EOM; Yong Sung

Patent Applications and Registrations

Patent applications and USPTO patent grants for EOM; Yong Sung.The latest application filed is for "method of fabricating semiconductor package".

Company Profile

7.27.49

EOM; Yong Sung - Daejeon KR
Eom; Yong-Sung - Daejeon-city KR
Eom; Yong Sung - Daejon-Shi KR
Eom, Yong Sung - Daejeon-Shi KR
Eom; Yong-sung - Daejon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Fabricating Semiconductor Package App 20220102603 - CHOI; Kwang-Seong ; et al.	2022-03-31
Composition For Conductive Adhesive, Semiconductor Package Comprising Cured Product Thereof, And Method Of Manufacturing Semiconductor Package Using The Same App 20220077099 - CHOI; Gwang-Mun ; et al.	2022-03-10
Wire For Electric Bonding App 20210402525 - CHOI; GWANG-MUN ; et al.	2021-12-30
Laser Bonding Method And A Semiconductor Package Including A Bonding Part And A Bonding Target App 20210358885 - CHOI; Kwang-Seong ; et al.	2021-11-18
Method For Transferring And Bonding Of Devices App 20210320236 - JOO; Jiho ; et al.	2021-10-14
Laser bonding method Grant 11,107,790 - Choi , et al. August 31, 2	2021-08-31
Transfer And Bonding Method Using Laser App 20210252620 - CHOI; KWANG-SEONG ; et al.	2021-08-19
Method For Manufacturing Semiconductor Package App 20200266078 - EOM; Yong Sung ; et al.	2020-08-20
Method of fabricating a semiconductor package Grant 10,636,761 - Choi , et al.	2020-04-28
Laser Bonding Method App 20200075535 - CHOI; Kwang-Seong ; et al.	2020-03-05
Filling Composition For Semiconductor Package App 20190287870 - JANG; KeonSoo ; et al.	2019-09-19
Adhesive Film For Electric Device And Method Of Fabricating Semiconductor Package Using The Same App 20190211231 - JANG; KeonSoo ; et al.	2019-07-11
Method Of Fabricating A Semiconductor Package App 20190067235 - CHOI; Kwang-Seong ; et al.	2019-02-28
Pattern-forming method for forming a conductive circuit pattern Grant 9,980,393 - Eom , et al. May 22, 2	2018-05-22
Method of fabricating a semiconductor package Grant 9,853,010 - Choi , et al. December 26, 2	2017-12-26
Method Of Fabricating A Semiconductor Package App 20170141071 - CHOI; Kwang-Seong ; et al.	2017-05-18
Bonding structure of electronic equipment Grant 9,538,666 - Choi , et al. January 3, 2	2017-01-03
Semiconductor Package And Method For Manufacturing The Same App 20160358892 - LEE; Haksun ; et al.	2016-12-08
Transmitting and receiving package Grant 9,490,198 - Eom November 8, 2	2016-11-08
Composition and methods of forming solder bump and flip chip using the same Grant 9,462,736 - Eom , et al. October 4, 2	2016-10-04
Transceiver Module And Communication Apparatus Including The Same App 20160094258 - BAE; Hyun-cheol ; et al.	2016-03-31
Stack Module Package And Method For Manufacturing The Same App 20150364445 - CHOI; Kwang Seong ; et al.	2015-12-17
Composition and methods of forming solder bump and flip chip using the same Grant 9,155,236 - Eom , et al. October 6, 2	2015-10-06
Pattern-forming Composition And Pattern-forming Method Using The Same App 20150237739 - EOM; Yong Sung ; et al.	2015-08-20
Semiconductor Device And Method Of Manufacturing The Same App 20150228617 - LEE; Haksun ; et al.	2015-08-13
Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same Grant 9,034,750 - Choi , et al. May 19, 2	2015-05-19
Methods of forming bump and semiconductor device with the same Grant 9,006,037 - Choi , et al. April 14, 2	2015-04-14
Bonding Structure Of Electronic Equipment App 20150043175 - CHOI; KWANG-SEONG ; et al.	2015-02-12
Method Of Fabricating A Solder Particle App 20140367375 - BAE; Hyun-cheol ; et al.	2014-12-18
Composition And Methods Of Forming Solder Bump And Flip Chip Using The Same App 20140317918 - EOM; Yong Sung ; et al.	2014-10-30
Composition And Methods Of Forming Solder Bump And Flip Chip Using The Same App 20140317915 - EOM; Yong Sung ; et al.	2014-10-30
Conductive Composition, Silicon Solar Cell Including The Same, And Manufacturing Method Thereof App 20140318615 - OH; Soo Young ; et al.	2014-10-30
Methods Of Forming Bump And Semiconductor Device With The Same App 20140287556 - CHOI; Kwang-Seong ; et al.	2014-09-25
Composition and methods of forming solder bump and flip chip using the same Grant 8,802,760 - Eom , et al. August 12, 2	2014-08-12
Method of forming solder on pad on fine pitch PCB and method of flip chip bonding semiconductor using the same Grant 8,794,502 - Eom , et al. August 5, 2	2014-08-05
Method Of Fabricating A Solder-on-pad Structure And Flip-chip Bonding Method Using The Same App 20140117070 - Choi; Kwang-Seong ; et al.	2014-05-01
Sensing Device Having Multi Beam Antenna Array App 20140062786 - JUN; Dong Suk ; et al.	2014-03-06
Method Of Forming Solder On Pad On Fine Pitch Pcb And Method Of Flip Chip Bonding Semiconductor Using The Same App 20130334291 - EOM; Yong Sung ; et al.	2013-12-19
Sensing device having multi beam antenna array Grant 8,547,278 - Jun , et al. October 1, 2	2013-10-01
Vacuum wafer level packaging method for micro electro mechanical system device Grant 8,524,571 - Moon , et al. September 3, 2	2013-09-03
Composition And Methods Of Forming Solder Bump And Flip Chip Using The Same App 20130200135 - EOM; Yong Sung ; et al.	2013-08-08
Pattern-forming Composition And Pattern-forming Method Using The Same App 20130146342 - EOM; Yong Sung ; et al.	2013-06-13
Composition and methods of forming solder bump and flip chip using the same Grant 8,420,722 - Eom , et al. April 16, 2	2013-04-16
Method For Manufacturing Dye Sensitized Solar Cell Module App 20120288983 - Chu; Moo Jung ; et al.	2012-11-15
Method Of Manufacturing Solder Powder Having Diameter Of Sub-micrometers Or Several Micrometers App 20120240727 - EOM; Yong Sung ; et al.	2012-09-27
Conductive Composition, Silicon Solar Cell Including The Same, And Manufacturing Method Thereof App 20120222738 - OH; Soo Young ; et al.	2012-09-06
Method and structure for bonding flip chip Grant 8,211,745 - Eom , et al. July 3, 2	2012-07-03
Vacuum Wafer Level Packaging Method For Micro Electro Mechanical System Device App 20120164787 - Moon; Jong Tae ; et al.	2012-06-28
Composition For Filling Through Silicon Via (tsv), Tsv Filling Method And Substrate Including Tsv Plug Formed Of The Composition App 20120161326 - Choi; Kwang-Seong ; et al.	2012-06-28
Electronic device including LTCC inductor Grant 8,044,757 - Bae , et al. October 25, 2	2011-10-25
Method for fabricating a semiconductor package Grant 8,030,200 - Eom , et al. October 4, 2	2011-10-04
Filling Composition, Semiconductor Device Including The Same, And Method Of Fabricating The Semiconductor Device App 20110227228 - EOM; Yong Sung ; et al.	2011-09-22
Wafer level package and method of fabricating the same Grant 7,985,697 - Moon , et al. July 26, 2	2011-07-26
Method And Structure For Bonding Flip Chip App 20110089577 - Eom; Yong Sung ; et al.	2011-04-21
Sensing Device Having Multi Beam Antenna Array App 20110050499 - JUN; Dong Suk ; et al.	2011-03-03
Electronic Device Including Ltcc Inductor App 20110018670 - BAE; Hyun-Cheol ; et al.	2011-01-27
Method For Fabricating Semiconductor Package And Semiconductor Package Using The Same App 20100320596 - Eom; Yong Sung ; et al.	2010-12-23
Composition And Methods Of Forming Solder Bump And Flip Chip Using The Same App 20100006625 - EOM; Yong Sung ; et al.	2010-01-14
Wafer Level Package And Method Of Fabricating The Same App 20090261481 - MOON; Jong Tae ; et al.	2009-10-22
Transceiver module and optical bench for passive alignment Grant 7,520,682 - Eom , et al. April 21, 2	2009-04-21
Surface emitting laser device including optical sensor and optical waveguide device employing the same Grant 7,244,923 - Song , et al. July 17, 2	2007-07-17
Surface emitting laser device including optical sensor and optical waveguide device employing the same App 20060124829 - Song; Hyun Woo ; et al.	2006-06-15
Transceiver module and optical bench for passive alignment App 20060056775 - Eom; Yong-Sung ; et al.	2006-03-16
Wavelength stabilization module having light-receiving element array and method of manufacturing the same Grant 7,012,939 - Choi , et al. March 14, 2	2006-03-14
Structure for manufacturing optical module App 20050123249 - Yun, Ho Gyeong ; et al.	2005-06-09
Optical transceiver for reducing crosstalk App 20050053380 - Kim, Sung Il ; et al.	2005-03-10
Method for optical module packaging of flip chip bonding Grant 6,825,065 - Moon , et al. November 30, 2	2004-11-30
Wavelength stabilization module having light-receiving element array and method of manufacturing the same App 20040101319 - Choi, Kwang Seong ; et al.	2004-05-27
Silicon optical bench for packaging optical switch device, optical switch package using the silicon optical bench, and method for fabricating the silicon optical bench App 20040076367 - Eom, Yong-sung ; et al.	2004-04-22
Optical module package of flip chip bonding Grant 6,707,161 - Moon , et al. March 16, 2	2004-03-16
Method for optical module packaging of flip chip bonding App 20040023437 - Moon, Jong-Tae ; et al.	2004-02-05
Flip-chip-bonded optical module package and method of packaging optical module using flip chip bonding App 20030098511 - Moon, Jong-Tae ; et al.	2003-05-29

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