From Ambient Atmosphere During Transportation From One Process To The Next App 20100051501 - Corbin, JR.; William E. ; et al.	2010-03-04
Reducing Introduction Of Foreign Material To Wafers App 20090180848 - Clark; David J. ; et al.	2009-07-16
Manufacturable CoWP metal cap process for copper interconnects Grant 7,407,605 - Restaino , et al. August 5, 2	2008-08-05
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS App 20070215842 - Restaino; Darryl D. ; et al.	2007-09-20
Manufacturable CoWP metal cap process for copper interconnects Grant 7,253,106 - Restaino , et al. August 7, 2	2007-08-07
Electroplated copper interconnection structure, process for making and electroplating bath Grant 7,227,265 - Andricacos , et al. June 5, 2	2007-06-05
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS App 20060134911 - Restaino; Darryl D. ; et al.	2006-06-22
Void-free damascene copper deposition process and means of monitoring thereof App 20050006242 - Andricacos, Panayotis ; et al.	2005-01-13
Electroplated copper interconnection structure, process for making and electroplating bath App 20040178078 - Andricacos, Panayotis C. ; et al.	2004-09-16
Electroplated copper interconnection structure, process for making and electroplating bath App 20040178077 - Andricacos, Panayotis C. ; et al.	2004-09-16
Method of forming planar Cu interconnects without chemical mechanical polishing App 20040094511 - Seo, Soon-Cheon ; et al.	2004-05-20
Method of controlling chemical bath composition in a manufacturing environment Grant 6,471,845 - Dukovic , et al. October 29, 2	2002-10-29
Copper seed layer repair technique using electroless touch-up Grant 6,395,164 - Andricacos , et al. May 28, 2	2002-05-28
Method and apparatus for making electrical contact to a substrate during electroplating Grant 6,077,405 - Biggs , et al. June 20, 2	2000-06-20

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