Fitzsimmons John A

USPTO Trademark & Patent Filings

Fitzsimmons John A

Trademark applications and grants for Fitzsimmons John A. Fitzsimmons John A has 2 trademark applications. The latest application filed is for "JAMES E. FITZSIMMONS"

Company Profile
    Company Aliases
  • FITZSIMMONS, JOHN A.
  • a john fitzsimmons
  • Fitzsimmons; John A - Poughkeepsie NY
  • Fitzsimmons; John A. - Poughkeepsie NY
  • Fitzsimmons; John A. - Hopewell Junction NY

Trademarks Patents
Patent Applications
Patent ApplicationDate
SOI WAFERS WITH BURIED DIELECTRIC LAYERS TO PREVENT CU DIFFUSION
20190172789 - 16/266196 Stamper; Anthony K ;   et al.
2019-06-06
INTEGRATED CIRCUIT STRUCTURE HAVING DEEP TRENCH CAPACITOR AND THROUGH-SILICON VIA AND METHOD OF FORMING SAME
20180108566 - 15/837279 Farooq; Mukta G. ;   et al.
2018-04-19
SOI WAFERS WITH BURIED DIELECTRIC LAYERS TO PREVENT CU DIFFUSION
20180012845 - 15/713756 Stamper; Anthony K. ;   et al.
2018-01-11
DEVICE LAYER TRANSFER WITH A PRESERVED HANDLE WAFER SECTION
20180005873 - 15/692666 Stamper; Anthony K. ;   et al.
2018-01-04
INTEGRATED CIRCUIT STRUCTURE HAVING DEEP TRENCH CAPACITOR AND THROUGH-SILICON VIA AND METHOD OF FORMING SAME
20170352618 - 15/171320 Fitzsimmons; John A. ;   et al.
2017-12-07
SOI wafers with buried dielectric layers to prevent CU diffusion
10,923,427 - 16/266,196 Stamper , et al. February 16, 2
2021-02-16
SOI wafers with buried dielectric layers to prevent CU diffusion
10,242,947 - 15/713,756 Stamper , et al.
2019-03-26
Self aligned contact structure
10,074,562 - 15/219,413 Orozco-Teran , et al. September 11, 2
2018-09-11
Device layer transfer with a preserved handle wafer section
10,037,911 - 15/692,666 Stamper , et al. July 31, 2
2018-07-31
Integrated circuit structure having deep trench capacitor and through-silicon via and method of forming same
9,966,310 - 15/837,279 Farooq , et al. May 8, 2
2018-05-08
Patent Grants & Applications
Trademark Applications
Company Registrations
SEC0001219439FITZSIMMONS JOHN A

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