Escher-Poeppel; Irmgard

Patent Applications and Registrations

Patent applications and USPTO patent grants for Escher-Poeppel; Irmgard.The latest application filed is for "predictive chip-maintenance".

Company Profile

11.45.47

Escher-Poeppel; Irmgard - Duggendorf DE
Escher-Poeppel; Irmgard - Regensburg DE
Escher-Poeppel; Irmgard - Deggendorf DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for fabricating a semiconductor flip-chip package Grant 11,393,742 - Meyer , et al. July 19, 2	2022-07-19
Predictive Chip-maintenance App 20210325445 - Escher-Poeppel; Irmgard ; et al.	2021-10-21
Additive Manufacturing of a Frontside or Backside Interconnect of a Semiconductor Die App 20210225798 - Fuergut; Edward ; et al.	2021-07-22
Method for fabricating a semiconductor and semiconductor package Grant 10,957,671 - Beer , et al. March 23, 2	2021-03-23
Semiconductor package system Grant 10,886,186 - Scharf , et al. January 5, 2	2021-01-05
Method for Fabricating a Semiconductor Flip-Chip Package App 20200388561 - Meyer; Thorsten ; et al.	2020-12-10
Semiconductor Package and Method of Forming a Semiconductor Package App 20200365548 - Fuergut; Edward ; et al.	2020-11-19
Method For Fabricating A Semiconductor And Semiconductor Package App 20200303340 - BEER; Gottfried ; et al.	2020-09-24
Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement Grant 10,734,352 - Escher-Poeppel , et al.	2020-08-04
Semiconductor Devices Including Adhesion Promoting Structures And Methods For Manufacturing Thereof App 20200227312 - Escher-Poeppel; Irmgard ; et al.	2020-07-16
Method for fabricating a semiconductor and semiconductor package Grant 10,643,971 - Beer , et al.	2020-05-05
Method of reducing a sheet resistance in an electronic device, and an electronic device Grant 10,573,533 - Fuergut , et al. Feb	2020-02-25
Method For Fabricating A Semiconductor And Semiconductor Package App 20200013751 - BEER; Gottfried ; et al.	2020-01-09
Heat Dissipation Device, Semiconductor Packaging System and Method of Manufacturing Thereof App 20200006187 - Otremba; Ralf ; et al.	2020-01-02
Method for fabricating a semiconductor and semiconductor package Grant 10,438,926 - Beer , et al. O	2019-10-08
Semiconductor Package System App 20190304858 - Scharf; Thorsten ; et al.	2019-10-03
Metallic Interconnect, a Method of Manufacturing a Metallic Interconnect, a Semiconductor Arrangement and a Method of Manufacturing a Semiconductor Arrangement App 20190103378 - Escher-Poeppel; Irmgard ; et al.	2019-04-04
Method Of Reducing A Sheet Resistance In An Electronic Device, And An Electronic Device App 20190013210 - Fuergut; Edward ; et al.	2019-01-10
Method for producing a power semiconductor module Grant 10,096,584 - Hohlfeld , et al. October 9, 2	2018-10-09
Method for producing a chip assemblage Grant 10,014,275 - Heinrich , et al. July 3, 2	2018-07-03
Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement Grant 9,818,730 - Beer , et al. November 14, 2	2017-11-14
Method For Producing A Chip Assemblage App 20170271298 - Heinrich; Alexander ; et al.	2017-09-21
Electronic device package including metal blocks Grant 9,768,037 - Palm , et al. September 19, 2	2017-09-19
Method for Producing a Power Semiconductor Module App 20170125395 - Hohlfeld; Olaf ; et al.	2017-05-04
Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement Grant 9,620,459 - Beer , et al. April 11, 2	2017-04-11
System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille Grant 9,584,889 - Escher-Poeppel , et al. February 28, 2	2017-02-28
Method for making a sensor device using a graphene layer Grant 9,536,953 - Elian , et al. January 3, 2	2017-01-03
Method of reducing a sheet resistance in an electronic device, and an electronic device App 20160336226 - FUERGUT; Edward ; et al.	2016-11-17
Electronic device and method for fabricating an electronic device Grant 9,355,984 - Escher-Poeppel , et al. May 31, 2	2016-05-31
Method of fabricating a semiconductor device with encapsulant Grant 9,287,206 - Beer , et al. March 15, 2	2016-03-15
Removable indicator structure in electronic chips of a common substrate for process adjustment Grant 9,275,916 - Fuergut , et al. March 1, 2	2016-03-01
Methods for manufacturing a chip package Grant 9,230,894 - Fuergut , et al. January 5, 2	2016-01-05
Electronic Device Package Including Metal Blocks App 20150332938 - Palm; Petteri ; et al.	2015-11-19
Method for Making a Sensor Device Using a Graphene Layer App 20150287788 - Elian; Klaus ; et al.	2015-10-08
Method for manufacturing an electronic module and an electronic module Grant 9,129,959 - Fuergut , et al. September 8, 2	2015-09-08
Method for making a sensor device using a graphene layer Grant 9,070,615 - Elian , et al. June 30, 2	2015-06-30
Semiconductor Arrangement, Method for Producing a Semiconductor Module, Method for Producing a Semiconductor Arrangement and Method for Operating a Semiconductor Arrangement App 20150061144 - Beer; Gottfried ; et al.	2015-03-05
Packaged MEMS Device App 20150061048 - Escher-Poeppel; Irmgard ; et al.	2015-03-05
Semiconductor Arrangement, Method for Producing a Number of Chip Assemblies, Method for Producing a Semiconductor Arrangement and Method for Operating a Semiconductor Arrangement App 20150061100 - Beer; Gottfried ; et al.	2015-03-05
Electronic Device And Method For Fabricating An Electronic Device App 20150021792 - Escher-Poeppel; Irmgard ; et al.	2015-01-22
Removable indicator structure in electronic chips of a common substrate for process adjustment App 20140327003 - FUERGUT; Edward ; et al.	2014-11-06
Method for Making a Sensor Device Using a Graphene Layer App 20140264255 - Elian; Klaus ; et al.	2014-09-18
Stackable semiconductor package with encapsulant and electrically conductive feed-through Grant 8,829,663 - Pohl , et al. September 9, 2	2014-09-09
Method for making a sensor device using a graphene layer Grant 8,759,153 - Elian , et al. June 24, 2	2014-06-24
Method for fabricating a semiconductor device and semiconductor package Grant 8,728,869 - Beer , et al. May 20, 2	2014-05-20
Method For Fabricating A Semiconductor And Semiconductor Package App 20140127859 - Beer; Gottfried ; et al.	2014-05-08
Method for Manufacturing an Electronic Module and an Electronic Module App 20140054780 - Fuergut; Edward ; et al.	2014-02-27
Method for fabricating a semiconductor and semiconductor package Grant 8,658,468 - Beer , et al. February 25, 2	2014-02-25
Methods For Manufacturing A Chip Package App 20130295720 - Fuergut; Edward ; et al.	2013-11-07
Method For Fabricating A Semiconductor Device And Semiconductor Package App 20130267063 - Beer; Gottfried ; et al.	2013-10-10
Method for fabricating a semiconductor and semiconductor package Grant 8,492,200 - Beer , et al. July 23, 2	2013-07-23
Semiconductor device Grant 8,394,673 - Poeppel , et al. March 12, 2	2013-03-12
Sensor Device and Method App 20130056703 - Elian; Klaus ; et al.	2013-03-07
Method For Fabricating A Semiconductor And Semiconductor Package App 20120319298 - Beer; Gottfried ; et al.	2012-12-20
Method For Fabricating A Semiconductor And Semiconductor Package App 20120258571 - Beer; Gottfried ; et al.	2012-10-11
Method for fabricating a semiconductor and semiconductor package Grant 8,258,624 - Beer , et al. September 4, 2	2012-09-04
Semiconductor Device App 20120214277 - Josef Poeppel; Gerhard ; et al.	2012-08-23
Method for fabricating a semiconductor and semiconductor package Grant 8,216,881 - Beer , et al. July 10, 2	2012-07-10
Semiconductor device Grant 8,169,070 - Poeppel , et al. May 1, 2	2012-05-01
Method of fabricating a semiconductor device Grant 8,119,452 - Beer , et al. February 21, 2	2012-02-21
Semiconductor device Grant 8,071,428 - Pohl , et al. December 6, 2	2011-12-06
Method Of Fabricating A Semiconductor Device And Semiconductor Device App 20110281405 - Beer; Gottfried ; et al.	2011-11-17
Semiconductor device Grant 8,035,224 - Poeppel , et al. October 11, 2	2011-10-11
Encapsulation method Grant 7,915,089 - Fuergut , et al. March 29, 2	2011-03-29
Method For Fabricating A Semiconductor And Semiconductor Package App 20110057304 - Beer; Gottfried ; et al.	2011-03-10
External contact material for external contacts of a semiconductor device and method of making the same Grant 7,893,532 - Bauer , et al. February 22, 2	2011-02-22
Semiconductor Device App 20100289095 - Poeppel; Gerhard Josef ; et al.	2010-11-18
Method Of Fabricating A Semiconductor Device App 20100178736 - Beer; Gottfried ; et al.	2010-07-15
Semiconductor Device App 20100123217 - Poeppel; Gerhard Josef ; et al.	2010-05-20
Electronic structure with components connected by way of solderable connecting elements and method Grant 7,666,777 - Bauer , et al. February 23, 2	2010-02-23
Method Of Fabricating A Semiconductor Device And Semiconductor Device App 20100025848 - Beer; Gottfried ; et al.	2010-02-04
Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film Grant 7,585,701 - Beer , et al. September 8, 2	2009-09-08
Semiconductor Device App 20090155956 - Pohl; Jens ; et al.	2009-06-18
Method For Fabricating A Semiconductor And Semiconductor Package App 20090039496 - Beer; Gottfried ; et al.	2009-02-12
Semiconductor Device App 20090008793 - Pohl; Jens ; et al.	2009-01-08
Encapsulation Method And Apparatus App 20080254575 - Fuergut; Edward ; et al.	2008-10-16
Semiconductor device with a recessed bond pad Grant 7,408,241 - Bauer , et al. August 5, 2	2008-08-05
Electronic structure with components connected by way of solderable connecting elements and method App 20070117424 - Bauer; Michael ; et al.	2007-05-24
External contact material for external contacts of a semiconductor device and method of making the same App 20070057372 - Bauer; Michael ; et al.	2007-03-15
Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film App 20060273469 - Beer; Gottfried ; et al.	2006-12-07
Semiconductor device with surface-mountable outer contacts, and process for producing it App 20060192298 - Bauer; Michael ; et al.	2006-08-31

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