| Patent | Date |
|---|
Method For Producing Substrate Having Through-silicon Vias, Substrate Having Through-silicon Vias, And Copper Paste For Through-silicon Via Formation
App 20220230918 - EJIRI; Yoshinori ; et al. | 2022-07-21 |
Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
Grant 11,370,066 - Kawana , et al. June 28, 2 | 2022-06-28 |
Electronic Component And Method For Manufacturing Electronic Component
App 20220053647 - EJIRI; Yoshinori ; et al. | 2022-02-17 |
Method For Producing Bonded Object And Semiconductor Device And Copper Bonding Paste
App 20220028824 - KAWANA; Yuki ; et al. | 2022-01-27 |
Member Connection Method
App 20210351157 - NEGISHI; Motohiro ; et al. | 2021-11-11 |
Solder Particles And Method For Producing Solder Particles
App 20210229222 - AKAI; Kunihiko ; et al. | 2021-07-29 |
Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
Grant 11,040,416 - Ishikawa , et al. June 22, 2 | 2021-06-22 |
Copper Paste For Pressureless Bonding, Bonded Body And Semiconductor Device
App 20210143121 - NAKAKO; Hideo ; et al. | 2021-05-13 |
Anisotropic Conductive Film, Method For Producing Same, And Method For Producing Connection Structure
App 20210114147 - AKAI; Kunihiko ; et al. | 2021-04-22 |
Solder Particles
App 20210114145 - AKAI; Kunihiko ; et al. | 2021-04-22 |
Copper paste for pressureless bonding, bonded body and semiconductor device
Grant 10,930,612 - Nakako , et al. February 23, 2 | 2021-02-23 |
Composition, Conductor, Method For Manufacturing Same, And Structure
App 20200399493 - URASHIMA; Kohsuke ; et al. | 2020-12-24 |
Organic Interposer And Method For Manufacturing Organic Interposer
App 20200365501 - MITSUKURA; Kazuyuki ; et al. | 2020-11-19 |
Method For Producing Joined Body, And Joining Material
App 20200344893 - NAKAKO; Hideo ; et al. | 2020-10-29 |
Method For Manufacturing Thermoelectric Conversion Module, Thermoelectric Conversion Module, And Binder For Thermoelectric Conversion Module
App 20200295248 - NEGISHI; Motohiro ; et al. | 2020-09-17 |
Organic interposer and method for manufacturing organic interposer
Grant 10,756,008 - Mitsukura , et al. A | 2020-08-25 |
Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
Grant 10,748,865 - Kawana , et al. A | 2020-08-18 |
Copper Paste For Joining, Method For Manufacturing Joined Body, And Method For Manufacturing Semiconductor Device
App 20200176411 - KAWANA; Yuki ; et al. | 2020-06-04 |
Metal Paste For Joints, Assembly, Production Method For Assembly, Semiconductor Device, And Production Method For Semiconductor
App 20200130109 - KAWANA; Yuki ; et al. | 2020-04-30 |
Copper Paste For Joining, Method For Manufacturing Joined Body, And Method For Manufacturing Semiconductor Device
App 20200108471 - ISHIKAWA; Dai ; et al. | 2020-04-09 |
Metal Paste For Joints, Assembly, Production Method For Assembly, Semiconductor Device, And Production Method For Semiconductor
App 20200075528 - KAWANA; Yuki ; et al. | 2020-03-05 |
Assembly and semiconductor device
Grant 10,566,304 - Nakako , et al. Feb | 2020-02-18 |
Copper Paste For Pressureless Bonding, Bonded Body And Semiconductor Device
App 20190355690 - NAKAKO; Hideo ; et al. | 2019-11-21 |
Copper paste for joining, method for producing joined body, and method for producing semiconductor device
Grant 10,363,608 - Kawana , et al. | 2019-07-30 |
Organic Interposer And Method For Manufacturing Organic Interposer
App 20190109082 - MITSUKURA; Kazuyuki ; et al. | 2019-04-11 |
Assembly And Semiconductor Device
App 20180342478 - NAKAKO; Hideo ; et al. | 2018-11-29 |
Copper Paste For Joining, Method For Producing Joined Body, And Method For Producing Semiconductor Device
App 20180250751 - KAWANA; Yuki ; et al. | 2018-09-06 |
Biomolecule Capturing Filter
App 20180021708 - Takai; Kenji ; et al. | 2018-01-25 |
Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition
Grant 9,457,406 - Nakako , et al. October 4, 2 | 2016-10-04 |
Substrate for mounting semiconductor chip and method for producing same
Grant 8,997,341 - Ejiri , et al. April 7, 2 | 2015-04-07 |
Biomolecule Capturing Filter
App 20140299539 - TAKAI; Kenji ; et al. | 2014-10-09 |
Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution
Grant 8,801,971 - Nakako , et al. August 12, 2 | 2014-08-12 |
Method For Forming A Copper Wiring Pattern
App 20130295276 - NAKAKO; Hideo ; et al. | 2013-11-07 |
Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package
Grant 8,426,742 - Ejiri , et al. April 23, 2 | 2013-04-23 |
Substrate For Mounting Semiconductor Chip And Method For Producing Same
App 20120234584 - Ejiri; Yoshinori ; et al. | 2012-09-20 |
Copper Metal Film, Method For Producing Same, Copper Metal Pattern, Conductive Wiring Line Using The Copper Metal Pattern, Copper Metal Bump, Heat Conduction Path, Bonding Material, And Liquid Composition
App 20120175147 - Nakako; Hideo ; et al. | 2012-07-12 |
Printing Ink, Metal Nanoparticles Used In The Same, Wiring, Circuit Board, And Semiconductor Package
App 20120170241 - Nakako; Hideo ; et al. | 2012-07-05 |
Copper Conductor Film And Manufacturing Method Thereof, Conductive Substrate And Manufacturing Method Thereof, Copper Conductor Wiring And Manufacturing Method Thereof, And Treatment Solution
App 20120125659 - Nakako; Hideo ; et al. | 2012-05-24 |
Coated Conductive Particles And Method For Producing Same
App 20120104333 - Takai; Kenji ; et al. | 2012-05-03 |
Method For Forming A Copper Wiring Pattern, And Copper Oxide Particle Dispersed Slurry Used Therein
App 20100233011 - Nakako; Hideo ; et al. | 2010-09-16 |
Connecting Terminal, Semiconductor Package Using Connecting Terminal And Method For Manufacturing Semiconductor Package
App 20100071940 - Ejiri; Yoshinori ; et al. | 2010-03-25 |
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